Semiconductor device
A semiconductor device comprising a first transistor, a second insulating film, a conductive film, and a capacitor is provided. The first transistor comprises a first oxide semiconductor film, a gate insulating film over the first oxide semiconductor film, and a gate electrode over the gate insulating film. The second insulating film is provided over the gate electrode. The conductive film is electrically connected to the first oxide semiconductor film. The capacitor comprises a second oxide semiconductor film, the second insulating film over the second oxide semiconductor film, and the conductive film over the second insulating film. The first oxide semiconductor film comprises a first region and a second region. Each of a carrier density of the second region and a carrier density of the second oxide semiconductor film is higher than a carrier density of the first region.
1. A semiconductor device comprising:
a pixel portion comprising:
a first transistor comprising:
a first oxide semiconductor film over and in direct contact with a first insulating film;
a gate insulating film over the first oxide semiconductor film; and
a gate electrode over the gate insulating film,
a second transistor electrically connected to the first transistor;
a second insulating film over the gate electrode of the first transistor;
a conductive film electrically connected to the first oxide semiconductor film; and
a capacitor comprising:
a second oxide semiconductor film over and in direct contact with the first insulating film;
the second insulating film over the second oxide semiconductor film; and
the conductive film over the second insulating film, and
a driver circuit portion electrically connected to the first transistor,
wherein the second insulating film is in direct contact with the first oxide semiconductor film, the gate insulating film, the gate electrode, the conductive film, and the second oxide semiconductor film.
2. The semiconductor device according to claim 1 ,
wherein the first oxide semiconductor film comprises a rare gas element.
3. The semiconductor device according to claim 1 ,
wherein the conductive film is electrically connected to one of a source and a drain of the first transistor through a hole provided in the second insulating film.
4. The semiconductor device according to claim 1 ,
wherein the second insulating film is in direct contact with a top surface and a side surface of the gate insulating film.
5. The semiconductor device according to claim 1 ,
wherein the conductive film is a transparent conductive film.
6. The semiconductor device according to claim 1 ,
wherein the conductive film comprises any one of indium tin oxide, indium oxide including tungsten oxide, indium zinc oxide including tungsten oxide, indium oxide including titanium oxide, indium tin oxide including titanium oxide, indium zinc oxide, and indium tin oxide including silicon oxide.
7. The semiconductor device according to claim 1 , wherein each of the gate electrode and the conductive film comprises copper.
8. The semiconductor device according to claim 1 , further comprising an organic resin film over the second insulating film,
wherein the organic resin film comprises any one of polyimide, acrylic, polyamide, and epoxy.
9. The semiconductor device according to claim 1 , further comprising a third transistor in the driver circuit portion,
wherein the first transistor and the third transistor have different structures.
10. The semiconductor device according to claim 1 ,
wherein the first oxide semiconductor film comprises a crystalline structure.
11. A semiconductor device comprising:
a pixel portion comprising:
a first transistor comprising:
a first oxide semiconductor film over and in direct contact with a first insulating film;
a gate insulating film over the first oxide semiconductor film; and
a gate electrode over the gate insulating film,
a second transistor electrically connected to the first transistor;
a second insulating film over the gate electrode of the first transistor;
a conductive film electrically connected to the first oxide semiconductor film;
a light-emitting element electrically connected to the second transistor; and
a capacitor comprising:
a second oxide semiconductor film over and in direct contact with the first insulating film;
the second insulating film over the second oxide semiconductor film; and
the conductive film over the second insulating film, and
a driver circuit portion electrically connected to the first transistor,
wherein the second insulating film is in direct contact with the first oxide semiconductor film, the gate insulating film, the gate electrode, the conductive film, and the second oxide semiconductor film.
12. The semiconductor device according to claim 11 ,
wherein the first oxide semiconductor film comprises a rare gas element.
13. The semiconductor device according to claim 11 ,
wherein the conductive film is electrically connected to one of a source and a drain of the first transistor through a hole provided in the second insulating film.
14. The semiconductor device according to claim 11 ,
wherein the second insulating film is in direct contact with a top surface and a side surface of the gate insulating film.
15. The semiconductor device according to claim 11 ,
wherein the conductive film is a transparent conductive film.
16. The semiconductor device according to claim 11 ,
wherein the conductive film comprises any one of indium tin oxide, indium oxide including tungsten oxide, indium zinc oxide including tungsten oxide, indium oxide including titanium oxide, indium tin oxide including titanium oxide, indium zinc oxide, and indium tin oxide including silicon oxide.
17. The semiconductor device according to claim 11 , wherein each of the gate electrode and the conductive film comprises copper.
18. The semiconductor device according to claim 11 , further comprising an organic resin film over the second insulating film,
wherein the organic resin film comprises any one of polyimide, acrylic, polyamide, and epoxy.
19. The semiconductor device according to claim 11 , further comprising a third transistor in the driver circuit portion,
wherein the first transistor and the third transistor have different structures.
20. The semiconductor device according to claim 11 ,
wherein the first oxide semiconductor film comprises a crystalline structure.