Acoustic wave device with acoustically separated multi-channel feedback
Aspects of this disclosure relate to an acoustic wave device that includes an acoustic obstacle disposed between canceling circuits coupled to one or more acoustic wave filters. The canceling circuits can cancel frequency components within different frequency bands. The acoustic obstacle can reduce acoustic coupling between the canceling circuits by scattering and/or absorbing acoustic energy.
1. An acoustic wave device comprising:
a first canceling circuit arranged to cancel frequency components in a first frequency band;
a second canceling circuit arranged to cancel frequency components in a second frequency band;
an acoustic wave filter coupled to the first canceling circuit and the second canceling circuit;
an acoustic obstacle disposed between the first canceling circuit and the second canceling circuit; and
a cavity wall, the acoustic obstacle including the same material as the cavity wall.
2. The acoustic wave device of claim 1 further comprising a cavity roof over the acoustic obstacle, the cavity roof being separated from the acoustic obstacle by a gap.
3. The acoustic wave device of claim 1 wherein the same material of the acoustic obstacle and the cavity wall is a polymer.
4. The acoustic wave device of claim 1 further comprising a cavity roof over the acoustic obstacle, the cavity roof being in contact with the acoustic obstacle.
5. The acoustic wave device of claim 1 wherein the acoustic obstacle is positioned on a piezoelectric substrate.
6. The acoustic wave device of claim 1 wherein the acoustic wave filter includes a surface acoustic wave resonator and the first canceling circuit includes an interdigital transducer electrode.
7. The acoustic wave device of claim 6 wherein the acoustic obstacle and the interdigital transducer electrode each include the same material.
8. The acoustic wave device of claim 1 wherein the acoustic obstacle is configured to absorb acoustic energy and to scatter acoustic energy.
9. The acoustic wave device of claim 1 further comprising a second acoustic wave filter coupled to the first canceling circuit and the second canceling circuit, the acoustic wave filter being a transmit filter and the second acoustic wave filter being a receive filter.
10. The acoustic wave device of claim 1 wherein the acoustic obstacle is positioned on a silicon dioxide layer such that the silicon dioxide layer is positioned between the acoustic obstacle and a piezoelectric substrate.
11. A multiplexer comprising:
a transmit filter including first acoustic wave resonators;
a receive filter including second acoustic wave resonators, the receive filter and the transmit filter being coupled to each other at a common node;
a first canceling circuit coupled to the transmit filter and to the receive filter, the first canceling circuit including an interdigital transducer electrode;
a second canceling circuit coupled to the transmit filter and to the receive filter; and
an acoustic obstacle disposed between the first canceling circuit and the second canceling circuit, the acoustic obstacle and the interdigital transducer electrode each including the same material, and the acoustic obstacle further including a polymer.
12. The multiplexer of claim 11 wherein the multiplexer is arranged as a duplexer.
13. The multiplexer of claim 11 wherein the first canceling circuit is configured to attenuate a transmission characteristic of the receive filter at frequencies in a pass band of the transmit filter.
14. A surface acoustic wave device comprising:
a surface acoustic wave filter; and
a multi-channel feedback circuit coupled to the surface acoustic wave filter, the multi-channel feedback circuit including first interdigital transducer electrodes corresponding to a first channel, second interdigital transducer electrodes corresponding to a second channel, and an acoustic obstacle arranged to reduce acoustic coupling between the first interdigital transducer electrodes and the second interdigital transducer electrodes, the acoustic obstacle and the first interdigital transducer electrodes both including the same material, and the acoustic obstacle further including a polymer.
15. The surface acoustic wave device of claim 14 further comprising a second surface acoustic wave filter coupled to the multi-channel feedback circuit.
16. The surface acoustic wave device of claim 14 further comprising a cavity wall that includes the same polymer as the acoustic obstacle.
17. The surface acoustic wave device of claim 14 wherein a metallic portion of the acoustic obstacle has a zig-zag shape, the metallic portion including the same material as the first interdigital transducer electrodes.
18. A surface acoustic wave device comprising:
a surface acoustic wave filter;
a multi-channel feedback circuit coupled to the surface acoustic wave filter, the multi-channel feedback circuit including first interdigital transducer electrodes corresponding to a first channel, second interdigital transducer electrodes corresponding to a second channel, and an acoustic obstacle arranged to reduce acoustic coupling between the first interdigital transducer electrodes and the second interdigital transducer electrodes; and
a cavity wall, the acoustic obstacle including the same material as the cavity wall.
19. The surface acoustic wave device of claim 18 wherein the acoustic obstacle and the first interdigital transducer electrodes both include the same metallic material.
20. The surface acoustic wave device of claim 18 further comprising a second surface acoustic wave filter coupled to the multi-channel feedback circuit.