Semiconductor device and method for manufacturing semiconductor device
A p anode layer is formed on one main surface of an n − drift layer. N + cathode layer having an impurity concentration more than that of the n − drift layer is formed on the other main surface. An anode electrode is formed on the surface of the p anode layer. A cathode electrode is formed on the surface of the n + cathode layer. N-type broad buffer region having a net doping concentration more than the bulk impurity concentration of a wafer and less than the n + cathode layer and p anode layer is formed in the n − drift layer. Resistivity ρ 0 of the n − drift layer satisfies 0.12V 0 ≤ρ 0 ≤0.25V 0 with respect to rated voltage V 0 . Total amount of net doping concentration of the broad buffer region is equal to or more than 4.8×10 11 atoms/cm 2 and equal to or less than 1.0×10 12 atoms/cm 2 .
1. A semiconductor device comprising:
a drift layer of a first-conductivity-type;
an anode layer of a second-conductivity-type that is provided on a first main surface of the drift layer and has an impurity concentration more than that of the drift layer;
a cathode layer of the first-conductivity-type that is provided on a second main surface of the drift layer and has an impurity concentration more than that of the drift layer; and
a plurality of broad buffer layers of the first conductivity-type that are provided in the drift layer and each of the plurality of the broad buffer layers has an impurity concentration more than that of a portion of the drift layer excluding the plurality of broad buffer layers, and has a mountain-shaped impurity concentration distribution in which a local maximum value is less than the impurity concentration of the anode layer and the cathode layer, the mountain-shaped impurity concentration distribution having a peak at the local maximum value and differences of elevation in a depth direction,
wherein a donor concentration at a first portion of the drift layer disposed between the cathode layer and a first broad buffer layer that is a broad buffer layer among the plurality of broad buffer layers closest to the cathode layer is higher than a lowest donor concentration of a second portion of the drift layer disposed between the first broad buffer layer and a second broad buffer layer among the plurality of broad buffer layers, the second broad buffer layer being a broad buffer layer among the plurality of broad buffer layers that is disposed nearest to the first broad buffer layer on an anode layer side of the first broad buffer layer,
wherein the first broad buffer layer, which is the broad buffer layer among the plurality of broad buffer layers that is closest to the cathode layer, includes either a hydrogen-related donor or phosphorus as a donor, and
wherein broad buffer layers of the plurality of broad buffer layers other than the first broad buffer layer include hydrogen-related donors.
2. The semiconductor device of claim 1 , wherein the plurality of broad buffer layers are disposed at different depths from the first main surface, respectively, and the number of broad buffer layers close to the second main surface from an intermediate position of the drift layer is more than the number of broad buffer layers close to the first main surface from the intermediate position of the drift layer.
3. The semiconductor device of claim 1 , wherein the number of broad buffer layers close to the first main surface from an intermediate position of the drift layer is at least one, and
wherein the number of broad buffer layers close to the second main surface from the intermediate position of the drift layer is at least one.
4. The semiconductor device of claim 1 , wherein the number of broad buffer layers is at least three.
5. The semiconductor device of claim 1 , wherein a resistivity ρ0 (Ωcm) of the drift layer satisfies 0.12V0≤ρ0 with respect to a rated voltage V0 (V).
6. The semiconductor device of claim 1 , wherein an oxygen concentration from a surface of the anode layer to a peak concentration of a broad buffer layer of the plurality of broad buffer layers is equal to or more than 1×10 16 atoms/cm 3 and equal to or less than 1×10 18 atoms/cm 3 .
7. A semiconductor device comprising:
a drift layer of a first conductivity-type;
a base layer of a second conductivity-type that is provided on a first main surface of the drift layer and has an impurity concentration more than that of the drift layer;
an emitter layer of the first-conductivity-type that is provided on the first main surface of the drift layer in contact with the base layer and has an impurity concentration more than that of the base layer;
an insulation layer that is provided in contact with the drift layer, the base layer and the emitter layer;
a gate electrode, the insulation layer being disposed between the gate electrode and the drift layer, the base layer, and the emitter layer;
a collector layer of the second conductivity-type that is provided on a second main surface of the drift layer and has an impurity concentration more than that of the drift layer; and
a plurality of broad buffer layers of the first conductivity-type that are provided in the drift layer and each of the plurality of the broad buffer layers has an impurity concentration more than that of a portion of the drift layer excluding the plurality of broad buffer layers, and has a mountain-shaped impurity concentration distribution in which a local maximum value is less than the impurity concentration of the base layer and the collector layer, the mountain-shaped impurity concentration distribution having a peak at the local maximum value and differences of elevation in a depth direction,
wherein a donor concentration at a first portion of the drift layer disposed between the collector layer and a first broad buffer layer a broad buffer layer among the plurality of broad buffer layers closest to the collector layer is higher than a lowest donor concentration of a second portion of the drift layer disposed between the first buffer layer and a second broad buffer layer among the plurality of broad buffer layers, the second broad buffer layer being a broad buffer layer among the plurality of broad buffer layers that is disposed nearest to the first broad buffer layer on a base layer side of the first broad buffer layer,
wherein the first broad buffer layer, which is the broad buffer layer among the plurality of broad buffer layers that is closest to the collector layer, includes either a hydrogen-related donor or phosphorus as a donor, and
wherein broad buffer layers of the plurality of broad buffer layers other than the first broad buffer layer include hydrogen-related donors.
8. The semiconductor device of claim 7 , wherein the plurality of broad buffer layers are disposed at different depths from the first main surface, respectively, and the number of broad buffer layers close to the second main surface from an intermediate position of the drift layer is more than the number of broad buffer layers close to the first main surface from the intermediate position of the drift layer.
9. The semiconductor device of claim 7 , wherein the number of broad buffer layers close to the first main surface from an intermediate position of the drift layer is at least one, and
wherein the number of broad buffer layers close to the second main surface from the intermediate position of the drift layer is at least one.
10. The semiconductor device of claim 7 , wherein the number of broad buffer layers is at least three.
11. The semiconductor device of claim 7 , wherein a resistivity ρ 0 (Ωcm) of the drift layer satisfies 0.12V 0 ≤ρ 0 with respect to a rated voltage V 0 (V).
12. The semiconductor device of claim 7 , wherein an oxygen concentration from a surface of the base layer to a peak concentration of a broad buffer layer of the plurality of broad buffer layers is equal to or more than 1×10 16 atoms/cm 3 and equal to or less than 1×10 18 atoms/cm 3 .