IP Library Granted Patent US 10,297,327
Granted Patent B2
US 10,297,327 · App. 15/952,155 · Granted May 21, 2019

Sensing amplifier comprising fully depleted silicon-on-insulator transistors for reading a selected flash memory cell in an array of flash memory cells

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Quick Facts
Patent No.
US 10,297,327
App. No.
15/952,155
Granted
May 21, 2019
Kind
B2
Abstract

The present invention relates to a flash memory system comprising one or more sense amplifiers for reading data stored in flash memory cells. The sense amplifiers utilize fully depleted silicon-on-insulator transistors to minimize leakage. The fully depleted silicon-on-insulator transistors comprise one or more fully depleted silicon-on-insulator NMOS transistors and/or one or more fully depleted silicon-on-insulator PMOS transistors.

Claims (49)

1. A flash memory system comprising:

an array of flash memory cells; and

a sensing amplifier for reading a selected memory cell in the array of flash memory cells, the sensing amplifier comprising:

a first stage comprising a first fully depleted silicon-on-insulator PMOS transistor for providing a reference current to a sensing node, a first fully depleted silicon-on-insulator NMOS transistor coupled between the sensing node and a selected flash memory cell in the array;

a second stage comprising a second fully depleted silicon-on-insulator PMOS transistor for providing a reference current to a reference node, a second fully depleted silicon-on-insulator NMOS transistor coupled between the reference node and a reference flash memory cell; and

a differential amplifier for receiving the sensing node and the reference node as inputs and generating an output indicative of a value stored in the selected flash memory cell.

2. The flash memory system of claim 1 , wherein the selected memory cell is in a first plane of the array and the reference memory cell is in a second plane of the array.

3. The flash memory system of claim 2 , wherein the first plane provides a selected bitline coupled to the selected memory cell and the second plane provides another selected bitline coupled to the reference memory cell.

4. The flash memory system of claim 2 , wherein a forward body bias is used in active mode and a reverse body bias is used in a standby mode for the first and second fully depleted silicon-on-insulator PMOS transistors and the first and second fully depleted silicon-on-insulator NMOS transistors.

5. The flash memory system of claim 4 , wherein the forward body bias or reverse body bias is used to reduce an offset of the sense amplifier.

6. The flash memory system of claim 1 , wherein the first and second fully depleted silicon-on-insulator PMOS transistors each comprises a p-well biased to ground and the first and second fully depleted silicon-on-insulator NMOS transistors each comprises an n-well biased to ground.

7. The flash memory system of claim 1 , wherein the memory cells comprise source side injection flash memory cells, each comprising:

an erase gate to provide erasing;

a coupling gate; and

a source line to provide programming current.

8. The flash memory system of claim 1 , wherein the first and second fully depleted silicon-on-insulator PMOS transistors each comprises a p-well coupled to a first variable voltage source and the first and second fully depleted silicon-on-insulator NMOS transistors each comprises an n-well coupled to a second variable voltage source.

9. A flash memory sensing system comprising:

an array of flash memory cells; and

a sensing amplifier for reading a selected memory cell in the array of flash memory cells, the sensing amplifier comprising:

a first stage comprising a first bulk CMOS transistor comprising a first fully depleted silicon-on-insulator PMOS transistor and a first fully depleted silicon-on-insulator NMOS transistor, wherein a sensing node is formed between the first fully depleted silicon-on-insulator PMOS transistor and the first fully depleted silicon-on-insulator NMOS transistor and the first fully depleted silicon-on-insulator NMOS transistor is coupled to a selected flash memory cell in the array;

a second stage comprising a second bulk CMOS transistor comprising a second fully depleted silicon-on-insulator PMOS transistor and a second fully depleted silicon-on-insulator NMOS transistor, wherein a reference node is formed between the second fully depleted silicon-on-insulator PMOS transistor and the second fully depleted silicon-on-insulator NMOS transistor and the second fully depleted silicon-on-insulator NMOS transistor is coupled to a reference memory cell; and

a differential amplifier for receiving the sensing node and the reference node as inputs and generating an output indicative of a value stored in the selected flash memory cell.

