IP Library Granted Patent US 10,903,145
Granted Patent B2
US 10,903,145 · App. 16/177,473 · Granted Jan 26, 2021

Symmetric input circuitry for IC in two-pin package

Inventor: Albert Weiner (Colorado Springs, CO)
Assignee: MICROCHIP TECHNOLOGY INCORPORATED
H01L23/49517H01L27/0248H03K5/2472H03K17/6874H03K17/693H03K19/20
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Quick Facts
Patent No.
US 10,903,145
App. No.
16/177,473
Granted
Jan 26, 2021
Kind
B2
Abstract

An integrated circuit device is disclosed, which integrated circuit device comprises at least a first external contact, a second external contact, and an input stage, connected with the external contacts and being configured to provide an internal operating voltage when an external voltage is applied to the external contacts. To allow easier handling at manufacture, test, assembly, and end use, the internal operating voltage has a predefined polarity, which predefined polarity is independent of the polarity of the external voltage.

Claims (33)

1. An integrated circuit device, comprising at least:

a one-wire interface having a first external contact and a second external contact, which one-wire interface is configured to provide power, data, and ground connections when in use; and

a self-configuring input stage, connected with the external contacts and being configured to provide an internal DC operating voltage when an external DC voltage is applied to the external contacts, which internal DC operating voltage has a predefined polarity, and which predefined polarity is independent of the polarity of the external DC voltage.

2. The integrated circuit device of claim 1 , comprising a maximum of two external contacts.

3. The integrated circuit device of claim 1 , further comprising a housing, which housing is symmetrical with respect to at least one axis of the housing and which housing comprises the one-wire interface.

4. The integrated circuit device of claim 1 , wherein the external contacts are pressure contacts.

5. The integrated circuit device of claim 1 , further comprising an electrostatic protection circuit, connected between the first external contact and the second external contact.

6. The integrated circuit device of claim 1 , wherein the self-configuring input stage comprises a ground switch device, which ground switch device is connected with the first and second external contacts, and which ground switch device is configured to connect one of the first and second external contacts with an internal ground.

7. The integrated circuit device of claim 6 , wherein the ground switch device comprises at least a first and a second ground switch, wherein the first ground switch is arranged to allow a connection of the first external contact with the internal ground and the second ground switch is arranged to allow a connection of the second external contact with the internal ground.

8. The integrated circuit device of claim 7 , wherein the first and second ground switches are cross-coupled, so that a voltage, applied to the first external contact connects the second external contact with the internal ground and a voltage, applied to the second external contact connects the first external contact with the internal ground.

9. The integrated circuit device of claim 7 , wherein the first and second ground switches are semiconductor switches.

10. The integrated circuit device of claim 1 , wherein the self-configuring input stage comprises a supply switch device, which supply switch device is connected with the first and second external contacts, and which supply switch device is configured to connect one of the first and second external contacts with an internal power supply line.

11. The integrated circuit device of claim 10 , wherein the supply switch device comprises at least a first and a second supply switch, wherein the first supply switch is arranged to allow a connection of the first external contact with the internal power supply line and the second supply switch is arranged to allow a connection of the second external contact with the internal power supply line.

12. The integrated circuit device of claim 10 , wherein the first and a second supply switches are semiconductor switches.

13. The integrated circuit device of claim 10 , wherein the supply switch device comprises a latching logic circuit, which latching logic circuit upon receiving a reset signal, determines the polarity of the external voltage, applied to the first and second external contacts during use and provides polarity information to the first and second supply switches.

14. The integrated circuit device of claim 13 , wherein the latching logic circuit maintains the polarity information until receiving a further reset signal.

15. The integrated circuit device of claim 13 , wherein the latching logic circuit maintains the polarity information independent of the external voltage being present at the first and/or second external contacts.

16. The integrated circuit device of claim 13 , wherein the latching logic circuit comprises NAND gates.

17. The integrated circuit device of claim 13 , wherein the latching logic circuit comprises a power-on-reset generator.

18. The integrated circuit device of claim 10 , further comprising processing circuitry, wherein the supply switch device is connected with the processing circuitry to receive a data transmission signal, and wherein the supply switch device disconnects both, the first and the second external contact from the internal power supply line in dependence of the data transmission signal.

19. The integrated circuit device of claim 1 , further comprising processing circuitry, wherein the processing circuitry is configured to transmit data to and receive data from a host device, connected with the integrated circuit device during use via the first and second external contacts.

20. The integrated circuit device of claim 1 , wherein

the self-configuring input stage comprises a ground switch device, which ground switch device is connected with the first and second external contacts, and which ground switch device is configured to connect one of the first and second external contacts with an internal ground; and

wherein the self-configuring input stage comprises a supply switch device, which supply switch device is connected with the first and second external contacts, and which supply switch device is configured to connect one of the first and second external contacts with an internal power supply line.

21. A self-configuring input stage for a one-wire integrated circuit device, the self-configuring input stage being connectable to a one-wire interface having a first external contact and a second external contact, which one-wire interface is configured to provide power, data, and ground connections when in use; wherein the self-configuring input stage being configured to provide a DC operating voltage when an external DC voltage is applied to the external contacts, which DC operating voltage has a predefined polarity, and which predefined polarity is independent of the polarity of the external DC voltage.

22. An integrated circuit device, comprising at least:

a first external contact;

a second external contact; and

an input stage, connected with the external contacts and being configured to provide an internal operating voltage when an external voltage is applied to the external contacts, which internal operating voltage has a predefined polarity, and which predefined polarity is independent of the polarity of the external voltage; wherein

the input stage comprises a supply switch device, which supply switch device is connected with the first and second external contacts, and which supply switch device is configured to connect one of the first and second external contacts with an internal power supply line; wherein

the supply switch device comprises a latching logic circuit, which latching logic circuit upon receiving a reset signal, determines the polarity of the external voltage, applied to the first and second external contacts during use and provides polarity information to the first and second supply switches;

wherein

the latching logic circuit maintains the polarity information until receiving a further reset signal.

Assignments (12)
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0335 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059263/0001 →
GRANT OF SECURITY INTEREST IN PATENT RIGHTS Recorded Nov 19, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 058214/0625 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 052856/0909 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 1, 2018
From: WEINER, ALBERT
To: MICROCHIP TECHNOLOGY INCORPORATED
Reel/Frame 047376/0028 →
Continuity (2)
Provisional Application 62580515 · Nov 2, 2017
Related Publication 20190131215A1 · May 2, 2019