Apparatus with a calibration mechanism
An apparatus includes: a ZQ connection configured to provide a reference resistance level for a ZQ calibration process that tunes one or more resistance levels associated with input/output signals at a corresponding one of a plurality of dies; one or more slave dies that are configured to implement the ZQ calibration process or a portion thereof; a master die configured to implement the ZQ calibration process or a portion thereof; and a calibration channel configured to communicate signals between the master die and the one or more of the slave dies for coordinating access to the ZQ connection across the connected dies in implementing the ZQ calibration process, wherein the plurality of dies includes the master die and the one or more slave dies.
1. An apparatus, comprising:
a ZQ pad configured to provide a reference resistance level for a ZQ calibration process that tunes one or more resistance levels associated with input/output signals at a corresponding one of a plurality of dies;
one or more slave dies electrically coupled to the ZQ pad, each of the slave dies configured to implement the ZQ calibration process or a portion thereof, wherein the plurality of dies includes the one or more slave dies;
a master die electrically coupled to the ZQ pad, the master die configured to implement the ZQ calibration process or a portion thereof, wherein the plurality of dies includes the master die; and
a calibration channel electrically coupling the master die and the slave dies, the calibration channel configured to communicate signals between the master die and the one or more slave dies for coordinating access to the ZQ pad across the connected dies in implementing the ZQ calibration process.
2. The apparatus of claim 1 , wherein the calibration channel includes a clock connection configured to communicate a calibration clock between the master die and the one or more slave dies, wherein the calibration clock is configured to coordinate timings associated with implementing the ZQ calibration process.
3. The apparatus of claim 2 , wherein the master die is configured to transmit the calibration clock to the slave dies through the clock connection, wherein the calibration clock is a common clock signal across the master die and the slave dies used to coordinate each die to exclusively access the ZQ pad.
4. The apparatus of claim 2 , wherein each of the slave dies is configured to wait a unique number of clock cycles before implementing the ZQ calibration process or a portion thereof, wherein the unique number of clock cycles is relative to the implement the ZQ calibration process or a portion thereof at the master die.
5. The apparatus of claim 1 , wherein the calibration channel includes an enable connection configured to communicate a calibration enable between the master die and the one or more slave dies, wherein the calibration enable is configured to enable the ZQ calibration process across the master die, one or more of the slave dies, or a combination thereof.
6. The apparatus of claim 5 , wherein the master die is configured to transmit the calibration enable to the slave dies through the enable connection, wherein the calibration enable is a common enable signal across the master die and the slave dies.
7. The apparatus of claim 6 , wherein the master die is configured to control a timing of the calibration enable to generate either a background calibration start or a command calibration start.
8. The apparatus of claim 1 , wherein the calibration channel is configured to communicate signals in one direction from the master die to the slave dies.
9. The apparatus of claim 1 , wherein the memory device comprises a dynamic random-access memory (DRAM).
10. The apparatus of claim 9 , wherein the DRAM is configured according to a Low Power 5 (LP5) specification, a double data rate (DDR) specification, or a combination thereof.