Cleaning systems and methods for semiconductor substrate storage articles
Provided are methods and systems for cleaning various semiconductor substrate storage articles, in particular, FOUP doors. The FOUP doors and other similar articles often have openings that may get contaminated with cleaning liquids if not covered. The described cleaning system includes contact points for engaging the article and covering these openings. The contact points may be also used for supporting the article and for pressurizing the openings in the article with a gas. The gas may be supplied through one or more contact points. It prevents liquids from getting into the openings if even the openings are not completely sealed. The pressurization may be maintained through the entire wet portion of the cleaning process. The article may be rotated within the cleaning system while cleaning and/or other liquids or gases are dispensed through a set of spraying nozzles. Spraying nozzles may move to enhance cleaning of the article.
1. A method for cleaning a semiconductor container, the method comprising:
loading a container door into a cleaning chamber;
protecting a latch opening of the container door with a contact point, wherein the contact point is configured to channel a gas from a gas inlet to the latch opening;
flowing a liquid toward the container door while supplying a gas flow into the gas inlet of the contact point such that the gas flow is channeled by the contact point towards the latch opening.
2. The method as in claim 1 , further comprising cleaning a container body including flowing a liquid toward the container body while protecting an opening of the container body with a gas flow.
3. The method as in claim 1 , further comprising rotating the container door.
4. The method as in claim 1 , further comprising aligning and engaging the contact point with the latch opening.
5. The method as in claim 1 , further comprising draining the liquid from the cleaning chamber.
6. The method as in claim 1 , wherein the latch opening comprises a latch element, wherein the latch element is configured to be slidable in the latch opening.
7. The method as in claim 1 , wherein the latch opening comprises a latch element, wherein the latch element is positioned in the latch opening with a gap, wherein a length of the latch element is at least 10× greater than the gap.
8. The method as in claim 1 , wherein the latch opening comprises a latch element, wherein the latch element is positioned in the latch opening with a gap, wherein a length of the latch element is at least 20× greater than the gap.
9. The method as in claim 1 , wherein protecting the latch opening comprises sealing the latch opening with the contact point.
10. The method as in claim 1 , wherein protecting the latch opening comprises positioning the contact point adjacent to the latch opening so that gas from the gas inlet is directed towards the latch opening.
11. The method as in claim 1 , wherein protecting the latch opening comprises pressurizing the contact point with the gas flow.
12. A method for cleaning a semiconductor container, the method comprising:
loading a container door into a cleaning chamber;
protecting a latch opening of the container door with a contact point, wherein the contact point has a configuration effecting gas channeling from a gas inlet to the latch opening;
flowing a liquid toward the container door while supplying a gas flow into the gas inlet of the contact point such that the gas flow is channeled by the contact point towards the latch opening.
13. The method as in claim 12 , further comprising cleaning a container body including flowing a liquid toward the container body while protecting an opening of the container body with a gas flow.
14. The method as in claim 12 , further comprising rotating the container door.
15. The method as in claim 12 , further comprising aligning and engaging the contact point with the latch opening.
16. The method as in claim 12 , further comprising draining the liquid from the cleaning chamber.
17. The method as in claim 12 , wherein the latch opening comprises a latch element, wherein the latch element is configured to be slidable in the latch opening.
18. The method as in claim 12 , wherein the latch opening comprises a latch element, wherein the latch element is positioned in the latch opening with a gap, wherein a length of the latch element is at least 10× greater than the gap.
19. The method as in claim 12 , wherein protecting the latch opening comprises sealing the latch opening with the contact point.
20. The method as in claim 12 , wherein protecting the latch opening comprises positioning the contact point adjacent to the latch opening so that gas from the gas inlet is directed towards the latch opening.