Semiconductor device and method for manufacturing
There is provided a semiconductor device that includes a semiconductor substrate, which has an upper surface and a lower surface, and a drift region of an n-type conductivity provided at a position including the center of the semiconductor substrate in a depth direction connecting the upper surface and the lower surface. Over the entire part of the drift region in the depth direction, a donor concentration of the drift region is higher than a base doping concentration of the semiconductor substrate.
1. A semiconductor device comprising:
a semiconductor substrate having an upper surface and a lower surface; and
a drift region of an n-type conductivity provided at a position including a center of the semiconductor substrate in a depth direction connecting the upper surface and the lower surface, wherein
over an entire part of the drift region in the depth direction, a donor concentration of the drift region is higher than a base doping concentration of the semiconductor substrate.
2. The semiconductor device according to claim 1 , wherein
a hydrogen donor is formed over the entire part of the drift region in the depth direction.
3. A semiconductor device comprising:
a semiconductor substrate having an upper surface and a lower surface; and
a drift region of an n-type conductivity provided at a position including a center of the semiconductor substrate in a depth direction connecting the upper surface and the lower surface, wherein
a hydrogen donor is formed over an entire part of the drift region in the depth direction.
4. The semiconductor device according to claim 1 , further comprising a base region of a p-type conductivity provided between the upper surface and the drift region in the depth direction.
5. The semiconductor device according to claim 4 , further comprising a plurality of trench portions that are provided at a side of the upper surface of the semiconductor substrate and reach the drift region.
6. The semiconductor device according to claim 5 , further comprising an emitter region of the n-type conductivity that is provided between the upper surface and the base region in the depth direction and in contact with the plurality of trench portions.
7. The semiconductor device according to claim 4 , further comprising a contact region of the p-type conductivity provided between the upper surface and the base region in the depth direction.
8. The semiconductor device according to claim 1 , wherein
the drift region includes a flat region having a length of at least 10 μm in a donor concentration distribution of the semiconductor substrate in the depth direction.
9. The semiconductor device according to claim 1 , wherein
in a donor concentration distribution of the semiconductor substrate in the depth direction, the drift region includes a flat region, a length of the flat region in the depth direction being 10% or more of a thickness of the semiconductor substrate in the depth direction.
10. The semiconductor device according to claim 8 , further comprising a buffer region of the n-type conductivity that is provided at a lower side of the drift region and has a plurality of peaks in the donor concentration distribution.
11. The semiconductor device according to claim 10 , further comprising an accumulation region of the n-type conductivity that is provided at an upper side of the drift region and has a donor concentration higher than the donor concentration of the drift region.
12. The semiconductor device according to claim 11 , wherein
the flat region is provided over the entire part of the drift region in the depth direction from the accumulation region to the buffer region.
13. The semiconductor device according to claim 10 , wherein
the length of the flat region in the depth direction is larger than a length of the buffer region in the depth direction.
14. The semiconductor device according to claim 8 , wherein
in the donor concentration distribution, a valley is provided continuously from the flat region at a side of the upper surface of the semiconductor substrate.
15. The semiconductor device according to claim 8 , further comprising a lifetime control region provided at a side of the upper surface of the semiconductor substrate with respective to the center of the semiconductor substrate in the depth direction.
16. A semiconductor device comprising:
a semiconductor substrate having an upper surface and a lower surface; and
a drift region of an n-type conductivity provided at a position including a center of the semiconductor substrate in a depth direction connecting the upper surface and the lower surface, the drift region being implanted with hydrogen, wherein
in a donor concentration distribution of the semiconductor substrate in the depth direction, the drift region includes a flat region having a length of at least 10 μm and a valley is provided continuously from the flat region at a side of the upper surface of the semiconductor substrate.
17. The semiconductor device according to claim 16 , wherein
helium is implanted at a side of the upper surface of the semiconductor substrate with respective to the center of the semiconductor substrate in the depth direction.
18. The semiconductor device according to claim 17 , wherein
a chemical concentration of the helium has a peak between a base region of a p-type conductivity and the flat region in the depth direction, the base region being provided between the upper surface and the drift region.
19. The semiconductor device according to claim 16 , wherein
a hydrogen donor is formed over an entire part of the flat region in the depth direction.
20. The semiconductor device according to claim 16 , wherein
over an entire part of the flat region in the depth direction, a donor concentration of the drift region is higher than a base doping concentration of the semiconductor substrate.