IP Library Granted Patent US 10,026,492
Granted Patent B2
US 10,026,492 · App. 15/640,563 · Granted Jul 17, 2018

Multi-die programming with die-jumping induced periodic delays

Inventors: Deepanshu Dutta (Fremont, CA); Arash Hazeghi (Emeryville, CA); Huai-Yuan Tseng (San Ramon, CA); Cynthia Hsu (Milpitas, CA); Navneeth Kankani (Fremont, CA)
Assignee: SANDISK TECHNOLOGIES LLC
G11C16/3459G11C16/0483G11C16/32
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Quick Facts
Patent No.
US 10,026,492
App. No.
15/640,563
Granted
Jul 17, 2018
Kind
B2
Abstract

Systems and methods for improving the reliability of data stored in memory cells are described. To mitigate the effects of trapped electrons after one or more programming pulses have been applied to memory cells, a delay between the one or more programming pulses and subsequent program verify pulses may be set based on a chip temperature, the number of the one or more programming pulses that were applied to the memory cells, and/or the programming voltage that was applied to the memory cells during the one or more programming pulses. To mitigate the effects of residual electrons after one or more program verify pulses have been applied to memory cells, a delay between the one or more program verify pulses and subsequent programming pulses may be set based on a chip temperature and/or the programming voltage to be applied to the memory cells during the subsequent programming pulses.

Claims (50)

1. A system, comprising:

a memory array including a set of memory cells;

a program circuit configured to apply a first set of programming pulses to the set of memory cells and apply one or more program verify pulses to the set of memory cells after a first delay from the application of the first set of programming pulses to the set of memory cells, the program circuit configured to apply a second set of programming pulses to the set of memory cells after a second delay from the application of the one or more program verify pulses to the set of memory cells; and

a delay circuit configured to determine the first delay and the second delay based on a temperature associated with the set of memory cells.

2. The system of claim 1 , wherein:

the first delay is different from the second delay.

3. The system of claim 2 , wherein:

the delay circuit configured to set the second delay greater than the first delay when the temperature associated with the set of memory cells is colder than a temperature threshold.

4. The system of claim 2 , wherein:

the delay circuit configured to set the second delay to a first time if the temperature associated with the set of memory cells is below a temperature threshold and set the second delay to a second time less than the first time if the temperature associated with the set of memory cells is greater than the temperature threshold.

5. The system of claim 1 , wherein:

the first set of programming pulses includes a first programming pulse at a first programming voltage;

the second set of programming pulses includes a second programming pulse at a second programming voltage different from the first programming voltage; and

the delay circuit configured to determine the first delay based on the first programming voltage and determine the second delay based on the second programming voltage.

6. The system of claim 1 , wherein:

the set of memory cells are connected to a first word line within the memory array.

7. The system of claim 1 , wherein:

the set of memory cells comprises re-writeable non-volatile memory cells.

8. The system of claim 1 , wherein:

the set of memory cells comprises ReRAM memory cells.

9. The system of claim 1 , wherein:

the set of memory cells comprises NAND memory cells.

10. An apparatus, comprising:

a memory array including a set of memory cells; and

a control circuit configured to apply one or more program verify pulses to the set of memory cells and determine a first programming voltage, the control circuit configured to determine a chip temperature and determine a delay between the one or more program verify pulses and one or more programming pulses based on the first programming voltage and the chip temperature, the one or more programming pulses includes a first programming pulse at the first programming voltage, the control circuit configured to apply the one or more programming pulses to the set of memory cells after the delay from application of the one or more program verify pulses to the set of memory cells.

11. The apparatus of claim 10 , wherein:

the control circuit configured to determine a number of programming pulses for the one or more programming pulses and determine the delay based on the number of programming pulses.

12. The apparatus of claim 10 , wherein:

the control circuit configured to determine a second delay between the one or more programming pulses and a second set of program verify pulses based on the first programming voltage and the chip temperature, the control circuit configured to apply the second set of program verify pulses to the set of memory cells after the second delay from application of the one or more programming pulses to the set of memory cells.

13. The apparatus of claim 12 , wherein:

the second delay is less than the delay between the one or more program verify pulses and the one or more programming pulses.

14. The apparatus of claim 10 , wherein:

the delay circuit configured to set the delay between the one or more program verify pulses and the one or more programming pulses to a first time if the chip temperature is below a temperature threshold and set the delay to a second time less than the first time if the chip temperature is greater than the temperature threshold.

15. The apparatus of claim 10 , wherein:

the set of memory cells comprises re-writeable non-volatile memory cells.

16. A system, comprising:

a memory array including a set of memory cells; and

one or more control circuits configured to apply a first set of programming pulses to the set of memory cells and apply one or more program verify pulses to the set of memory cells after a first pre-verify delay from the application of the first set of programming pulses to the set of memory cells, the one or more control circuits configured to apply a second set of programming pulses to the set of memory cells after a second post-verify delay from the application of the one or more program verify pulses to the set of memory cells; and

a delay circuit configured to determine the second post-verify delay based on a temperature associated with the set of memory cells.

17. The system of claim 16 , wherein:

the delay circuit configured to set the second post-verify delay to a first time if the temperature associated with the set of memory cells is below a temperature threshold and set the second post-verify delay to a second time less than the first time if the temperature associated with the set of memory cells is greater than the temperature threshold.

18. The system of claim 16 , wherein:

the delay circuit configured to increase the second post-verify delay if the temperature associated with the set of memory cells is colder than a temperature threshold.

19. The system of claim 16 , wherein:

the first set of programming pulses includes a first programming pulse at a first programming voltage;

the second set of programming pulses includes a second programming pulse at a second programming voltage different from the first programming voltage; and

the delay circuit configured to determine the first pre-verify delay based on the first programming voltage and determine the second post-verify delay based on the second programming voltage.

20. The system of claim 16 , wherein:

the set of memory cells are connected to a first word line within the memory array; and

the set of memory cells comprises re-writeable non-volatile memory cells.

Assignments (5)
PARTIAL RELEASE OF SECURITY INTERESTS Recorded Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →
SECURITY AGREEMENT Recorded Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 31, 2024
From: SANDISK TECHNOLOGIES LLC
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 069796/0423 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 3, 2017
From: DUTTA, DEEPANSHU; HAZEGHI, ARASH; TSENG, HUAI-YUAN; HSU, CYNTHIA; KANKANI, NAVNEETH
To: SANDISK TECHNOLOGIES INC.
Reel/Frame 042881/0900 →
CHANGE OF NAME Recorded Jul 3, 2017
From: SANDISK TECHNOLOGIES INC.
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 043077/0307 →
Continuity (2)
Continuation 15099781 · Apr 15, 2016
Related Publication 20170309344A1 · Oct 26, 2017