Semiconductor device
A semiconductor device is described, which includes a first transistor, a second transistor, and a capacitor. The second transistor and the capacitor are provided over the first transistor so as to overlap with a gate of the first transistor. A semiconductor layer of the second transistor and a dielectric layer of the capacitor are directly connected to the gate of the first transistor. The second transistor is a vertical transistor, where its channel direction is perpendicular to an upper surface of a semiconductor layer of the first transistor.
1. A semiconductor device comprising:
a single crystal semiconductor substrate;
a first insulating film over the single crystal semiconductor substrate;
a first conductive film over the first insulating film;
a second insulating film over the first conductive film;
a second conductive film over the second insulating film;
a semiconductor film over the second conductive film, the semiconductor film being electrically connected to the second conductive film;
a third conductive film over the second conductive film, the third conductive film including an opening; and
a third insulating film over the second conductive film,
wherein:
the semiconductor film is in the opening, and
at least part of the third insulating film is in the opening and between the semiconductor film and the third conductive film.
2. The semiconductor device according to claim 1 , wherein:
the third conductive film is a first gate electrode,
the third insulating film is a first gate insulating film, and
the semiconductor film, the third conductive film, and the third insulating film form a first transistor.
3. The semiconductor device according to claim 2 , wherein:
the first insulating film is a second gate insulating film,
the first conductive film is a second gate electrode,
the single crystal semiconductor substrate, the first insulating film, and the first conductive film form a second transistor, and
the second transistor is electrically connected to the first transistor.
4. The semiconductor device according to claim 1 , wherein the semiconductor film includes an oxide semiconductor.
5. The semiconductor device according to claim 1 , wherein the third conductive film includes polycrystalline silicon containing a conductive material.
6. The semiconductor device according to claim 1 , wherein the third insulating film is a stack of layers containing silicon oxide and silicon nitride.
7. A semiconductor device comprising:
a single crystal semiconductor substrate;
a first insulating film over the single crystal semiconductor substrate;
a first conductive film over the first insulating film;
a second insulating film over the first conductive film;
a second conductive film over the second insulating film;
a third insulating film over the second conductive film;
a third conductive film over the third insulating film;
a semiconductor film over the third conductive film, the semiconductor film being electrically connected to the third conductive film;
a fourth conductive film over the third conductive film, the fourth conductive film including an opening; and
a fourth insulating film over the third conductive film,
wherein:
the semiconductor film is in the opening, and
at least part of the fourth insulating film is in the opening and between the semiconductor film and the fourth conductive film.
8. The semiconductor device according to claim 7 , wherein:
the fourth conductive film is a first gate electrode,
the fourth insulating film is a first gate insulating film, and
the semiconductor film, the fourth conductive film, and the fourth insulating film form a first transistor.
9. The semiconductor device according to claim 8 , wherein:
the first insulating film is a second gate insulating film,
the first conductive film is a second gate electrode,
the single crystal semiconductor substrate, the first insulating film, and the first conductive film form a second transistor, and
the second transistor is electrically connected to the first transistor.
10. The semiconductor device according to claim 7 , wherein the semiconductor film includes an oxide semiconductor.
11. The semiconductor device according to claim 7 , wherein the third conductive film includes polycrystalline silicon containing a conductive material.
12. The semiconductor device according to claim 7 , wherein the third insulating film is a stack of layers containing silicon oxide and silicon nitride.
13. The semiconductor device according to claim 7 , wherein the second conductive film is electrically connected to the single crystal semiconductor substrate.
14. A semiconductor device comprising:
a single crystal semiconductor substrate;
a first insulating film over the single crystal semiconductor substrate;
a first conductive film over the first insulating film;
a second insulating film over the first conductive film;
a second conductive film over the second insulating film;
a first semiconductor film over the second conductive film, the first semiconductor film being electrically connected to the second conductive film;
a third conductive film over the second conductive film, the third conductive film including an opening;
a third insulating film over the second conductive film;
a second semiconductor film over the third conductive film; and
a fourth conductive film over the second semiconductor film, the fourth conductive film being electrically connected to the second semiconductor film,
wherein:
the first semiconductor film is in the opening, and
at least part of the third insulating film is in the opening and between the first semiconductor film and the third conductive film.
15. The semiconductor device according to claim 14 , wherein:
the third conductive film is a first gate electrode,
the third insulating film is a first gate insulating film, and
the first semiconductor film, the third conductive film, and the third insulating film form a first transistor.
16. The semiconductor device according to claim 15 , wherein:
the first insulating film is a second gate insulating film,
the first conductive film is a second gate electrode,
the single crystal semiconductor substrate, the first insulating film, and the first conductive film form a second transistor, and
the second transistor is electrically connected to the first transistor.
17. The semiconductor device according to claim 14 , wherein the first semiconductor film and the second semiconductor film each include an oxide semiconductor.
18. The semiconductor device according to claim 14 , wherein the third conductive film includes polycrystalline silicon containing a conductive material.
19. The semiconductor device according to claim 14 , wherein the third insulating film is a stack of layers containing silicon oxide and silicon nitride.
20. The semiconductor device according to claim 14 , wherein the second semiconductor film is part of a third transistor.