Stacked chip-on-board module with edge connector

1. A method of fabricating a module, comprising:

providing a module card having a first surface, a second surface, and a plurality of exposed edge contacts adjacent an edge of at least one of the first and second surfaces for mating with corresponding contacts of a socket when the module is inserted in the socket, and an aperture extending between the first and second surfaces, each of the first and second surfaces extending in a first direction and a second direction transverse to the first direction;

mounting first and second microelectronic elements onto the module card, such that front surfaces of the first and second microelectronic elements face the first surface of the module card, and such that the front surface of the second microelectronic element partially overlies a rear surface of the first microelectronic element and is attached thereto, the first microelectronic element having a lateral edge extending between the front and rear surfaces of the first microelectronic element and extending in the second direction, the front surface of the second microelectronic element projecting in the first direction beyond the lateral edge, chip contacts of the second microelectronic element being exposed at the front surface of the second microelectronic element and disposed beyond the lateral edge,

the second microelectronic element having first and second opposed edges extending between the front surface and a rear surface of the second microelectronic element and extending in the second direction, the front surface of the second microelectronic element having a first outer region adjacent the first edge, a second outer region adjacent the second edge, and a central region disposed between the first and second outer regions, each of the first and second outer regions and the central region having equal width such that the central region extends a middle third of a distance between the first and second edges, the chip contacts of the second microelectronic element being disposed in the central region; and

electrically connecting the first and second microelectronic elements to the module card including electrically connecting a plurality of leads extending from the chip contacts of the second microelectronic element to the edge contacts, the plurality of leads including first wire bonds extending through the aperture and coupled to the chip contacts of the second microelectronic element.

2. The method as claimed in claim 1 , wherein chip contacts of the first microelectronic element are exposed within a central region of the front surface of the first microelectronic element.

3. The method as claimed in claim 1 , wherein the step of electrically connecting the first and second microelectronic elements to the module card includes flip-chip bonding at least one of the first and second microelectronic elements to the module card.

4. The method as claimed in claim 1 , wherein the leads include conductive elements on the module card, and the step of electrically connecting the first and second microelectronic elements to the module card electrically connects the conductive elements to the chip contacts of at least one of the first and second microelectronic elements using a bonding tool inserted through the aperture.

5. The method as claimed in claim 1 , wherein the aperture is a first aperture aligned with the chip contacts of the second microelectronic element, and the module card further includes a second aperture aligned with the chip contacts of the first microelectronic element.

6. The method as claimed in claim 5 , wherein the leads include second wire bonds extending through the second aperture from the chip contacts of the first microelectronic element to conductive elements exposed at the first surface of the module card.