Power module with improved reliability
A power module includes a first terminal, a second terminal, and a number of semiconductor die coupled between the first terminal and the second terminal. The semiconductor die are configured to provide a low-resistance path for current flow from the first terminal to the second terminal during a forward conduction mode of operation and a high-resistance path for current flow from the first terminal to the second terminal during a forward blocking configuration. Due to improvements made to the power module, it is able to pass a temperature, humidity, and bias test at 80% of its rated voltage for at least 1000 hours.
1. A semiconductor die comprising:
a substrate;
a drift layer on the substrate;
a front-side metallization layer on the drift layer opposite the substrate; and
a passivation layer stack on the drift layer and the front-side metallization layer such that the passivation layer stack provides protection for the front-side metallization layer, the passivation layer stack comprising at least four passivation layers such that a composition of the at least four passivation layers alternates between at least a first material and a second material.
2. The semiconductor die of claim 1 wherein the first material and the second material are different ones of silicon nitride (SiN), silicon-dioxide (SiO 2 ), and silicon-oxy-nitride (SiON).
3. The semiconductor die of claim 1 wherein the passivation layer stack has a thickness of at least 1.6 μm.
4. The semiconductor die of claim 1 further comprising a back-side metallization layer directly on the substrate opposite the drift layer, wherein the back-side metallization layer is substantially free of silver.
5. The semiconductor die of claim 1 wherein the passivation layer stack comprises at least five passivation layers.
6. The semiconductor die of claim 1 wherein a metal-oxide-semiconductor field-effect transistor (MOSFET) is formed in the drift layer.
7. A semiconductor die comprising:
a substrate;
a drift layer on the substrate; and
a back-side metallization layer directly on the substrate opposite the drift layer, wherein the back-side metallization layer is substantially free of silver.
8. The semiconductor die of claim 7 wherein:
a metal-oxide-semiconductor field-effect transistor (MOSFET) is formed in the drift layer; and
the back-side metallization layer provides a drain contact of the MOSFET.
9. The semiconductor die of claim 8 wherein:
a Schottky diode is formed in the drift layer; and
the back-side metallization layer provides an anode contact of the Schottky diode.
10. The semiconductor die of claim 7 wherein:
a Schottky diode is formed in the drift layer; and
the back-side metallization layer provides an anode contact of the Schottky diode.
11. The semiconductor die of claim 7 wherein the back-side metallization layer comprises tin, nickel, and gold.
12. The semiconductor die of claim 7 further comprising a front-side metallization layer on the drift layer opposite the substrate, wherein the front-side metallization layer comprises a first layer of titanium and a second layer comprising aluminum, nickel, and gold on the first layer.
13. A semiconductor die comprising:
a substrate;
a drift layer on the substrate;
a front-side metallization layer on the drift layer opposite the substrate; and
a passivation layer stack on the drift layer and the front-side metallization layer such that the passivation layer stack provides protection for the front-side metallization layer, the passivation layer stack comprising at least four passivation layers.
14. The semiconductor die of claim 13 wherein the passivation layer stack is at least 1.6 μm thick.
15. The semiconductor die of claim 13 wherein the passivation layer stack comprises at least five passivation layers.
16. The semiconductor die of claim 13 further comprising a back-side metallization layer on the substrate opposite the drift layer, wherein the back-side metallization layer is substantially free of silver.
17. The semiconductor die of claim 16 wherein a metal-oxide-semiconductor field-effect transistor (MOSFET) is formed in the drift layer.
18. The semiconductor die of claim 17 wherein the back-side metallization layer provides a drain contact of the MOSFET.
19. The semiconductor die of claim 16 wherein a Schottky diode is formed in the drift layer.
20. The semiconductor die of claim 19 wherein the back-side metallization layer provides an anode contact of the Schottky diode.
21. The semiconductor die of claim 6 further comprising a back-side metallization layer on the substrate opposite the drift layer, wherein the back-side metallization layer forms a drain contact of the MOSFET and the back-side metallization layer is substantially free of silver.