Three-dimensional monolithic vertical field effect transistor logic gates
Techniques facilitating three-dimensional monolithic vertical field effect transistor logic gates are provided. A logic device can comprise a first vertical transport field effect transistor formed over and adjacent a substrate and a first bonding film deposited over the first vertical transport field effect transistor. The logic device can also comprise a second vertical transport field effect transistor comprising a second bonding film and stacked on the first vertical transport field effect transistor. The second bonding film can affix the second vertical transport field effect transistor to the first vertical transport field effect transistor. In addition, the logic device can comprise one or more monolithic inter-layer vias that extend from first respective portions of the second vertical transport field effect transistor to second respective portions of the first vertical transport field effect transistor and through the first bonding film and the second bonding film.
1. A logic device, comprising:
a first vertical transport field effect transistor formed over and adjacent a substrate;
a first bonding film deposited over the first vertical transport field effect transistor;
a second vertical transport field effect transistor comprising a second bonding film and stacked on the first vertical transport field effect transistor, wherein the second bonding film affixes the second vertical transport field effect transistor to the first vertical transport field effect transistor; and
one or more monolithic inter-layer vias that extend from first respective portions of the second vertical transport field effect transistor to second respective portions of the first vertical transport field effect transistor and through the first bonding film and the second bonding film.
2. The logic device of claim 1 , wherein the first vertical transport field effect transistor is an n-channel field effect transistor and the second vertical transport field effect transistor is a p-channel field effect transistor.
3. The logic device of claim 1 , wherein the first vertical transport field effect transistor is a p-channel field effect transistor and the second vertical transport field effect transistor is an n-channel field effect transistor.
4. The logic device of claim 1 , wherein the first vertical transport field effect transistor comprises:
a first doped layer formed on the substrate;
a first semiconducting layer formed on the first doped layer;
a first gate layer formed around respective first elements of the first semiconducting layer;
a second doped layer formed over the first semiconducting layer; and
a first contact layer formed on the second doped layer.
5. The logic device of claim 4 , wherein the second vertical transport field effect transistor comprises:
a third doped layer placed over the first contact layer and the first bonding film;
a second semi-conducting layer formed on the third doped layer;
a second gate layer formed around respective second elements of the second semi-conducting layer;
a fourth doped layer formed over the second semi-conducting layer; and
a second contact layer formed on the fourth doped layer.
6. The logic device of claim 5 , wherein the one or more monolithic inter-layer vias penetrate and contact the second gate layer and extend to the first gate layer.
7. The logic device of claim 5 , wherein the one or more monolithic inter-layer vias extend from a first metallurgy on the first vertical transport field effect transistor to a second metallurgy on the second vertical transport field effect transistor.
8. A semiconductor chip, comprising:
a first vertical transport field effect transistor formed over and adjacent a substrate;
a first bonding film deposited on the first vertical transport field effect transistor;
a second vertical transport field effect transistor stacked on the first vertical transport field effect transistor, the second vertical transport field effect transistor comprises a second bonding film, wherein the second bonding film affixes the second vertical transport field effect transistor to the first vertical transport field effect transistor; and
one or more monolithic inter-layer vias that extend from first respective portions of the second vertical transport field effect transistor to second respective portions of the first vertical transport field effect transistor and through the first bonding film and the second bonding film.
9. The semiconductor chip of claim 8 , wherein the one or more monolithic inter-layer vias extend from a first metallurgy on the first vertical transport field effect transistor to a second metallurgy on the second vertical transport field effect transistor.