Nanowire with sacrificial top wire
Methods for forming field effect transistors include forming a stack of nanowires of alternating layers of channel material and sacrificial material, with a top layer of the sacrificial material forming a top layer of the stack. A dummy gate is formed over the stack. Channel material and sacrificial material of the stack of nanowires is etched away outside of a region covered by the dummy gate. The sacrificial material is then selectively etched to form recesses in the sacrificial material layers. Spacers are formed in the recesses in the sacrificial material layers. The dummy gate is etched away with an anisotropic etch. The sacrificial material is etched away to expose the layers of the channel material. A gate stack is formed over and around the layers of the channel material.
1. A method for forming a field effect transistor, comprising:
forming a stack of nanowires of alternating layers of channel material and sacrificial material, with a top layer of the sacrificial material forming a top layer of the stack;
forming a dummy gate over the stack;
etching away channel material and sacrificial material of the stack of nanowires outside of a region covered by the dummy gate, then selectively etching the sacrificial material to form recesses in the sacrificial material layers;
forming spacers in the recesses in the sacrificial material layers after the recesses are formed, including a top pair of the spacers that each have a side that faces the dummy gate, where the side includes a curved lower portion in a respective one of the recesses and a straight upper portion, outside the respective one of the recesses, on a sidewall of the dummy gate;
etching away the dummy gate with an anisotropic etch;
etching away the sacrificial material to expose the layers of the channel material; and
forming a gate stack over and around the layers of the channel material.
2. The method of claim 1 , further comprising forming merged source and drain regions at respective ends of the layers of the channel material.
3. The method of claim 2 , wherein the merged source and drain regions cover the spacers in the recesses in the sacrificial material layers.
4. The method of claim 2 , wherein forming the merged source and drain regions comprises epitaxially growing the source and drain regions from exposed faces of the layers of the channel material.
5. The method of claim 1 , wherein the spacers each have a crescent shape.
6. The method of claim 1 , wherein forming the spacers in the recesses in the sacrificial material layers comprises conformally depositing spacer material and etching away the spacer material outside of the recesses.
7. The method of claim 1 , further comprising:
forming an initial spacer on sidewalls of the dummy gate before etching the channel material and the sacrificial material of the stack of nanowires, such that the channel material and the sacrificial material of the stack of nanowires directly under the initial spacer is not removed; and
etching away the initial spacer before forming the spacers in the recesses of the sacrificial material layers.
8. The method of claim 1 , further comprising forming lateral dummy gates on each side of the dummy gate.
9. The method of claim 8 , wherein etching the channel material and the sacrificial material of the stack of nanowires etches away only the channel material and the sacrificial material of the stack of nanowires not covered by the dummy gate and the lateral dummy gates.
10. The method of claim 8 , further comprising forming vestigial source and drain regions at ends of the layers of the channel material in regions covered by the lateral dummy gates.
11. The method of claim 1 , wherein the nanowires each have a cross-sectional width that is less than twice a cross-sectional height.
12. A method for forming a field effect transistor, comprising:
forming a stack of nanowires of alternating layers of channel material and sacrificial material, with a top layer of the sacrificial material forming a top layer of the stack;
forming a dummy gate over the stack;
etching away channel material and sacrificial material of the stack of nanowires outside of a region covered by the dummy gate, then selectively etching the sacrificial material to form recesses in the sacrificial material layers;
forming crescent-shaped spacers in the recesses in the sacrificial material layers after the recesses are formed, with topmost ones of the crescent-shaped spacers each having a side that faces the dummy gate, where the side includes a crescent-shaped lower portion in a respective one of the recesses and a straight vertical upper portion, outside the respective one of the recesses, on a sidewall of the dummy gate;
etching away the dummy gate with an anisotropic etch;
etching away the sacrificial material to expose the layers of the channel material; and
forming a gate stack over and around the layers of the channel material.
13. The method of claim 12 , further comprising forming merged source and drain regions at respective ends of the layers of the channel material.
14. The method of claim 13 , wherein the merged source and drain regions cover the spacers in the recesses in the sacrificial material layers.
15. The method of claim 13 , wherein forming the merged source and drain regions comprises epitaxially growing the source and drain regions from exposed faces of the layers of the channel material.
16. The method of claim 12 , wherein forming the crescent-shaped spacers in the recesses in the sacrificial material layers comprises conformally depositing spacer material and etching away the spacer material outside of the recesses.
17. The method of claim 12 , further comprising:
forming an initial spacer on sidewalls of the dummy gate before etching the channel material and the sacrificial material of the stack of nanowires, such that the channel material and the sacrificial material of the stack of nanowires directly under the initial spacer is not removed; and
etching away the initial spacer before forming the crescent-shaped spacers in the recesses of the sacrificial material layers.
18. The method of claim 12 , further comprising forming lateral dummy gates on each side of the dummy gate.
19. The method of claim 18 , wherein etching the channel material and the sacrificial material of the stack of nanowires etches away only the channel material and the sacrificial material of the stack of nanowires not covered by the dummy gate and the lateral dummy gates.
20. The method of claim 18 , further comprising forming vestigial source and drain regions at ends of the layers of the channel material in regions covered by the lateral dummy gates.