IP Library Granted Patent US 9,881,651
Granted Patent B2
US 9,881,651 · App. 15/692,512 · Granted Jan 30, 2018

Interconnections for 3D memory

Inventor: Toru Tanzawa (Tokyo, JP)
Assignee: Micron Technology, Inc.
G11C5/063G11C5/02G11C5/06G11C7/12G11C7/222G11C16/10G11C16/26H01L27/11524H01L27/11529H01L27/11551G11C16/0483G11C16/08G11C16/16
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Quick Facts
Patent No.
US 9,881,651
App. No.
15/692,512
Granted
Jan 30, 2018
Kind
B2
Abstract

Apparatuses and methods for interconnections for 3D memory are provided. One example apparatus can include a stack of materials including a plurality of pairs of materials, each pair of materials including a conductive line formed over an insulation material. The stack of materials has a stair step structure formed at one edge extending in a first direction. Each stair step includes one of the pairs of materials. A first interconnection is coupled to the conductive line of a stair step, the first interconnection extending in a second direction substantially perpendicular to a first surface of the stair step.

Claims (44)

1. A method, comprising:

performing a read operation on a three dimensional memory array including a string of memory cells and access lines coupled to the string and comprising:

providing a first voltage to a selected one of the access lines;

providing a second voltage to a non-selected one of the access lines; and

discharging the selected one of the access lines and the non-selected one of the access lines to an equalization potential of the selected one of the access lines and the non-selected one of the access lines after performing the read operation.

2. The method of claim 1 , wherein the second voltage is higher than the first voltage.

3. The method of claim 1 , further comprising discharging the selected one of the access lines and the non-selected one of the access lines to a ground reference potential after discharging the selected one of the access lines and the non-selected one of the access lines to the equalization potential.

4. The method of claim 1 , further comprising:

disabling an equalization circuit while performing the read operation; and

enabling the equalization circuit while discharging the selected one of the access lines and the non-selected one of the access lines to the equalization potential.

5. The method of claim 1 , further comprising disabling a string driver coupled to the string of memory cells subsequent to discharging the selected one of the access lines and the non-selected one of the access lines to the equalization potential.

6. The method of claim 1 , further comprising enabling a string driver coupled to the string of memory cells subsequent to discharging the selected one of the access lines and the non-selected one of the access lines to the equalization potential to provide a third voltage to at least one of the selected one of the access lines and the non-selected one of the access lines.

7. The method of claim 6 , wherein the third voltage is different than the equalization potential.

8. A method, comprising:

performing a read operation on a three dimensional memory array including a string of memory cells and control lines coupled to the string and comprising:

providing a first voltage to a first control line;

providing a second voltage to a second control line; and

discharging the first control line and the second control line to an equalization potential after performing the read operation.

9. The method of claim 8 , further comprising discharging the first control line and the second control line to a ground reference potential after discharging the first control line and the second control line to the equalization potential.

10. The method of claim 9 , further comprising discharging the first control line to a third voltage after discharging the first control line and the second control line to the equalization potential, wherein the third voltage is different from a ground reference potential.

11. The method of claim 9 , further comprising discharging the second control line to a fourth voltage after discharging the first control line and the second control line to the equalization potential, wherein the fourth voltage is different from a ground reference potential.

12. The method of claim 9 , further comprising:

discharging the first control line and the second control line to a potential different than the ground reference potential after discharging the first control line and the second control line to the equalization potential;

discharging a selected access line coupled to the first control line to the potential different than the ground reference potential concurrently after discharging the first control line and the second control line to the equalization potential; and

discharging a non-selected access line coupled to the second control line to the potential different than the ground reference potential concurrently after discharging the first control line and the second control line to the equalization potential.

13. The method of claim 9 , wherein the first control line and the second control line are global control lines.

14. An apparatus, comprising:

a three dimensional memory array including a string of memory cells and access lines coupled to the string; and

a controller coupled to the three dimensional memory array, wherein the controller is configured to cause:

a first voltage to be applied to a selected one of the access lines;

a second voltage to be applied to a non-selected one of the access lines; and

the selected one of the access lines and the non-selected one of the access lines to be discharged to an equalization potential subsequent to performance of a read operation.

15. The apparatus of claim 14 , wherein the first voltage is different than the second voltage.

16. The apparatus of claim 14 , wherein the controller is further configured to cause the selected one of the access lines and the non-selected one of the access lines to be discharged to a ground reference potential subsequent to discharge of the selected one of the access lines and the non-selected one of the access lines to the equalization potential.

17. The apparatus of claim 14 , wherein the equalization potential is different than a ground reference potential.

18. The apparatus of claim 14 , further comprising an equalization circuit coupled to the three dimensional memory array, and wherein the controller is further configured to:

disable the equalization circuit while performing the read operation; and

enable the equalization circuit while discharging the selected one of the access lines and the non-selected one of the access lines to the equalization potential.

19. The apparatus of claim 14 , further comprising:

a first global control line coupled to the selected access line; and

a second global control line coupled to the non-selected access line, wherein the controller is configured to cause the first global control line and the second global control line to be discharged to an equalization potential subsequent to performance of the read operation.

20. The apparatus of claim 14 , further comprising:

a first global control line coupled to the selected access line; and

a second global control line coupled to the non-selected access line, wherein the controller is configured to cause the first global control line and the second global control line to be discharged to a potential different than the equalization potential discharge of the selected one of the access lines and the non-selected one of the access lines to the equalization potential.

Assignments (7)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050709/0838 →
RELEASE OF SECURITY INTEREST Recorded Jul 20, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 046597/0333 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
SUPPLEMENT NO. 6 TO PATENT SECURITY AGREEMENT Recorded Nov 1, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 044348/0253 →
SUPPLEMENT NO. 6 TO PATENT SECURITY AGREEMENT Recorded Nov 1, 2017
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 044653/0333 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 31, 2017
From: TANZAWA, TORU
To: MICRON TECHNOLOGY, INC.
Reel/Frame 043464/0181 →
Continuity (4)
Continuation 15164400 · May 25, 2016
Continuation 14813711 · Jul 30, 2015
Division 13774522 · Feb 22, 2013
Related Publication 20170365298A1 · Dec 21, 2017