IP Library Granted Patent US 10,334,372
Granted Patent B2
US 10,334,372 · App. 16/180,020 · Granted Jun 25, 2019

Systems and methods for suppressing sound leakage

Inventors: Xin Qi (Guangdong, CN); Fengyun Liao (Guangdong, CN)
Assignee: SHENZHEN VOXTECH CO., LTD.
H04R25/505G10K9/13G10K9/22G10K11/175G10K11/178G10K11/26H04R1/2811H04R9/066G10K2210/3216H04R1/2876H04R17/00H04R2460/13
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,334,372
App. No.
16/180,020
Granted
Jun 25, 2019
Kind
B2
Abstract

A bone conduction speaker includes a housing, a vibration board and a transducer. The transducer is located in the housing, and the vibration board is configured to contact with skin and pass vibration. At least one sound guiding hole is set on at least one portion of the housing to guide sound wave inside the housing to the outside of the housing. The guided sound wave interfaces with the leaked sound wave, and the interfacing reduces a sound pressure level of at least a portion of the leaked sound wave. A frequency of the at least a portion of the leaked sound wave is lower than 4000 Hz.

Claims (32)

1. A method of reducing sound leakage, the method comprising:

providing a bone conduction speaker including:

a vibration board;

a transducer configured to cause the vibration board to vibrate;

a housing connected to the transducer, the transducer causing the housing to vibrate, the vibration of the housing producing a leaked sound wave; and

at least one sound guiding hole located on the housing and configured to guide a sound wave inside the housing through the at least one sound guiding hole to an outside of the housing, the guided sound wave interfacing with the leaked sound wave, the interfacing reducing a sound pressure level of at least a portion of the leaked sound wave, a frequency of the at least a portion of the leaked sound wave being lower than 4000 Hz.

2. The method of claim 1 , wherein the frequency of the at least a portion of the leaked sound wave is within a range of 1000 Hz to 4000 Hz.

3. The method of claim 1 , wherein the frequency of the at least a portion of the leaked sound wave is within a range of 1500 Hz to 3000 Hz.

4. The method of claim 3 , wherein the sound pressure level of the at least a portion of the leaked sound wave is reduced by 10 dB or more than 10 dB on average.

5. The method of claim 1 , wherein the frequency of the at least a portion of the leaked sound wave is within a range of 2000 Hz to 2500 Hz.

6. The method of claim 5 , wherein the sound pressure level of the at least a portion of the leaked sound wave is reduced by 20 dB or more than 20 dB on average.

7. The method of claim 1 , wherein:

the housing includes a bottom or a sidewall; and

the at least one sound guiding hole is located on the bottom or the sidewall of the housing.

8. The method of claim 1 , wherein a location of the at least one sound guiding hole is determined based on at least one of: a vibration frequency of the transducer, a shape of the at least one sound guiding hole, a number of the at least one sound guiding hole, a target region where the sound pressure level of the at least a portion of the leaked sound wave is to be reduced, or a frequency range of the at least a portion of the leaked sound wave.

9. The method of claim 1 , wherein the at least one sound guiding hole includes a damping layer, the damping layer being configured to adjust a phase and an amplitude of the guided sound wave.

10. The method of claim 1 , wherein the at least one sound guiding hole includes at least two portions, the at least two portions of the at least one sound guiding hole being configured to generate at least two guided sound waves having a same phase, the at least two guided sound waves being configured to change the sound pressure level of the leaked sound wave having a same wavelength.

11. The method of claim 1 , wherein the at least one sound guiding hole includes at least two different portions, the two different portions of the at least one sound guiding hole being configured to generate at least two guided sound waves having different phases, the at least two guided sound waves being configured to change the sound pressure level of the leaked sound wave having different wavelengths.

12. A bone conduction speaker comprising:

a transducer configured to cause a vibration board to vibrate;

a housing connected to the transducer, the transducer causing the housing to vibrate, the vibration of the housing producing a leaked sound wave; and

at least one sound guiding hole located on the housing and configured to guide a sound wave inside the housing through the at least one sound guiding hole to an outside of the housing, the guided sound wave interfacing with the leaked sound wave, the interfacing reducing a sound pressure level of at least a portion of the leaked sound wave, a frequency of the at least a portion of the leaked sound wave being lower than 4000 Hz.

13. The bone conduction speaker of claim 12 , wherein the frequency of the at least a portion of the leaked sound wave is within a range of 1000 Hz to 4000 Hz.

14. The bone conduction speaker of claim 12 , wherein the frequency of the at least a portion of the leaked sound wave is within a range of 1500 Hz to 3000 Hz.

15. The bone conduction speaker of claim 14 , wherein the sound pressure level of the at least a portion of the leaked sound wave is reduced by 10 dB or more than 10 dB on average.

16. The bone conduction speaker of claim 12 , wherein the frequency of the at least a portion of the leaked sound wave is within a range of 2000 Hz to 2500 Hz.

17. The method of claim 16 , wherein the sound pressure level of the at least a portion of the leaked sound wave is reduced by 20 dB or more than 20 dB on average.

18. The bone conduction speaker of claim 12 , wherein:

the housing includes a bottom or a sidewall; and

the at least one sound guiding hole is located on the bottom or the sidewall of the housing.

19. The bone conduction speaker of claim 12 , wherein the housing includes a cylindrical sidewall, and the at least one sound guiding hole is located on the cylindrical sidewall.

20. The bone conduction speaker of claim 12 , wherein the at least one sound guiding hole includes a damping layer, the damping layer being configured to adjust a phase and an amplitude of the guided sound wave.

Assignments (2)
CHANGE OF NAME Recorded Jan 20, 2022
From: SHENZHEN VOXTECH CO., LTD.
To: SHENZHEN SHOKZ CO., LTD.
Reel/Frame 058785/0552 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 28, 2019
From: QI, XIN; LIAO, FENGYUN
To: SHENZHEN VOXTECH CO., LTD.
Reel/Frame 048720/0408 →
Priority Claims (1)
CN 2014 1 0005804 · Jan 6, 2014 · national
Continuity (3)
Continuation 15650909 · Jul 16, 2017
Continuation 15109831
Related Publication 20190132689A1 · May 2, 2019
Cited By (23)
US 12,238,483 US 12,273,686 US 12,273,687 US 12,302,066 US 12,309,550 US 12,342,132 US 12,342,133 US 12,389,170 US 12,389,172 US 12,407,992 US 12,413,915 US 12,452,614 US 12,457,457 US 12,464,299 US 12,470,879 US 12,483,842 US 12,501,224 US 12,532,132 US 12,538,083 US 12,581,249 US 12,666,207 US 12,684,300 US 12,696,038