Semiconductor device and method of manufacturing semiconductor device
Provided is a semiconductor device including a semiconductor substrate doped with impurities, a front surface-side electrode provided on a front surface side of the semiconductor substrate, a back surface-side electrode provided on a back surface side of the semiconductor substrate, wherein the semiconductor substrate has a peak region arranged on the back surface side of the semiconductor substrate and having one or more peaks of impurity concentration, a high concentration region arranged closer to the front surface than the peak region and having a gentler impurity concentration than the one or more peaks, and a low concentration region arranged closer to the front surface than the high concentration region and having a lower impurity concentration than the high concentration region.
1. A semiconductor device comprising:
a semiconductor substrate doped with impurities;
a front surface-side electrode provided on a front surface side of the semiconductor substrate; and
a back surface-side electrode provided on a back surface side of the semiconductor substrate; wherein
the semiconductor substrate has:
a peak region arranged on the back surface side of the semiconductor substrate and having one or more peaks of impurity concentration;
a high concentration region arranged closer to a front surface than the peak region and having a gentler distribution of the impurity concentration than the one or more peaks; and
a low concentration region arranged closer to the front surface than the high concentration region and having a lower impurity concentration than the high concentration region,
wherein the impurity concentration at a boundary between the peak region and the high concentration region is higher than the impurity concentration in the low concentration region,
the high concentration region is adjacent to a front surface side of the peak region, and the low concentration region is adjacent to a front surface side of the high concentration region, and
the peak region, the high concentration region, and the low concentration region form a contiguous region of the semiconductor device in a depth direction.
2. The semiconductor device according to claim 1 , wherein
the semiconductor substrate has a drift region, and
the low concentration region is included in the drift region.
3. The semiconductor device according to claim 1 , wherein
a length in a depth direction of the high concentration region is longer than a length in a depth direction of the peak region.
4. The semiconductor device according to claim 1 , wherein
a carrier lifetime in the high concentration region is longer than a carrier lifetime in the low concentration region.
5. The semiconductor device according to claim 1 , wherein
a length in a depth direction of the high concentration region is 5 μm or more.
6. The semiconductor device according to claim 1 , wherein
the maximum value of the impurity concentration in the high concentration region is larger than or equal to 1.2 times the impurity concentration in the low concentration region.
7. The semiconductor device according to claim 1 , wherein
the impurity concentration of a peak of the one or more peaks that is closest to the front surface side is higher than 5×10 14 /cm 3 .
8. The semiconductor device according to claim 1 , wherein
the high concentration region has:
an increase part in which the impurity concentration increases from the back surface side toward the front surface side; and
a decrease part arranged closer to the front surface side than the increase part and having the impurity concentration decreasing from the back surface side toward the front surface side.
9. The semiconductor device according to claim 8 , wherein
an absolute value of a decrease rate of the impurity concentration in the decrease part is larger than an absolute value of an increase rate of the impurity concentration in the increase part.
10. The semiconductor device according to claim 1 , wherein
the semiconductor substrate is a MCZ substrate.
11. The semiconductor device according to claim 1 , wherein
an average oxygen concentration in the semiconductor substrate is 1.0×10 16 /cm 3 or more and 1.0×10 18 /cm 3 or less.
12. The semiconductor device according to claim 1 , wherein
the semiconductor substrate further has a defect region formed to extend in a depth direction from the front surface side of the semiconductor substrate, wherein the defect region includes vacancy-related defects containing at least vacancies and divacancies.
13. The semiconductor device according to claim 12 , wherein
a part of the defect region and a part of the high concentration region are formed at a same position in a depth direction.
14. The semiconductor device according to claim 13 , wherein
a tip of the defect region extends closer to the back surface side of the semiconductor substrate than a peak among the one or more peaks that is provided closest to the front surface side of the semiconductor substrate in the peak region.
15. The semiconductor device according to claim 13 , wherein
a tip of the defect region is formed at a same position in a depth direction as any of the one or more peaks in the peak region.
16. The semiconductor device according to claim 1 , wherein
the semiconductor substrate further has a defect region formed to extend in a depth direction from the back surface side of the semiconductor substrate.
17. The semiconductor device according to claim 16 , wherein
the defect region extends closer to the front surface side of the semiconductor substrate than the high concentration region.
18. The semiconductor device according to claim 1 , wherein
the semiconductor substrate has a transistor region in which a transistor is formed and a diode region in which a diode is formed, and
the high concentration region is formed in the diode region, wherein
the transistor region is adjacent to the diode region in the semiconductor substrate.
19. The semiconductor device according to claim 18 , wherein the high concentration region is formed also in the transistor region.
20. The semiconductor device according to claim 18 , wherein
the high concentration region is not formed in the transistor region.
21. The semiconductor device according to claim 1 , wherein
a length in a depth direction of the high concentration region is 20 μm or more.
22. The semiconductor device according to claim 1 , wherein
the peak region has one or more peaks of hydrogen concentration, and
a hydrogen concentration of the high concentration region has a profile that the hydrogen concentration is lower than that of one of the one or more peaks of the peak region that is closest to the high concentration region side, and the hydrogen concentration continues to decrease from an edge of a surface side of the semiconductor substrate in the peak region to a surface side of the semiconductor device.
23. The semiconductor device according to claim 1 , wherein
the peak region and the high concentration region are regions in which donors are formed of vacancy-oxygen-hydrogen (VOH) defects.
24. The semiconductor device according to claim 1 , wherein
the one or more peaks of the peak region comprise at least four peaks of impurity concentration.
25. The semiconductor device according to claim 1 , wherein
a donor concentration of a boundary between one of the one or more peaks that is closest to the high concentration region and the high concentration region is higher than a donor concentration of the low concentration region.
26. The semiconductor device according to claim 1 , wherein
the high concentration region is, in a depth direction of the semiconductor substrate, longer than a total of the peak region.
27. The semiconductor device according to claim 1 , wherein
the peak region, the high concentration region and the low concentration region have a first conductivity type, and
a front surface-side region of a second conductivity type is provided in the front surface side adjacent to the front surface side of the low concentration region.
28. The semiconductor device according to claim 12 , wherein
helium is included in the defect region.
29. The semiconductor device according to claim 1 , wherein
the high concentration region is positioned closer to the front surface side than a position of one of the one or more peaks in the peak region that is closest to the front surface side.