Electrostatic discharge devices and methods of manufacture
Electrostatic discharge (ESD) devices and methods of manufacture are provided. The method includes forming a plurality of fin structures and a mesa structure from semiconductor material. The method further includes forming an epitaxial material with doped regions on the mesa structure and forming gate material over at least the plurality of fin structures. The method further includes planarizing at least the gate material such that the gate material and the epitaxial material are of a same height. The method further includes forming contacts in electrical connection with respective ones of the doped regions of the epitaxial material.
1. A method of manufacturing a semiconductor structure, comprising:
covering a plurality of fin structures on an insulator layer, the plurality of fin structures having a first height;
forming an electrostatic discharge (ESD) device comprising a doped epitaxial material at second height higher than the first height;
uncovering the plurality of fin structures; and
forming a gate stack on the plurality of fin structures, the gate stack being at the second height.
2. The method of claim 1 , wherein the covering the plurality of fin structures comprises forming a conformal oxide layer on the plurality of fin structures.
3. The method of claim 2 , wherein the uncovering the plurality of fin structures comprises removing the conformal oxide layer.
4. The method of claim 1 , wherein the doped epitaxial material is formed on a mesa on the insulator layer.
5. The method of claim 4 , further comprising patterning the mesa and the plurality of fin structures from a same layer of semiconductor material.
6. The method of claim 4 , further comprising cleaning the mesa prior to forming the doped epitaxial material on the mesa.
7. The method of claim 1 , wherein the epitaxial material is doped with N+ and P+ implants.
8. The method of claim 7 , wherein the epitaxial material comprises an N+ area and a P+ area.
9. The method of claim 1 , further comprising forming an oxide layer between the gate stack and the epitaxial material.
10. The method of claim 9 , further comprising planarizing top surfaces of the oxide layer, the gate stack, and the epitaxial material to the second height.
11. The method of claim 10 , further comprising forming a blocking layer on and contacting the planarized top surfaces of the oxide layer, the gate stack, and the epitaxial material.
12. The method of claim 1 , further comprising forming an insulator layer over the gate stack and the epitaxial material.
13. The method of claim 12 , further comprising forming silicide on the epitaxial material.
14. The method of claim 13 , further comprising forming contacts through the insulator layer and contacting the silicide regions.