IP Library Granted Patent US 10,128,842
Granted Patent B1
US 10,128,842 · App. 15/934,663 · Granted Nov 13, 2018

Output impedance calibration for signaling

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Quick Facts
Patent No.
US 10,128,842
App. No.
15/934,663
Granted
Nov 13, 2018
Kind
B1
Abstract

Methods, systems, and devices for output impedance calibration for signaling are described. Techniques are provided herein to adjust impedance levels associated with data transmitted using signaling and related techniques. In some cases, the signaling may be multi-level signaling. Such signaling may be configured to increase a data transfer rate without increasing the frequency of data transfer and/or a transmit power of the communicated data.

Claims (10)

1. A method, comprising:

receiving first data output from a first partition of a driver and second data output from a second partition of the driver;

determining an output impedance of at least one of the first partition or the second partition based at least in part on receiving the first data and the second data;

initiating an adjustment of the first partition from a first impedance level to a second impedance level based at least in part on the determination;

determining an output impedance offset between the first data and the second data after initiating the adjustment of the first partition to the second impedance level, wherein initiating the adjustment of the first partition, the second partition, or both is based at least in part on the output impedance offset; and

initiating an adjustment of the second partition from a third impedance level to a fourth impedance level based at least in part on determining the output impedance of at least one of the first partition or the second partition.

2. The method of claim 1 , wherein at least one leg group of the first partition comprises at least one binary weighted leg.

3. The method of claim 1 , wherein initiating the adjustment of the impedance level of the first partition comprises activating a first leg group comprising a plurality of legs, the first leg group comprising a first transistor coupled with a first resistive component and second leg group comprising a second transistor coupled with a second resistive component.

4. The method of claim 3 , further comprising:

initiating the adjustment of the impedance level of the first partition further comprises activating at least one additional leg of the first leg group, each additional leg comprising a transistor.

Assignments (5)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050709/0965 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
SUPPLEMENT NO. 8 TO PATENT SECURITY AGREEMENT Recorded May 7, 2018
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 046084/0955 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 9, 2018
From: LIN, FENG
To: MICRON TECHNOLOGY, INC.
Reel/Frame 045478/0394 →