Patterning of high density small feature size pillar structures
A method for forming an array of very small pillar structures having a very small feature size that is smaller than the resolution limit of photolithographic process available for patterning such structures. The method involves forming an array of silicon pillar structures over a layer of material that will ultimately form the pillar structures. The array of silicon pillar structures is repeatedly oxidized to form a layer of silicon oxide at an outer surface of the silicon pillar structures and then etched to remove the outer layer of oxide, thereby reducing the features size (i.e. diameter) of the silicon pillar structure. A final oxidation process entirely oxidizes the remaining silicon pillar structures, leaving an array of small silicon oxide pillar structures that can be used as a mask for patterning underlying layers, including the underlying pillar material. The process is especially useful for forming an array of magnetic memory pillars.
1. A method for manufacturing an array of pillar structures, the method comprising:
depositing a pillar material over a substrate;
depositing a layer of silicon over the pillar material;
forming a mask structure over the layer of silicon, the mask structure including an array of patterned features;
performing material removal process to transfer the pattern of the mask structure onto the underlying layer of silicon to form an array of silicon pillar structures;
oxidizing the silicon pillar structures to form an outer oxide layer on the silicon pillar structure;
etching the silicon pillar structures to remove the oxide layer, thereby reducing the size of the silicon pillar structure; and
using the reduced size pillar structure as a mask to pattern the underlying pillar material.
2. The method as in claim 1 , wherein the processes of oxidizing the silicon pillar structures and performing an etching to remove the oxide layer is repeatedly performed until the final oxidation oxidizes the entire silicon pillar structure, leaving an array of silicon oxide structures.
3. The method as in claim 2 , using the array of silicon oxide structures as a mask to form the pillar material layer into an array of pillar structures.
4. The method as in claim 3 , wherein the array of pillar structures is formed by performing an etching process to remove portions of the pillar material.
5. The method as in claim 1 , wherein the pillar material comprises a plurality of layers arranged to form a magnetic memory element.
6. The method as in claim 1 , wherein the pillar material comprises a plurality of layers arranged to form a magnetic tunnel junction structure.