3D semiconductor device
A 3D semiconductor device, the device including: a first level including a plurality of first single crystal transistors, contacts, and a first metal layer, where a portion of the first single crystal transistors are interconnected, where the interconnected includes the first metal layer and the contacts, and where the portion of the first single crystal transistors are interconnected forms memory control circuits; a second level overlaying the first level, the second level including a plurality of second transistors; a third level overlaying the second level, the third level including a plurality of third transistors; a fourth level overlaying the third level, the fourth level including a plurality of fourth transistors; and a second metal layer overlaying the fourth level, where the plurality of second transistors are aligned to the plurality of first transistors with a less than 40 nm alignment error.
1. A 3D semiconductor device, the device comprising:
a first level comprising a plurality of first single crystal transistors, contacts, and a first metal layer,
wherein a portion of said first single crystal transistors are interconnected,
wherein said interconnected comprises said first metal layer and said contacts, and
wherein said portion of said first single crystal transistors are interconnected forms memory control circuits;
a second level overlaying said first level, said second level comprising a plurality of second transistors;
a third level overlaying said second level, said third level comprising a plurality of third transistors;
a fourth level overlaying said third level, said fourth level comprising a plurality of fourth transistors;
a second metal layer overlaying said fourth level; and
a memory cell,
wherein said plurality of second transistors are aligned to said plurality of first transistors with a less than 40 nm alignment error,
wherein at least one of said plurality of second transistors comprises a source, a channel, and a drain,
wherein said source, said channel, and said drain have the same dopant type,
wherein said second metal comprises bit lines,
wherein said plurality of second transistors each comprise a region of oxide isolation,
wherein said oxide isolation has a leakage current of less than one picoamp per micron at a device power supply voltage of 1.0 and at 25° C.,
wherein at least one of said plurality of third transistors comprise polysilicon,
wherein one of said plurality of second transistors is self-aligned to at least one of said third transistors,
wherein said memory cell comprises at least one of said plurality of third transistors,
wherein at least one of said plurality of second transistors at least partially overlays at least a portion of said memory control circuits, and
wherein at least one of said memory control circuits is designed to control said memory cell.
2. The 3D semiconductor device according to claim 1 , further comprising:
a connective path,
wherein said connective path connects from at least one of said plurality of second transistors to at least one of said plurality of first transistors,
wherein said connective path comprises a through-layer via, and
wherein said through-layer via has a bottom diameter less of than 400 nm.
3. The 3D semiconductor device according to claim 1 ,
wherein processing of said first transistors accounts for the thermal processing of said second transistors by adjusting the thermal budget of said first level accordingly.
4. The 3D semiconductor device according to claim 1 , further comprising:
a NAND type non-volatile memory array,
wherein said NAND type non-volatile memory array comprises said memory cell.
5. The 3D semiconductor device according to claim 1 ,
wherein said plurality of second transistors are circumscribed by a first guard ring,
wherein said plurality of third transistors are circumscribed by a second guard ring, and
wherein said second guard ring overlays said first guard ring.
6. The 3D semiconductor device according to claim 1 , further comprising:
a first set of external connections underlying said first single crystal layer; and
a second set of external connections overlying said metal layer,
wherein said first set of external connections connect said device to a first external device,
wherein said second set of external connections connect said device to a second external device, and
wherein said first set of external connections comprises a through silicon via (TSV).
7. The 3D semiconductor device according to claim 1 ,
wherein said fourth level comprises a region of transparent material so to enable alignment of said second metal layer to said first metal layer.
8. A 3D semiconductor device, the device comprising:
a first level comprising a plurality of first single crystal transistors, contacts, and a first metal layer,
wherein a portion of said first single crystal transistors are interconnected,
wherein said interconnected comprises said first metal layer and said contacts, and
wherein said portion of said first single crystal transistors are interconnected forms memory control circuits;
a second level overlaying said first level, said second level comprising a plurality of second transistors;
a third level overlaying said second level, said third level comprising a plurality of third transistors;
a fourth level overlaying said third level, said fourth level comprising a plurality of fourth transistors;
a second metal layer overlaying said fourth level;
a fifth level comprising single crystal, said fifth level overlaying said second metal layer; and
a memory cell,
wherein said plurality of second transistors are aligned to said plurality of first transistors with a less than 40 nm alignment error,
wherein at least one of said plurality of second transistors comprises a source, a channel, and a drain,
wherein said source, said channel, and said drain have the same dopant type,
wherein said second metal comprises bit lines,
wherein said plurality of second transistors each comprise a region of oxide isolation,
wherein said oxide isolation has a leakage current of less than one picoamp per micron at a device power supply voltage of 1.0 and at 25° C.,
wherein at least one of said plurality of third transistors comprise polysilicon,
wherein one of said plurality of second transistors is self-aligned to at least one of said third transistors,
wherein said memory cell comprises at least one of said plurality of third transistors.
