IP Library Granted Patent US 12,342,133
Granted Patent B2
US 12,342,133 · App. 18/446,452 · Granted Jun 24, 2025

Systems and methods for suppressing sound leakage

Inventors: Xin Qi (Shenzhen, CN); Fengyun Liao (Shenzhen, CN)
Assignee: SHENZHEN SHOKZ CO., LTD.
H04R25/505G10K9/13G10K9/22G10K11/175G10K11/178G10K11/26H04R1/025H04R1/10H04R1/2811H04R1/2849H04R1/288H04R1/345H04R9/066G10K2210/3216H04R1/2876H04R17/00H04R2460/13
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,342,133
App. No.
18/446,452
Granted
Jun 24, 2025
Kind
B2
Abstract

A speaker comprises a housing, a transducer residing inside the housing, and at least one sound guiding hole located on the housing. The transducer generates vibrations. The vibrations produce a sound wave inside the housing and cause a leaked sound wave spreading outside the housing from a portion of the housing. The at least one sound guiding hole guides the sound wave inside the housing through the at least one sound guiding hole to an outside of the housing. The guided sound wave interferes with the leaked sound wave in a target region. The interference at a specific frequency relates to a distance between the at least one sound guiding hole and the portion of the housing.

Claims (30)

1. A speaker, comprising:

a housing;

a transducer residing inside the housing and configured to generate vibrations, the vibrations producing a sound wave inside the housing; and

at least two sound guiding holes located on the housing and configured to guide the sound wave inside the housing through the at least two sound guiding holes to an outside of the housing, wherein,

the at least two sound guiding holes include a first sound guiding hole and a second sound guiding hole, the first sound guiding hole is located on a lower portion of a first side of the housing, the second sound guiding hole is located on a second side different from the first side where the first sound guiding hole is located, and the guided sound wave through the first sound guiding hole and the guided sound wave through the second sound guiding hole have different phases.

2. The speaker of claim 1 , wherein the first sound guiding hole includes a perforative hole with at least one damping layer, the at least one damping layer is configured to adjust at least one of a phase and an amplitude of the guided sound wave passing through the perforative hole.

3. The speaker of claim 2 , wherein the at least one damping layer includes at least one of a tuning paper, a tuning cotton, a nonwoven fabric, a silk, a cotton, a sponge, or a rubber.

4. The speaker of claim 1 , wherein the at least one damping layer includes one or more damping layers.

5. The speaker of claim 1 , wherein the second side where the second sound guiding hole is located is connected to the first side where the first sound guiding hole is located, the lower portion of the first side ranges from ⅔ height of the first side to the second side where the second sound guiding hole is located.

6. The speaker of claim 1 , wherein the first sound guiding hole and the second sound guiding hole are configured to guide sound waves with substantially same amplitude.

7. The speaker of claim 1 , further comprising:

an acoustic route coupled to the second sound guiding hole, wherein the guided sound wave of the second sound guiding hole is propagated to the second sound guiding hole along the acoustic route, and the acoustic route is configured to adjust a frequency of the guided sound wave of the second sound guiding hole.

8. The speaker of claim 7 , wherein the acoustic route is configured to adjust a frequency of the guided sound wave by filtering sound waves in target frequencies.

9. The speaker of claim 7 , wherein the acoustic route includes one or more lumen structures.

10. The speaker of claim 7 , wherein the acoustic route includes one or more resonance cavities.

11. The speaker of claim 1 , wherein the guided sound wave through the first sound guiding hole to the outside and the guided sound wave through the second sound guiding hole to the outside interfere with each to reduce a sound pressure level of a leaked sound wave.

12. The speaker of claim 11 , wherein at least a portion of the leaked sound wave whose sound pressure level is reduced is within a range of 1500 Hz to 3000 Hz.

13. The speaker of claim 12 , wherein the sound pressure level of the at least a portion of the leaked sound wave is reduced by more than 10 dB on average.

14. The speaker of claim 1 , wherein at least a portion of the leaked sound wave whose sound pressure level is reduced is within a range of 2000 Hz to 2500 Hz.

15. The speaker of claim 14 , wherein the sound pressure level of the at least a portion of the leaked sound wave is reduced by more than 20 dB on average.

16. A method, comprising:

providing a speaker, the speaker including:

a housing;

a transducer residing inside the housing and configured to generate vibrations, the vibrations producing a sound wave inside the housing; and

at least two sound guiding holes located on the housing and configured to guide the sound wave inside the housing through the at least two sound guiding holes to an outside of the housing, wherein,

the at least two sound guiding holes include a first sound guiding hole and a second sound guiding hole, the first sound guiding hole is located on a lower portion of a first side of the housing, the second sound guiding hole is located on a second side different from the first side where the first sound guiding hole is located, and the guided sound wave through the first sound guiding hole and the guided sound wave through the second sound guiding hole have different phases.

