Silicon carbide power module
A power module includes a case, a first terminal, a second terminal, and a number of silicon carbide semiconductor die. The case has a footprint less than 30 cm 2 . The silicon carbide semiconductor die are inside the case and coupled between the first terminal and the second terminal. The power module and the silicon carbide semiconductor die are configured such that in a first operating state the silicon carbide semiconductor die are capable of continuously blocking voltages greater than 650V between the first terminal and the second terminal, and in a second operating state the silicon carbide semiconductor die are capable of continuously passing currents greater than 200 A between the first terminal and the second terminal.
1. A power module comprising:
a case having a footprint less than 30 cm 2 ;
a first terminal and a second terminal, each terminal comprising:
a terminal base connected to a power substrate, the terminal base comprising a first terminal base sub-section and a second terminal base sub-section, wherein an area of the first terminal base sub-section and the second terminal base sub-section in contact with the power substrate is greater than 15 mm 2 ;
a terminal body coupled to the terminal base; and
a plurality of silicon carbide semiconductor die inside the case on the power substrate and coupled between the first terminal and the second terminal, wherein the power module and the plurality of silicon carbide semiconductor die are configured so that:
in a first operating state, the plurality of silicon carbide semiconductor die is capable of continuously blocking voltages greater than 650V and up to 1700V between the first terminal and the second terminal; and
in a second operating state, the plurality of silicon carbide semiconductor die is capable of continuously passing currents greater than 200 A between the first terminal and the second terminal.
2. The power module of claim 1 wherein the power module and the plurality of silicon carbide semiconductor die are configured so that in the second operating state the plurality of silicon carbide semiconductor die are capable of continuously passing currents greater than 300 A and up to 400 A between the first terminal and the second terminal.
3. The power module of claim 2 wherein the footprint of the case is less than 25 cm 2 and as low as 20 cm 2 .
4. The power module of claim 2 wherein the power module and the plurality of silicon carbide semiconductor die are configured so that in the first operating state the plurality of silicon carbide semiconductor die is capable of continuously blocking voltages up to 1700V between the first terminal and the second terminal.
5. The power module of claim 2 wherein a thermal resistance between a junction of at least one of the plurality of silicon carbide semiconductor die and the case is less than 0.20° C./W and as low as 0.05° C./W.
6. The power module of claim 1 wherein the footprint of the case is less than 25 cm 2 and as low as 20 cm 2 .
7. The power module of claim 1 wherein the power module and the plurality of silicon carbide semiconductor die are configured so that in the second operating state a resistance between the first terminal and the second terminal is less than 4.0 mΩ at 25° C. and as low as 3.0 mΩ at 25° C.
8. The power module of claim 7 wherein the power module and the plurality of silicon carbide semiconductor die are configured so that in the second operating state the resistance between the first terminal and the second terminal is less than 8.0 mΩ at 175° C. and as low as 5.0 mΩ at 175° C.
9. The power module of claim 1 wherein a thermal resistance between a junction of at least one of the plurality of silicon carbide semiconductor die and the case is less than 0.20° C./W and as low as 0.05° C./W.
10. The power module of claim 1 wherein a loop inductance between the first terminal and the second terminal is less than 25 nH and as low as 5 nH.
11. The power module of claim 1 wherein the area of each one of the first terminal and the second terminal in contact with the power substrate is less than 50 mm 2 .
12. A power module comprising:
a case having a footprint less than 30 cm 2 ;
a power substrate inside the case;
a first terminal and a second terminal, each of which is a blade connector soldered to the power substrate comprising:
a terminal base soldered to the power substrate, the terminal base comprising a first terminal base sub-section and a second terminal base sub-section separated from the first terminal base sub-section; and
a terminal body coupled to the terminal base such that the terminal body is coupled with each of the first terminal base sub-section and the second terminal base sub-section; and
a plurality of silicon carbide semiconductor die mounted on the power substrate and coupled between the first terminal and the second terminal such that the first terminal is configured to provide a positive supply voltage to the plurality of silicon carbide semiconductor die and the second terminal is configured to provide a negative supply voltage to the plurality of silicon carbide semiconductor die, wherein the first terminal and the second terminal are arranged to be adjacent to one another on the power substrate.
13. The power module of claim 12 wherein the first terminal and the second terminal each further comprise a terminal header coupled to the terminal body, the terminal header comprising a plurality of pins configured to be soldered to a printed circuit board.
14. The power module of claim 12 wherein a width of the terminal body is greater than 5 mm and less than 15 mm.
15. The power module of claim 12 wherein a loop inductance between the first terminal and the second terminal is less than 25 nH and as low as 5 nH.
16. The power module of claim 12 wherein an area of each one of the first terminal and the second terminal in contact with the power substrate is greater than 15 mm 2 and less than 50 mm 2 .
17. The power module of claim 12 wherein a width of each one of the first terminal and the second terminal is greater than 5 mm and less than 15 mm.
18. The power module of claim 12 wherein the footprint of the power module is as low as 20 cm 2 .