9. The 3D semiconductor device according to claim 8 , further comprising:
a connective path,
wherein said connective path connects from at least one of said plurality of second transistors to at least one of said plurality of first transistors,
wherein said connective path comprises a through-layer via, and
wherein said through-layer via has a bottom diameter less of than 400 nm.
10. The 3D semiconductor device according to claim 8 ,
wherein said fourth level comprises a region of transparent material so to enable alignment through said region to alignment marks.
11. The 3D semiconductor device according to claim 8 , further comprising:
a NAND type non-volatile memory array,
wherein said NAND type non-volatile memory array comprises said memory cell.
12. The 3D semiconductor device according to claim 8 ,
wherein said plurality of second transistors are circumscribed by a first guard ring,
wherein said plurality of third transistors are circumscribed by a second guard ring, and
wherein said second guard ring overlays said first guard ring.
13. The 3D semiconductor device according to claim 8 ,
wherein at least one of said plurality of second transistors at least partially overlays at least one of said plurality of first transistors.
14. The 3D semiconductor device according to claim 8 , further comprising:
a first set of external connections underlying said first single crystal layer; and
a second set of external connections overlying said metal layer,
wherein said first set of external connections connect said device to a first external device,
wherein said second set of external connections connect said device to a second external device, and
wherein said first set of external connections comprises a through silicon via (TSV).
15. A 3D semiconductor device, the device comprising:
a first level comprising a plurality of first single crystal transistors, contacts, and a first metal layer,
wherein a portion of said first single crystal transistors are interconnected,
wherein said interconnected comprises said first metal layer and said contacts, and
wherein said portion of said first single crystal transistors are interconnected forms memory control circuits;
a second level overlaying said first level, said second level comprising a plurality of second transistors;
a third level overlaying said second level, said third level comprising a plurality of third transistors;
a fourth level overlaying said third level, said fourth level comprising a plurality of fourth transistors;
a second metal layer overlaying said fourth level; and
a fifth level comprising single crystal overlaying said second metal layer;
wherein said plurality of second transistors are aligned to said plurality of first transistors with a less than 40 nm alignment error,
wherein at least one of said plurality of second transistors comprises a source, a channel, and a drain,
wherein said source, said channel, and said drain have the same dopant type,
wherein said second metal comprises bit lines,
wherein said plurality of second transistors each comprise a region of oxide isolation,
wherein said oxide isolation has a leakage current of less than one picoamp per micron at a device power supply voltage of 1.0 and at 25° C.
16. The 3D semiconductor device according to claim 15 ,
wherein said plurality of second transistors are circumscribed by a first guard ring,
wherein said plurality of third transistors are circumscribed by a second guard ring, and
wherein said second guard ring overlays said first guard ring.
17. The 3D semiconductor device according to claim 15 ,
wherein at least one of said plurality of third transistors comprises a source, a channel, and a drain,
wherein said source, said channel, and said drain have the same dopant type.
18. The 3D semiconductor device according to claim 15 ,
wherein said fourth level comprises a region of transparent material so to enable alignment through said region to alignment marks.
19. The 3D semiconductor device according to claim 15 , further comprising:
a first set of external connections underlying said first single crystal layer; and
a second set of external connections overlying said second metal layer,
wherein said first set of external connections connects said device to a first external device,
wherein said second set of external connections connects said device to a second external device, and
wherein said first set of external connections comprises a through silicon via (TSV).
20. The 3D semiconductor device according to claim 15 , further comprising:
a connective path,
wherein said connective path connects from at least one of said plurality of second transistors to at least one of said plurality of first transistors,
wherein said connective path comprises a through-layer via, and
wherein said through-layer via has a bottom diameter less of than 400 nm.