Thin-film resistor (TFR) module with top-side interconnects connected to reduced TFR ridges and manufacturing methods
A method for manufacturing a thin film resistor (TFR) module in an integrated circuit (IC) structure is provided. A TFR trench may be formed in an oxide layer. A resistive TFR layer may be deposited over the structure and extending into the trench. Portions of the TFR layer outside the trench may be removed by CMP to define a TFR element including a laterally-extending TFR bottom region and a plurality of TFR ridges extending upwardly from the laterally-extending TFR bottom region. At least one CMP may be performed to remove all or portions of the oxide layer and at least a partial height of the TFR ridges. A pair of spaced-apart metal interconnects may then be formed over opposing end regions of the TFR element, wherein each metal interconnect contacts a respective upwardly-extending TFR ridge, to thereby define a resistor between the metal interconnects via the TFR element.
1. A method for manufacturing a thin film resistor (TFR) module in an integrated circuit (IC) structure, the method comprising:
forming a trench in an integrated circuit structure;
depositing a resistive TFR layer over the integrated circuit structure and extending into the trench;
removing portions of the TFR layer outside the trench to define a TFR element including a laterally-extending TFR bottom region and a plurality of TFR ridges extending upwardly from the laterally-extending TFR bottom region;
performing at least one material removal process to remove at least a partial height of the TFR ridges; and
forming a pair of spaced-apart metal interconnects over opposing end regions of the TFR element by a process including:
depositing a metal layer over the TFR element; and
performing a metal etch to remove portions of the metal layer to thereby define the pair of spaced-apart metal interconnects, wherein the metal etch also removes at least a partial height of at least one TFR ridge uncovered by the metal interconnects,
wherein each metal interconnect contacts a respective upwardly-extending TFR ridge, to thereby define a conductive path between the metal interconnects via the TFR element.
2. The method of claim 1 , wherein the at least one material removal process forms a mound-shaped structure including the TFR element; and
wherein forming the pair of spaced-apart metal interconnects comprises forming the pair of metal interconnects on sloping upper surfaces of the mound-shaped structure.
3. The method of claim 1 , wherein the spaced-apart metal interconnects comprise aluminum.
4. The method of claim 1 , wherein the spaced-apart metal interconnects are formed in a metal 1 layer.
5. The method of claim 1 , wherein the TFR layer comprises SiCr or SiCCr.
6. The method of claim 1 , further comprising:
prior to removing portions of the TFR layer outside the trench, depositing a nitride cap layer over the TFR layer and extending into the trench; and
wherein the step of removing portions of the TFR layer outside the trench to define the TFR element also removes portions of the nitride cap layer outside the trench.
7. The method of claim 1 , further comprising, prior to forming the metal interconnects, annealing the TFR layer or TFR element to provide a selected temperature coefficient of resistance (TCR).
8. The method of claim 1 , wherein forming a trench in an integrated circuit structure comprises:
forming an oxide layer over a dielectric region; and
forming a trench in the oxide layer.
9. The method of claim 1 , wherein the material removal process comprises a chemical mechanical planarization (CMP).
10. The method of claim 1 , wherein removing portions of the TFR layer outside the trench to define the TFR element comprises performing a chemical mechanical planarization (CMP).
11. A thin film resistor (TFR), comprising:
a resistive TFR element including a laterally-extending TFR bottom region and a pair of TFR ridges extending upwardly from first and second lateral sides of the laterally-extending TFR bottom region;
a non-conductive structure adjacent each upwardly-extending TFR ridge, each non-conductive structure defining a sloping top surface that slopes downwardly in a direction away from a center of the TFR element, the sloping top surface being non-parallel and non-perpendicular with respect to the laterally-extending TFR bottom region;
a pair of metal interconnects formed over the TFR element, wherein each metal interconnect:
is positioned over a respective non-conductive structure adjacent a respective upwardly-extending TFR ridge;
extends obliquely over the sloping top surface of the respective non-conductive structure, such that each metal interconnect extends non-parallel and non-perpendicular with respect to the laterally-extending TFR bottom region; and
contacts the respective upwardly-extending TFR ridge;
such that a conductive path is defined between the metal interconnects via the upwardly-extending TFR ridges and the laterally-extending TFR bottom region.
12. The thin film resistor of claim 11 , wherein the metal interconnects comprise aluminum.
13. The thin film resistor of claim 11 , wherein the TFR element comprises a damascene-type element formed in a trench.
14. The thin film resistor of claim 11 , wherein the metal interconnects are formed in a metal 1 layer.
15. The thin film resistor of claim 11 , wherein the TFR element comprises SiCr or SiCCr.
16. The thin film resistor of claim 11 , wherein the non-conductive structure adjacent each upwardly-extending TFR ridge comprises a nitride region located laterally between the pair of upwardly-extending TFR ridges and over the laterally-extending TFR bottom region.
17. The thin film resistor of claim 11 , wherein the non-conductive structure adjacent each upwardly-extending TFR ridge comprises an oxide region on a first side of the respective upwardly-extending TFR ridge and a nitride region on a second side of the respective upwardly-extending TFR ridge.
18. A method for manufacturing a thin film resistor (TFR) module in an integrated circuit (IC) structure, the method comprising:
forming a trench in an integrated circuit structure;
depositing a resistive TFR layer over the integrated circuit structure and extending into the trench;
depositing a nitride cap layer over the TFR layer, the nitride layer extending downwardly into the trench to cover a portion of the TFR layer in the trench and also extending outside the trench to cover portions of the TFR layer outside the trench;
removing the portions of the nitride cap layer outside the trench and the portions of the TFR layer outside the trench to define a TFR element including a laterally-extending TFR bottom region and a plurality of TFR ridges extending upwardly from the laterally-extending TFR bottom region;
performing at least one material removal process to remove at least a partial height of the TFR ridges; and
forming a pair of spaced-apart metal interconnects over opposing end regions of the TFR element, wherein each metal interconnect contacts a respective upwardly-extending TFR ridge, to thereby define a conductive path between the metal interconnects via the TFR element.
19. The method of claim 18 , wherein the removing step leaves at least a partial thickness of the portion of the nitride layer in the trench covering the portion of the TFR layer in the trench.