17. The method of claim 16 , wherein the second side where the second sound guiding hole is located is connected to the first side where the first sound guiding hole is located, the lower portion of the first side ranges from ⅔ height of the first side to the second side where the second sound guiding hole is located.

18. The method of claim 16 , wherein the first sound guiding hole and the second sound guiding hole are configured to guide sound waves with substantially same amplitude.

19. The method of claim 16 , wherein the first sound guiding hole includes a damping layer, the damping layer being configured to adjust the phase of the guided sound wave through the first sound guiding hole.

20. The method of claim 16 , wherein the guided sound wave through the first sound guiding hole to the outside and the guided sound wave through the second sound guiding hole to the outside interfere with each to reduce a sound pressure level of a leaked sound wave.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 28, 2023
From: QI, XIN; LIAO, FENGYUN
To: SHENZHEN VOXTECH CO., LTD.
Reel/Frame 064715/0733 →
CHANGE OF NAME Recorded Aug 28, 2023
From: SHENZHEN VOXTECH CO., LTD.
To: SHENZHEN SHOKZ CO., LTD.
Reel/Frame 064715/0737 →
Priority Claims (1)
CN 201410005804.0 · Jan 6, 2014 · national
Continuity (9)
Continuation 18187652 · Mar 21, 2023
Continuation 17455927 · Nov 22, 2021
Continuation 17074762 · Oct 20, 2020
Continuation In Part 16813915 · Mar 10, 2020
Continuation 16419049 · May 22, 2019
Continuation 16180020 · Nov 5, 2018
Continuation 15650909 · Jul 16, 2017
Continuation 15109831
Related Publication 20230388722A1 · Nov 30, 2023
References Cited (93)
US 2327320A · Shapiro · 1943 [cited by applicant]
US 4987597A · Haertl · 1991 [cited by applicant]
US 5430803A · Kimura et al. · 1995 [cited by applicant]
US 5692059A · Kruger · 1997 [cited by applicant]
US 5757935A · Kang et al. · 1998 [cited by applicant]
US 5790684A · Niino et al. · 1998 [cited by applicant]
US 6850138B1 · Sakai · 2005 [cited by applicant]
US 7639825B2 · Fukuda · 2009 [cited by applicant]
US 8141678B2 · Ikeyama et al. · 2012 [cited by applicant]
US 8340334B2 · Suyama · 2012 [cited by applicant]
US 8345915B2 · Shin et al. · 2013 [cited by applicant]
US 9226075B2 · Lee · 2015 [cited by applicant]
US 9729978B2 · Qi et al. · 2017 [cited by applicant]
US 10149071B2 · Qi et al. · 2018 [cited by applicant]
US 10334372B2 · Qi et al. · 2019 [cited by applicant]
US 10506362B1 · Gomes · 2019 [cited by applicant]
US 10631075B1 · Patil et al. · 2020 [cited by applicant]
US 10897677B2 · Walraevens et al. · 2021 [cited by applicant]
US 11197106B2 · Qi et al. · 2021 [cited by applicant]
US 11582563B2 · Qi et al. · 2023 [cited by applicant]
US 20030048913A1 · Lee et al. · 2003 [cited by applicant]
US 20040131219A1 · Polk, Jr. · 2004 [cited by applicant]
US 20050251952A1 · Johnson · 2005 [cited by applicant]
US 20060098829A1 · Kobayashi · 2006 [cited by applicant]
US 20070034493A1 · Kawasaki et al. · 2007 [cited by applicant]
US 20070041595A1 · Carazo et al. · 2007 [cited by applicant]
US 20070237341A1 · Laroche · 2007 [cited by applicant]
US 20080144874A1 · Wu et al. · 2008 [cited by applicant]
US 20090095613A1 · Lin · 2009 [cited by applicant]
US 20090208031A1 · Abolfathi · 2009 [cited by applicant]
US 20090285417A1 · Shin et al. · 2009 [cited by applicant]
US 20090290730A1 · Fukuda et al. · 2009 [cited by applicant]
US 20100054492A1 · Eaton et al. · 2010 [cited by applicant]
US 20100322454A1 · Ambrose et al. · 2010 [cited by applicant]
US 20110150262A1 · Nakama et al. · 2011 [cited by applicant]
US 20120020501A1 · Lee · 2012 [cited by applicant]
