IP Library Granted Patent US 10,566,560
Granted Patent B2
US 10,566,560 · App. 16/039,994 · Granted Feb 18, 2020

Image pickup device and electronic apparatus

Inventor: Yohei Hirose (Tokyo, JP)
Assignee: Sony Semiconductor Solutions Corporation
H01L51/445H01L27/307H01L51/441H01L51/448H01L2251/301H01L2251/303Y02E10/549
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,566,560
App. No.
16/039,994
Granted
Feb 18, 2020
Kind
B2
Abstract

An image pickup device includes: a first electrode film; an organic photoelectric conversion film; a second electrode film; and a metal wiring film electrically connected to the second electrode film, the first electrode film, the organic photoelectric conversion film, and the second electrode film all provided on a substrate in this order, and the metal wiring film coating an entire side of the organic photoelectric conversion film.

Claims (29)

1. An image pickup device comprising:

a first electrode film;

an organic photoelectric conversion film;

a second electrode film; and

a metal wiring film electrically connected to the second electrode film,

the first electrode film, the organic photoelectric conversion film, and the second electrode film all provided on a substrate in this order, and

the metal wiring film coating an entire side of the organic photoelectric conversion film.

2. The image pickup device according to claim 1 , wherein

the metal wiring film is made of W, Al, Ti, Mo, Ta, Cu, an alloy containing one or more thereof, or a material containing one or more thereof and Si.

3. The image pickup device according to claim 2 , further comprising a protective film coating the organic photoelectric conversion film and the second electrode film, the protective film formed between the organic photoelectric conversion film and the metal wiring film.

4. The image pickup device according to claim 3 , wherein

the protective film is a silicon nitride film, a silicon nitrogen oxide film, an aluminum oxide film, or a stacked film containing two or more thereof.

5. The image pickup device according to claim 3 , wherein

the protective film includes a first protective film and second protective film, the first protective film coating an upper surface of the second electrode film, the second protective film coating the organic photoelectric conversion film and the first protective film.

6. The image pickup device according to claim 3 , wherein

the protective film has one or more openings positioned opposite the second electrode film, and

the metal wiring film makes contact with the second electrode film via the one or more openings.

7. The image pickup device according to claim 3 , wherein

the first electrode film includes a plurality of pixel electrodes provided in respective pixels,

the organic photoelectric conversion film is a sheet-shaped film provided to be shared by all the pixels, and

the metal wiring film coats an entire side of the sheet-shaped film.

8. The image pickup device according to claim 3 , wherein

the first electrode film includes a plurality of pixel electrodes provided in respective pixels,

the organic photoelectric conversion film includes a plurality of island-shaped films provided in the respective pixels, and

the metal wiring film coats an entire side of each of the island-shaped films.

9. An electronic apparatus comprising:

an image pickup device; and

a signal processing circuit subjecting a pixel signal output from the image pickup device to a predetermined process,

the image pickup device including a first electrode film, an organic photoelectric conversion film, and a second electrode film which are all provided on a substrate in this order, and a metal wiring film electrically connected to the second electrode film, the metal wiring film coating an entire side of the organic photoelectric conversion film.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 19, 2018
From: SONY CORPORATION
To: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Reel/Frame 046403/0060 →
Priority Claims (1)
JP 2013-138262 · Jul 1, 2013 · national
Continuity (4)
Continuation 15273518 · Sep 22, 2016
Continuation 14942715 · Nov 16, 2015
Continuation 14313488 · Jun 24, 2014
Related Publication 20180323391A1 · Nov 8, 2018
Cited By (1)
US 12,249,675