Ferroelectric field effect transistors, pluralities of ferroelectric field effect transistors arrayed in row lines and column lines, and methods of forming a plurality of ferroelectric field effect transistors
A ferroelectric field effect transistor comprises a semiconductive channel comprising opposing sidewalls and an elevationally outermost top. A source/drain region is at opposite ends of the channel. A gate construction of the transistor comprises inner dielectric extending along the channel top and laterally along the channel sidewalls. Inner conductive material is elevationally and laterally outward of the inner dielectric and extends along the channel top and laterally along the channel sidewalls. Outer ferroelectric material is elevationally outward of the inner conductive material and extends along the channel top. Outer conductive material is elevationally outward of the outer ferroelectric material and extends along the channel. Other constructions and methods are disclosed.
1. A plurality of ferroelectric field effect transistors arrayed in row lines and column lines, comprising:
individual ferroelectric field effect transistors comprising:
a semiconductive channel comprising sidewalls and an elevationally outermost top;
a source/drain region at opposite ends of the channel; and
a gate construction comprising:
inner dielectric extending along the channel top and laterally along the channel sidewalls;
inner conductive material elevationally and laterally outward of the inner dielectric and extending along the channel top and laterally along the channel sidewalls;
outer ferroelectric material elevationally outward of the inner conductive material and extending along the channel top; and
outer conductive material elevationally outward of the outer ferroelectric material and extending along the channel top;
the outer conductive material and the outer ferroelectric material being discontinuous between immediately adjacent transistors along one of a) the collective row lines, and b) the collective column lines; and
the outer conductive material and the ferroelectric material being continuous between immediately adjacent transistors along the other of the collective row lines and the collective column lines.
2. The plurality of ferroelectric field effect transistors of claim 1 wherein the outer conductive material and the outer ferroelectric material are discontinuous between immediately adjacent transistors along the collective row lines, and the outer conductive material and the ferroelectric material are continuous between immediately adjacent transistors along the collective column lines.
3. The plurality of ferroelectric field effect transistors of claim 1 wherein the outer conductive material and the outer ferroelectric material are discontinuous between immediately adjacent transistors along the collective column lines, and the outer conductive material and the ferroelectric material are continuous between immediately adjacent transistors along the collective row lines.
4. The plurality of ferroelectric field effect transistors of claim 1 wherein no portion of the outer ferroelectric material is laterally over any of the channel sidewalls.
5. The plurality of ferroelectric field effect transistors of claim 1 wherein no portion of the outer conductive material is laterally over any of the channel sidewalls.
6. The plurality of ferroelectric field effect transistors of claim 5 wherein no portion of the outer ferroelectric material is laterally over any of the channel sidewalls.
7. The plurality of ferroelectric field effect transistors of claim 1 wherein the source/drain regions each have a maximum elevational thickness that is less than a maximum elevational thickness of the inner dielectric.
8. The plurality of ferroelectric field effect transistors of claim 1 wherein the source/drain regions each have a maximum elevational thickness that is less than a maximum elevational thickness of the inner conductive material.
9. The plurality of ferroelectric field effect transistors of claim 1 wherein the inner conductive material has a maximum elevational thickness that is greater than a minimum width of the channel taken orthogonally relative to a shortest straight-line distance between the source/drain regions.
10. The plurality of ferroelectric field effect transistors of claim 1 wherein the inner conductive material has a maximum elevational thickness that is greater than length of the channel along a shortest straight-line distance between the source/drain regions.
11. The plurality of ferroelectric field effect transistors of claim 1 wherein the inner conductive material and the inner dielectric have respective elevationally innermost surfaces that are not elevationally coincident.
12. The plurality of ferroelectric field effect transistors of claim 1 wherein all of the outer conductive material, the outer ferroelectric material, the inner conductive material, and the inner dielectric have at least two laterally opposing vertical sidewalls elevationally outward of the channel that are laterally coincident relative one another.
13. The plurality of ferroelectric field effect transistors of claim 1 wherein all of the outer conductive material, the outer ferroelectric material, and the inner conductive material have at least two pairs of two laterally opposing vertical sidewalls elevationally outward of the channel that are laterally coincident relative one another.
14. The plurality of ferroelectric field effect transistors of claim 1 wherein at least some of the source/drain regions are shared between and by two immediately adjacent transistors in individual of the column lines.
15. The plurality of ferroelectric field effect transistors of claim 1 wherein at least some of the source/drain regions are between and not shared by two immediately adjacent transistors in individual of the column lines.