10. The flash memory sensing system of claim 9 , wherein the first fully depleted silicon-on-insulator PMOS transistor is coupled to a first power supply and the second fully depleted silicon-on-insulator PMOS transistor is coupled to a second power supply, wherein the first power supply has a higher voltage than the second power supply.

11. The flash memory sensing system of claim 9 , wherein the differential amplifier comprises latched inverters.

12. The flash memory sensing system of claim 11 , wherein the latched inverters are coupled to NMOS input pairs that are coupled to the sensing node.

13. A flash memory system comprising:

an array of flash memory cells arranges into rows and columns; and

a row decoder for selecting a row of flash memory cells in the array for a read or write operation, the row decoder comprising one or more fully depleted silicon-on-insulator NMOS transistors, and one or more fully depleted silicon-on-insulator PMOS transistors;

a column decoder for selecting a column of flash memory cells in the array for a read or write operation, the column decoder comprising one or more fully depleted silicon-on-insulator NMOS transistors each comprising a p-well under a buried oxide layer, and one or more fully depleted silicon-on-insulator NMOS transistors each comprising an n-well under a buried oxide layer; and

a sensing amplifier comprising:

a first stage comprising a first fully depleted silicon-on-insulator PMOS transistor for providing a reference current to a sensing node, a first fully depleted silicon-on-insulator NMOS transistor coupled between the sensing node and a selected flash memory cell in the array;

a second stage comprising a second fully depleted silicon-on-insulator PMOS transistor for providing a reference current to a reference node, a second fully depleted silicon-on-insulator NMOS transistor coupled between the reference node and a reference flash memory cell; and

a differential amplifier for receiving the sensing node and the reference node as inputs and generating an output indicative of a value stored in the selected flash memory cell.

14. The flash memory system of claim 13 , wherein each flash memory cell comprises:

an erase gate to provide erasing;

a coupling gate; and

a source line to provide programming current.

15. The flash memory system of claim 13 , wherein the array comprises a plurality of flash sub-arrays, each comprising separate p-wells underneath.

16. A flash memory system comprising:

an array of flash memory cells arranges into rows and columns;

a row decoder for selecting a row of flash memory cells in the array for a read or write operation, the row decoder comprising one or more fully depleted silicon-on-insulator NMOS transistors, and one or more fully depleted silicon-on-insulator PMOS transistors;

a column decoder for selecting a column of flash memory cells in the array for a read or write operation, the column decoder comprising one or more fully depleted silicon-on-insulator NMOS transistors each comprising a p-well under a buried oxide layer, and one or more fully depleted silicon-on-insulator NMOS transistors each comprising an n-well under a buried oxide layer;

a sensing amplifier for reading a selected memory cell in the array of flash memory cells, the sensing amplifier comprising one or more fully depleted silicon-on-insulator NMOS transistors, and one or more fully depleted silicon-on-insulator PMOS transistors; and

a high voltage decoder comprising:

an erase gate decoder for providing a high voltage to an erase gate terminal of a selected flash memory cell;

a coupling gate decoder for providing a high voltage a coupling gate terminal of a selected flash memory cell; and

a sourceline decoder for providing a high voltage to a sourceline terminal of a selected flash memory cell.

17. The flash memory system of claim 16 , wherein the high voltage decoder further comprises an enabling latch comprising fully depleted silicon-on-insulator transistors.

18. The flash memory system of claim 16 , wherein the erase gate decoder, the coupling gate decoder, and the source line decoder each comprises bulk CMOS transistors.

Assignments (12)
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0335 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059263/0001 →
GRANT OF SECURITY INTEREST IN PATENT RIGHTS Recorded Nov 19, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 058214/0625 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 052856/0909 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
Cited By (1)
US 12,433,019