IP Library Granted Patent US 10,515,694
Granted Patent B2
US 10,515,694 · App. 16/148,304 · Granted Dec 24, 2019

System and method for storing multibit data in non-volatile memory

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Quick Facts
Patent No.
US 10,515,694
App. No.
16/148,304
Granted
Dec 24, 2019
Kind
B2
Abstract

A method of reading a memory device having a plurality of memory cells by, and a device configured for, reading a first memory cell of the plurality of memory cells to generate a first read current, reading a second memory cell of the plurality of memory cells to generate a second read current, applying a first offset value to the second read current, and then combining the first and second read currents to form a third read current, and then determining a program state using the third read current. Alternately, a first voltage is generated from the first read current, a second voltage is generated from the second read current, whereby the offset value is applied to the second voltage, wherein the first and second voltages are combined to form a third voltage, and then the program state is determined using the third voltage.

Claims (72)

1. A method of reading a memory device having a plurality of memory cells, comprising:

reading a first memory cell of the plurality of memory cells to generate a first read current;

reading a second memory cell of the plurality of memory cells to generate a second read current;

applying a first offset value to the second read current; then

combining the first read current and the second read current having the first offset value to form a third read current; and then

determining a program state using the third read current.

2. The method of claim 1 , wherein the combining comprises adding the first read current and the second read current having the first offset value together.

3. The method of claim 1 , further comprising:

reading a third memory cell of the plurality of memory cells to generate a fourth read current;

applying a second offset value to the fourth read current;

wherein the combining including combining the first read current, the second read current having the first offset value and the fourth read current having the second offset value to form the third read current.

4. The method of claim 3 , wherein the second offset value is different from the first offset value.

5. The method of claim 3 , wherein the combining comprises adding the first read current, the second read current having the first offset value and the fourth read current having the second offset value together.

6. The method of claim 1 , wherein the plurality of memory cells are arranged in an array of rows and columns of the memory cells, wherein each of the columns includes a bit line connected to the memory cells therein, wherein the first memory cell is disposed in a first one of the columns, and wherein the second memory cell is disposed in a second one of the columns different than the first one of the columns.

7. A method of reading a memory device having a plurality of memory cells, comprising:

reading a first memory cell of the plurality of memory cells to generate a first read current;

reading a second memory cell of the plurality of memory cells to generate a second read current;

generating a first voltage from the first read current;

generating a second voltage from the second read current;

applying a first offset value to the second voltage; then combining the first voltage and the second voltage having the first offset value to form a third voltage; and then

determining a program state using the third voltage.

8. The method of claim 7 , wherein the combining comprises adding the first voltage and the second voltage having the first offset value together.

9. The method of claim 7 , further comprising:

reading a third memory cell of the plurality of memory cells to generate a third read current;

generating a fourth voltage from the third read current;

applying a second offset value to the fourth voltage;

wherein the combining including combining the first voltage, the second voltage having the first offset value and the fourth voltage having the second offset value to form the third voltage.

10. The method of claim 9 , wherein the second offset value is different from the first offset value.

11. The method of claim 9 , wherein the combining comprises adding the first voltage, the second voltage having the first offset value and the fourth voltage having the second offset value together.

12. The method of claim 7 , wherein the plurality of memory cells are arranged in an array of rows and columns of the memory cells, wherein each of the columns includes a bit line connected to the memory cells therein, wherein the first memory cell is disposed in a first one of the columns, and wherein the second memory cell is disposed in a second one of the columns different than the first one of the columns.

13. A memory device, comprising: a semiconductor substrate;

a plurality of memory cells formed on the semiconductor substrate; and

circuitry formed on the semiconductor substrate and configured to:

read a first memory cell of the plurality of memory cells to generate a first read current;

read a second memory cell of the plurality of memory cells to generate a second read current;

apply a first offset value to the second read current; then

combine the first read current and the second read current having the first offset value to form a third read current; then

determine a program state using the third read current.

14. The device of claim 13 , wherein the combining comprises adding the first read current and the second read current having the first offset value together.

15. The device of claim 13 , wherein the circuitry is further configured to:

read a third memory cell of the plurality of memory cells to generate a fourth read current;

applying a second offset value to the fourth read current;

wherein the combining including combining the first read current, the second read current having the first offset value and the fourth read current having the second offset value to form the third read current.

16. The device of claim 15 , wherein the second offset value is different from the first offset value.

17. The device of claim 15 , wherein the combining comprises adding the first read current, the second read current having the first offset value and the fourth read current having the second offset value together.

18. The device of claim 13 , wherein:

the plurality of memory cells are arranged in an array of rows and columns of the memory cells;

each of the columns includes a bit line connected to the memory cells therein;

the first memory cell is disposed in a first one of the columns; and

the second memory cell is disposed in a second one of the columns different than the first one of the columns.

19. A memory device, comprising: a semiconductor substrate;

a plurality of memory cells formed on the semiconductor substrate; and

circuitry formed on the semiconductor substrate and configured to:

read a first memory cell of the plurality of memory cells to generate a first read current;

read a second memory cell of the plurality of memory cells to generate a second read current;

generate a first voltage from the first read current;

generate a second voltage from the second read current;

apply a first offset value to the second voltage; then

combine the first voltage and the second voltage having the first offset value to form a third voltage; then

determine a program state using the third voltage.

20. The device of claim 19 , wherein the combining comprises adding the first voltage and the second voltage having the first offset value together.

21. The device of claim 19 , wherein the circuitry is further configured to: read a third memory cell of the plurality of memory cells to generate a third read current;

generate a fourth voltage from the third read current;

apply a second offset value to the fourth voltage;

wherein the combining including combining the first voltage, the second voltage having the first offset value and the fourth voltage having the second offset value to form the third voltage.

22. The device of claim 21 , wherein the second offset value is different from the first offset value.

23. The device of claim 21 , wherein the combining comprises adding the first voltage, the second voltage having the first offset value and the fourth voltage having the second offset value together.

24. The device of claim 19 , wherein:

the plurality of memory cells are arranged in an array of rows and columns of the memory cells;

each of the columns includes a bit line connected to the memory cells therein;

the first memory cell is disposed in a first one of the columns; and

the second memory cell is disposed in a second one of the columns different than the first one of the columns.

Assignments (13)
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0335 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059263/0001 →
GRANT OF SECURITY INTEREST IN PATENT RIGHTS Recorded Nov 19, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 058214/0625 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 052856/0909 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 12, 2019
From: TIWARI, VIPIN; DO, NHAN; TRAN, HIEU VAN
To: SILICON STORAGE TECHNOLOGY, INC.
Reel/Frame 048313/0142 →