Packaging a substrate with an LED into an interconnect structure only through top side landing pads on the substrate
Standardized photon building blocks are packaged in molded interconnect structures to form a variety of LED array products. No electrical conductors pass between the top and bottom surfaces of the substrate upon which LED dies are mounted. Microdots of highly reflective material are jetted onto the top surface. Landing pads on the top surface of the substrate are attached to contact pads disposed on the underside of a lip of the interconnect structure. In a solder reflow process, the photon building blocks self-align within the interconnect structure. Conductors in the interconnect structure are electrically coupled to the LED dies in the photon building blocks through the contact pads and landing pads. Compression molding is used to form lenses over the LED dies and leaves a flash layer of silicone covering the landing pads. The flash layer laterally above the landing pads is removed by blasting particles at the flash layer.
1. A method comprising:
mounting a light emitting diode (LED) die on a substrate, wherein the substrate has a top surface and a bottom surface, wherein landing pads are disposed on the top surface of the substrate, and wherein no electrical conductor passes through the substrate from the top surface of the substrate to the bottom surface of the substrate;
placing each of the landing pads adjacent to one of a plurality of contact pads disposed on an underside of a lip of an interconnect structure, wherein the lip surrounds an opening in the interconnect structure; and
heating the landing pads such that the landing pads align with the contact pads, such that the substrate is electrically coupled to the interconnect structure only by the landing pads being attached to the contact pads, and such that the LED die is electrically coupled to at least one of the contact pads.
2. The method of claim 1 , further comprising:
electrically connecting the LED die to the landing pads with wire bonds.
3. The method of claim 2 , further comprising:
overmolding a lens over the LED die and over the wire bonds.
4. The method of claim 1 , wherein the landing pads are connected to the contact pads using solder.
5. The method of claim 4 , wherein upon the heating of the landing pads, the landing pads are pulled under the contact pads by surface tension of molten solder.
6. The method of claim 1 , further comprising:
aligning the substrate with the interconnect structure using a solder reflow process.
7. The method of claim 1 , wherein the interconnect structure is taken from the group consisting of: a molded interconnect device (MID), an FR-4 epoxy circuit board, and a lead frame structure.
8. The method of claim 1 , wherein the interconnect structure includes a conductor, and wherein after heating the landing pads the conductor of the interconnect structure is electrically coupled to the LED die.
9. The method of claim 1 , wherein the opening is circular.
10. The method of claim 9 , wherein after the landing pads align with the contact pads upon heating, a section of the landing pads is disposed laterally inside the circular opening.
11. A method comprising:
mounting a light emitting diode (LED) die on a substrate, wherein the substrate has a top surface and a bottom surface, wherein a landing pad is disposed on the top surface of the substrate, and wherein no electrical conductor passes through the substrate from the top surface of the substrate to the bottom surface of the substrate;
placing the landing pad adjacent to a contact pad disposed on an underside of a lip of an interconnect structure, wherein the lip surrounds an opening in the interconnect structure; and
heating the landing pad such that the landing pad is pulled towards the contact pad, such that the substrate is electrically coupled to the interconnect structure by the landing pad being attached to the contact pad, and such that the LED die is electrically coupled to the contact pad.
12. The method of claim 11 , further comprising:
electrically connecting the LED die to the landing pad with a wire bond.
13. The method of claim 12 , further comprising:
overmolding a lens over the LED die and over the wire bond.
14. The method of claim 11 , wherein the landing pad is connected to the contact pad using solder.
15. The method of claim 14 , wherein upon the heating of the landing pad, the landing pad is pulled under the contact pad by surface tension of molten solder.
16. The method of claim 11 , further comprising:
aligning the substrate with the interconnect structure using a solder reflow process.
17. The method of claim 11 , wherein the interconnect structure is taken from the group consisting of: a molded interconnect device (MID), an FR-4 epoxy circuit board, and a lead frame structure.
18. The method of claim 11 , wherein the interconnect structure includes a conductor, and wherein after heating the landing pad the conductor of the interconnect structure is electrically coupled to the LED die.
19. The method of claim 11 , wherein the opening is circular.
20. The method of claim 19 , wherein after the landing pad is pulled towards the contact pad upon heating, a section of the landing pad is disposed laterally inside the circular opening.