Substrate processing apparatus and substrate processing method
A resist film including a metallic component and a photosensitive material is formed on a surface of a substrate, and then a peripheral portion of the resist film on the substrate is irradiated with light by an edge exposer. Subsequently, development processing is performed with a development liquid from a nozzle on the exposed portion of the resist film. Thus, the part of the resist film formed on the peripheral portion of the substrate is removed. Thereafter, exposure processing is performed on the substrate in an exposure device, so that an exposure pattern is formed on the resist film. Then, a development liquid is supplied to the exposed substrate in a development processing unit, so that development processing is performed on the resist film.
1. A substrate processing apparatus arranged to be adjacent to an exposure device that performs exposure processing on a substrate, comprising:
a film formation unit that forms a metal-containing photosensitive film including a metallic component and a photosensitive material on a surface to be processed of the substrate;
an edge exposer that irradiates a peripheral portion of the substrate after formation of the metal-containing photosensitive film with light;
an edge development processor that performs development processing on a part of the metal-containing photosensitive film that has been irradiated with light by the edge exposer by supplying a development liquid to the peripheral portion of the substrate;
a transport mechanism that transports the substrate after the development processing by the edge development processor to the exposure device; and
a development processing unit that performs development processing on the metal-containing photosensitive film by supplying a development liquid to the substrate after the exposure processing in the exposure device,
wherein the edge development processor performs the development processing on the part of the metal-containing photosensitive film that has been irradiated with light by the edge exposer after the irradiation of the peripheral portion of the substrate with light by the edge exposer and before the exposure processing in the exposer.
2. The substrate processing apparatus according to claim 1 , wherein
the film formation unit includes
a rotation holder that holds and rotates the substrate, and
a liquid supplier that supplies a coating liquid for the metal-containing photosensitive film to the surface to be processed of the substrate rotated by the rotation holder, and
the edge exposer is configured to irradiate the peripheral portion of the substrate rotated by the rotation holder with light after supply of the coating liquid by the liquid supplier.
3. The substrate processing apparatus according to claim 2 , wherein
the film formation unit further includes a first removal liquid supplier that supplies a first removal liquid for dissolving the coating liquid to the peripheral portion of the substrate rotated by the rotation holder after supply of the coating liquid by the liquid supplier.
4. The substrate processing apparatus according to claim 2 , wherein
the edge development processor is configured to discharge the development liquid to the peripheral portion of the substrate that is rotated by the rotation holder after irradiation with light by the edge exposer.
5. The substrate processing apparatus according to claim 2 , further comprising a heater configured to heat the peripheral portion of the substrate rotated by the rotation holder after irradiation with light by the edge exposer and before the development processing by the edge development processor.
6. The substrate processing apparatus according to claim 1 , wherein
the edge development processor is provided in the development processing unit.
7. The substrate processing apparatus according to claim 6 , wherein
the edge development processor and the development processing unit have a common development liquid nozzle that can discharge the development liquid.
8. The substrate processing apparatus according to claim 1 , further comprising a thermal processing unit that performs heating processing on the substrate after irradiation with light by the edge exposer and before development by the edge development processor.
9. The substrate processing apparatus according to claim 1 , further comprising a second removal liquid supplier that supplies a second removal liquid for dissolving a metallic component to the peripheral portion of the substrate after the development processing by the edge development processor.
10. A substrate processing method comprising:
forming a metal-containing photosensitive film including a metallic component and a photosensitive material on a surface to be processed of a substrate by a film formation unit;
irradiating a peripheral portion of the substrate after formation of the metal-containing photosensitive film with light by an edge exposer;
performing development processing on a part of the metal-containing photosensitive film that has been irradiated with light by the edge exposer by supplying a development liquid to the peripheral portion of the substrate by an edge development processor;
transporting the substrate after the development processing by the edge development processor to an exposure device; and
performing development processing on the metal-containing photosensitive film by supplying a development liquid to the substrate in a development processing unit after exposure processing in the exposure device,
wherein the performing of the development processing on the part of the metal-containing photosensitive film that has been irradiated with light by the edge exposer includes performing the development processing on the part of the metal-containing photosensitive film that has been irradiated with light by the edge exposer after the irradiation of the peripheral portion of the substrate with light by the edge exposer and before the exposure processing in the exposer.
11. The substrate processing method according to claim 10 , wherein
the forming of the metal-containing photosensitive film includes supplying a coating liquid for the metal-containing photosensitive film by a liquid supplier to the surface to be processed of the substrate rotated by a rotation holder, and
the irradiating of the peripheral portion of the substrate with light includes irradiating the peripheral portion of the substrate rotated by the rotation holder with light by the edge exposer after supply of the coating liquid by the liquid supplier.
12. The substrate processing method according to claim 11 , further including supplying a first removal liquid for dissolving the coating liquid by a first removal liquid supplier in the film formation unit to the peripheral portion of the substrate rotated by the rotation holder after supply of the coating liquid by the liquid supplier.
13. The substrate processing method according to claim 11 , wherein the performing development processing on the part of the metal-containing photosensitive film includes discharging the development liquid to the peripheral portion of the substrate rotated by the rotation holder after irradiation with light by the edge exposer.
14. The substrate processing method according to claim 11 , further including heating the peripheral portion of the substrate rotated by the rotation holder after irradiation with light by the edge exposer and before the development processing by the edge development processor.
15. The substrate processing method according to claim 10 , wherein
the edge development processor is provided in the development processing unit, and
the performing development processing on the part of the metal-containing photosensitive film includes supplying the development liquid to the peripheral portion of the substrate by the edge development processor that is provided in the development processing unit.
16. The substrate processing method according to claim 15 , wherein
the edge development processor and the development processing unit have a common development liquid nozzle that can discharge the development liquid,
the performing development processing on the part of the metal-containing photosensitive film includes supplying the development liquid to the peripheral portion of the substrate by the common development liquid nozzle, and
the performing development processing on the metal-containing photosensitive film includes supplying the development liquid to the substrate by the common development liquid nozzle after the exposure processing by the exposure device.
17. The substrate processing method according to claim 10 , further including performing heating processing on the substrate by a thermal processing unit after irradiation with light by the edge exposer and before the development processing by the edge development processor.
18. The substrate processing method according to claim 10 , further including supplying a second removal liquid for dissolving a metallic component to the peripheral portion of the substrate by a second removal liquid supplier after the development processing by the edge development processor.