Semiconductor device, manufacturing method of semiconductor device, and power conversion device comprising semiconductor device
Provided is a semiconductor device comprising: a semiconductor substrate provided with a drift region; a buffer region arranged between the drift region and the lower surface, wherein a doping concentration distribution has three or more concentration peaks; and a collector region arranged between the buffer region and the lower surface, wherein the three or more concentration peaks in the buffer region include: a first concentration peak closest to the lower surface; a second concentration peak closest, next to the first concentration peak, to the lower surface, arranged 5 μm or more distant from the lower surface in the depth direction, and having a doping concentration lower than the first concentration peak, the doping concentration being less than 1.0×10 15 /cm 3 ; and a high concentration peak arranged farther from the lower surface than the second concentration peak, and having a higher doping concentration than the second concentration peak.
1. A semiconductor device comprising:
a semiconductor substrate having an upper surface and a lower surface and provided with a drift region of a first conductivity type;
a buffer region of the first conductivity type arranged between the drift region and the lower surface, wherein a doping concentration distribution in a depth direction of the semiconductor substrate has three or more concentration peaks; and
a collector region of a second conductivity type arranged between the buffer region and the lower surface,
wherein the three or more concentration peaks in the buffer region include:
a first concentration peak closest to the lower surface;
a second concentration peak closest, next to the first concentration peak, to the lower surface, arranged 5 μm or more distant from the lower surface in the depth direction, and having a doping concentration lower than the first concentration peak, the doping concentration being less than 1.0×10 15 /cm 3 ; and
a high concentration peak arranged farther from the lower surface than the second concentration peak, and having a higher doping concentration than the second concentration peak,
wherein the doping concentration has a minimum value between each adjacent pair of the three or more concentration peaks, and
wherein the minimum value of the doping concentration between each adjacent pair of the three or more concentration peaks is 2.0×10 14 /cm 3 or more and 5.0×10 14 /cm 3 or less.
2. The semiconductor device according to claim 1 ,
wherein a dose amount of a dopant of the second conductivity type in the collector region is 8×10 12 /cm 2 or less.
3. The semiconductor device according to claim 1 ,
the doping concentration of the first concentration peak is 0.1 times or more and 10 times or less a doping concentration of the collector region.
4. The semiconductor device according to claim 1 ,
wherein full width at half maximum of the second concentration peak is larger than full width at half maximum of any of the concentration peaks other than the second concentration peak.
5. The semiconductor device according to claim 4 ,
wherein full width at half maximum of the second concentration peak is larger than full width at half maximum of the high concentration peak.
6. The semiconductor device according to claim 4 ,
wherein full width at half maximum of the second concentration peak is larger than full width at half maximum of any other concentration peaks.
7. The semiconductor device according to claim 1 ,
wherein full width at half maximum of the high concentration peak is twice or more full width at half maximum of the first concentration peak.
8. The semiconductor device according to claim 1 ,
wherein full width at half maximum of the second concentration peak is twice or more full width at half maximum of the first concentration peak.
9. The semiconductor device according to claim 1 , wherein
the three or more concentration peaks in the buffer region include a third concentration peak arranged between the second concentration peak and the high concentration peak, and
full width at half maximum of the third concentration peak is twice or more full width at half maximum of the first concentration peak.
10. The semiconductor device according to claim 1 ,
wherein the high concentration peak has a flat portion where the doping concentration distribution in the depth direction is flat, including a depth position at which the doping concentration indicates a local maximum value.
11. The semiconductor device according to claim 9 ,
wherein the third concentration peak has a flat portion where the doping concentration distribution in the depth direction is flat, including a depth position at which the doping concentration indicates a local maximum value.
12. A semiconductor device comprising:
a semiconductor substrate having an upper surface and a lower surface and provided with a drift region of a first conductivity type;
a buffer region of the first conductivity type arranged between the drift region and the lower surface, wherein a doping concentration distribution of the buffer region in a depth direction of the semiconductor substrate has four concentration peaks; and
a collector region of a second conductivity type arranged between the buffer region and the lower surface, wherein
the four concentration peaks in the buffer region include:
a first concentration peak closest to the lower surface;
a second concentration peak arranged closest, next to the first concentration peak, to the lower surface;
a third concentration peak arranged between the second concentration peak and the upper surface; and
a fourth concentration peak arranged between the third concentration peak and the upper surface,
each of the first concentration peak, the second concentration peak, the third concentration peak, and the fourth concentration peak has a full width at half maximum,
full width at half maximum of the second concentration peak is larger than full width at half maximum of the third concentration peak and full width at half maximum of the fourth concentration peak.
13. The semiconductor device according to claim 12 ,
wherein the upper surface side concentration peak is arranged closest to the upper surface among the three or more concentration peaks.
14. The semiconductor device according to claim 12 ,
wherein the upper surface side concentration peak is arranged closest, next to the second concentration peak, to the lower surface.
15. The semiconductor device according to claim 12 ,
wherein full width at half maximum of the second concentration peak is larger than full width at half maximum of any other concentration peaks.
16. A semiconductor device comprising:
a semiconductor substrate having an upper surface and a lower surface and provided with a drift region of a first conductivity type;
a buffer region of the first conductivity type arranged between the drift region and the lower surface, wherein a doping concentration distribution in a depth direction of the semiconductor substrate has three or more concentration peaks; and
a collector region of a second conductivity type arranged between the buffer region and the lower surface, wherein
the three or more concentration peaks in the buffer region include:
a first concentration peak arranged closest to the lower surface and having a doping concentration 0.1 times or more and 10 times or less the collector region; and
an upper surface side concentration peak arranged closer to the upper surface than the first concentration peak, and having the doping concentration being 0.1 times or less the first concentration peak.
17. The semiconductor device according to claim 16 ,
wherein the doping concentration distribution in the depth direction of the buffer region has four or more concentration peaks,
wherein the four or more concentration peaks in the buffer region include:
the first concentration peak arranged closest to the lower surface; and
the upper surface side concentration peak arranged closer to the upper surface than the first concentration peak, and wherein the upper surface side concentration peak is arranged closest, next to the first concentration peak, to the lower surface.
18. A power conversion device comprising the semiconductor device according to claim 1 ,
wherein a carrier frequency is 10 kHz or more.
19. The semiconductor device according to claim 17 ,
wherein the four or more concentration peaks include a third concentration peak having a doping concentration and a fourth concentration peak having a doping concentration, wherein the third concentration peak is arranged closest to the lower surface next to the upper surface side concentration peak, wherein the fourth peak is arranged closest to the lower surface next to the third concentration peak, and wherein the doping concentration of the fourth concentration peak is 0.1 times or less than the doping concentration of the first concentration peak.