Dedicated termination dies for memory systems
An apparatus includes a controller die and a group of dies that communicate with each other via a transmission line. Less than all of the dies of the group includes a respective on-die termination resistance circuit coupled to the transmission line. In some embodiments, one of the dies that includes an on-die termination resistance circuit is an end die of the group. In particular embodiments, the end die is the only die of the group that includes an on-die termination resistance circuit coupled to the transmission line. Transmission frequencies or data rates may be increased without degrading signal quality by removing capacitance associated with on-die termination resistance circuits from at least one of the dies of the group.
1. An apparatus comprising:
a transmission line; and
a group of dies coupled to the transmission line, wherein the group of dies comprises:
a first die configured with an on-die termination resistance circuit coupled to the transmission line, wherein the first die is not configured to store data; and
a second die configured without any on-die termination resistance circuits coupled to the transmission line.
2. The apparatus of claim 1 , wherein none of the other dies of the group, except the first die, comprises a respective on-die termination resistance circuit coupled to the transmission line.
3. The apparatus of claim 1 , wherein the first die comprises an end die of the group.
4. The apparatus of claim 1 , wherein the group of dies is coupled to the transmission line via a wire bond portion of the transmission line.
5. The apparatus of claim 1 , wherein the group of dies is configured as a die stack.
6. The apparatus of claim 5 , wherein the die stack comprises a staircase stack.
7. The apparatus of claim 1 , wherein the group of dies is configured to communicate over the transmission line at a predetermined high frequency and at a predetermined low frequency, and wherein the on-die termination resistance circuit is configured to:
set an associated resistance at a low level when the group of dies communicates over the transmission line at the predetermined high frequency; and
set the associated resistance at a high level when the group of dies communicates over the transmission line at the predetermined low frequency.
8. An apparatus comprising:
a controller die;
a group of dies configured to communicate with the controller die via a transmission line, wherein the group of dies comprises a plurality of memory dies and an end die that is not configured to store data,
wherein the end die comprises at least one on-die termination circuit coupled to the transmission line, and
wherein less than all of the group of dies comprises a respective one of the at least one on-die termination circuit.
9. The apparatus of claim 8 , wherein only one of the dies of the group comprises the at least one on-die termination circuit coupled to the transmission line.
10. The apparatus of claim 9 , wherein the only one of the dies comprises the end die.
11. The apparatus of claim 8 , wherein the end die is configured to perform error correction.
12. The apparatus of claim 8 , wherein the end die does not include additional circuitry other than input/output contact pads and on-die resistance circuits.
13. The apparatus of claim 8 , wherein the group of dies is coupled to the transmission line via a wire bond portion of the transmission line.
14. The apparatus of claim 8 , wherein the group of dies is configured as a die stack.
15. The apparatus of claim 14 , wherein the die stack comprises a staircase stack.
16. The apparatus of claim 8 , wherein the controller die and the group of dies are configured to communicate over the transmission line at a predetermined high frequency and at a predetermined low frequency, and wherein the at least one on-die termination resistance circuit is configured to:
set an associated resistance at a low level for communication over the transmission line at the predetermined high frequency; and
set the associated resistance at a high level for communication over the transmission line at the predetermined low frequency.
17. A method comprising:
setting an on-die termination resistance circuit of an end die of a group of dies to a low level, the on-die termination resistance circuit coupled to a transmission line, wherein no other dies of the group of dies comprises a respective on-die termination resistance circuit, and wherein the end die does not contain memory; and
communicating a signal over the transmission line between the group of dies and a controller die with the on-die termination resistance circuit set to the low level.
18. The method of claim 17 , wherein communicating the signal comprises communicating the signal at a predetermined high frequency, and wherein setting the on-die termination resistance circuit to the low level is dependent on communicating the signal at the predetermined high frequency.
19. The method of claim 17 , wherein the signal comprises a first signal, the method further comprises:
setting the on-die termination resistance circuit of the end die to a high level dependent on communicating a second signal over the transmission line at a predetermined low frequency; and
communicating the second signal over the transmission line between the group of dies and the controller die with the on-die termination resistance circuit set to the high level.