US 20120070022A1 · Saiki · 2012 [cited by applicant]
US 20120177206A1 · Yamagishi et al. · 2012 [cited by applicant]
US 20120201406A1 · Yamaguchi · 2012 [cited by applicant]
US 20130329919A1 · He · 2013 [cited by applicant]
US 20140009008A1 · Li et al. · 2014 [cited by applicant]
US 20140064533A1 · Kasic, II · 2014 [cited by applicant]
US 20140185822A1 · Kunimoto et al. · 2014 [cited by applicant]
US 20140185837A1 · Kunimoto et al. · 2014 [cited by applicant]
US 20140274229A1 · Fukuda · 2014 [cited by applicant]
US 20140315605A1 · Cho et al. · 2014 [cited by applicant]
US 20140355777A1 · Nabata et al. · 2014 [cited by applicant]
US 20150030189A1 · Nabata et al. · 2015 [cited by applicant]
US 20150256656A1 · Horii · 2015 [cited by applicant]
US 20150264473A1 · Fukuda · 2015 [cited by applicant]
US 20150326967A1 · Otani · 2015 [cited by applicant]
US 20160037243A1 · Lippert et al. · 2016 [cited by applicant]
US 20160150337A1 · Nandy · 2016 [cited by applicant]
US 20160165357A1 · Morishita et al. · 2016 [cited by applicant]
US 20160295328A1 · Park · 2016 [cited by applicant]
US 20160329041A1 · Qi et al. · 2016 [cited by applicant]
US 20170201823A1 · Shetye et al. · 2017 [cited by applicant]
US 20170223445A1 · Bullen et al. · 2017 [cited by applicant]
US 20180167710A1 · Silver et al. · 2018 [cited by applicant]
US 20180182370A1 · Hyde et al. · 2018 [cited by applicant]
US 20190052954A1 · Rusconi Clerici Beltrami et al. · 2019 [cited by applicant]
US 20190238971A1 · Wakeland et al. · 2019 [cited by applicant]
US 20190320258A1 · Ohura · 2019 [cited by applicant]
US 20200367008A1 · Walsh et al. · 2020 [cited by applicant]
US 20210099027A1 · Larsson et al. · 2021 [cited by applicant]
US 20210219059A1 · Qi et al. · 2021 [cited by applicant]
US 20240276155A1 · Li et al. · 2024 [cited by applicant]
CN 201616895U · 2010 [cited by applicant]
CN 201690580U · 2010 [cited by applicant]
CN 102014328A · 2011 [cited by applicant]
CN 202435600U · 2012 [cited by applicant]
CN 103347235A · 2013 [cited by applicant]
CN 102421043B · 2015 [cited by applicant]
CN 204206450U · 2015 [cited by applicant]
CN 103167390B · 2017 [cited by applicant]
CN 109547888A · 2019 [cited by applicant]
EP 2011367B1 · 2014 [cited by applicant]
JP 2006332715A · 2006 [cited by applicant]
JP 2007251358A · 2007 [cited by applicant]
JP 2013055571A · 2013 [cited by applicant]
JP 2014072555A · 2014 [cited by applicant]
KR 20050030183A · 2005 [cited by applicant]
KR 20090082999A · 2009 [cited by applicant]
WO 2004095878A2 · 2004 [cited by applicant]
Decision to Patent Grant in Korean Application No. 10-2016-7017110 mailed on Jun. 14, 2018, 3 pages. [cited by applicant]
International Search Report in PCT/CN2014/094065 mailed on Mar. 17, 2015, 5 pages. [cited by applicant]
First Office Action in Chinese application No. 201410005804.0 mailed on Dec. 17, 2015, 9 pages. [cited by applicant]
The Examination Report in European Application No. 14877111.6 mailed on Apr. 23, 2018, 6 pages. [cited by applicant]
The Notice of Rejection in Japanese Application No. 2016-545828 mailed on Oct. 10, 2017, 6 pages. [cited by applicant]
Decision to Grant a Patent in Japanese Application No. 2016-545828 mailed on Jan. 16, 2018, 5 pages. [cited by applicant]
The Extended European Search Report in European Application No. 14877111.6 mailed on Mar. 17, 2017, 6 pages. [cited by applicant]
First Examination Report in Indian Application No. 201617026062 mailed on Nov. 13, 2020, 6 pages. [cited by applicant]
Notice of Preliminary Rejection in Korean Application No. 10-2022-7010046 mailed on Jun. 20, 2022, 15 pages. [cited by applicant]