IP Library › Granted Patent US 10,186,435
Granted Patent B2
US 10,186,435 · App. 15/630,387 · Granted Jan 22, 2019

Chemical liquid preparation method of preparing a chemical liquid for substrate processing, chemical liquid preparation unit preparing a chemical liquid for substrate processing, and substrate processing system

Inventors: Atsuyasu Miura (Kyoto, JP); Hidekazu Ishikawa (Kyoto, JP)
Assignee: SCREEN Holdings Co., Ltd.
H01L21/6708B01F1/0038B01F3/04503B01F3/04737B01F3/04744B01F5/0614B01F5/10B01F5/102C09K13/00H01L21/30617H01L21/67017H01L21/67051H01L21/67253B01F2003/04879B01F2003/04921
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Quick Facts
Patent No.
US 10,186,435
App. No.
15/630,387
Granted
Jan 22, 2019
Kind
B2
Abstract

A substrate processing system includes a chemical liquid preparation unit preparing a chemical liquid to be supplied to a substrate and a processing unit which supplies the chemical liquid, prepared by the chemical liquid preparation unit, to the substrate. The chemical liquid preparation unit supplies an oxygen-containing gas, containing oxygen gas, to a TMAH-containing chemical liquid, containing TMAH (tetramethylammonium hydroxide), to make the oxygen-containing gas dissolve in the TMAH-containing chemical liquid.

Claims (15)

1. A substrate processing method comprising:

a chemical liquid preparing step of stabilizing or increasing an etching rate of a TMAH-containing chemical liquid that contains TMAH (tetramethylammonium hydroxide) by causing an oxygen-containing gas that contains oxygen gas to dissolve in the TMAH-containing chemical liquid;

a chemical liquid guiding step of guiding the TMAH-containing chemical liquid prepared in the chemical liquid preparing step by a chemical liquid piping; and

a substrate etching step of etching a film formed on the substrate by causing a nozzle to discharge the TMAH-containing chemical liquid guided by the chemical liquid piping toward the substrate,

wherein the substrate etching step is a step of etching a polysilicon film formed on the substrate by causing the nozzle to discharge the TMAH-containing chemical liquid guided by the chemical liquid piping toward the substrate.

2. The substrate processing method according to claim 1 ;

wherein the chemical liquid preparing step includes an oxygen-containing gas guiding step of causing a gas piping to guide the oxygen-containing gas to a tank that stores the TMAH-containing chemical etching liquid.

3. A substrate processing method comprising:

a chemical liquid preparing step of stabilizing or increasing an etching rate of a TMAH-containing chemical liquid that contains TMAH (tetramethylammonium hydroxide) by causing an oxygen-containing gas that contains oxygen gas to dissolve in the TMAH-containing chemical liquid;

a chemical liquid guiding step of guiding the TMAH-containing chemical liquid prepared in the chemical liquid preparing step by a chemical liquid piping; and

a substrate etching step of etching a film formed on the substrate by causing a nozzle to discharge the TMAH-containing chemical liquid guided by the chemical liquid piping toward the substrate,

wherein the chemical liquid preparing step includes

a measurement step of measuring a dissolved oxygen concentration in the TMAH-containing chemical liquid;

a nitrogen dissolution step of supplying a nitrogen-containing gas containing nitrogen gas to the TMAH-containing chemical liquid to make the nitrogen-containing gas dissolve in the TMAH-containing chemical liquid when the dissolved oxygen concentration measured in the measurement step is higher than a predetermined concentration; and

an oxygen dissolution step of supplying the oxygen-containing gas to the TMAH-containing chemical liquid to make the oxygen-containing gas dissolve in the TMAH-containing chemical liquid when the dissolved oxygen concentration measured in the measurement step is lower than the predetermined concentration.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 1, 2017
From: MIURA, ATSUYASU; ISHIKAWA, HIDEKAZU
To: SCREEN HOLDINGS CO., LTD.
Reel/Frame 044005/0365 →
Priority Claims (2)
JP 2012-111758 · May 15, 2012 · national
JP 2013-025312 · Feb 13, 2013 · national
Continuity (2)
Division 13835073 · Mar 15, 2013
Related Publication 20170294323A1 · Oct 12, 2017