Methods, apparatuses, and circuits for programming a memory device

1. An apparatus, comprising:

a memory material having a first edge and a second edge that is laterally offset from the first edge in a first direction;

a separation material positioned over the memory material and having a first edge and a second edge that is laterally offset from the first edge in the first direction; and

a conductive material positioned over the separation material and having a first edge and a second edge that is laterally offset from the first edge in the first direction, wherein the second edge of the separation material and the second edge of the memory material extend farther in the first direction than the second edge of the conductive material.

2. The apparatus of claim 1 , wherein the memory material comprises a programmable portion, and wherein the second edge of the conductive material is laterally offset from a center of the programmable portion of the memory material in a second direction by a distance that is greater than or equal to a height of the separation material, the second direction being different than the first direction.

3. The apparatus of claim 1 , wherein the first edge of the separation material and the first edge of the conductive material are aligned, and wherein the second edge of the conductive material is laterally offset from the second edge of the separation material in a second direction that is different than the first direction.

4. The apparatus of claim 1 , wherein the first edge of the memory material is aligned with the first edge of the conductive material and the second edge of the memory material is aligned with the second edge of the separation material.

5. The apparatus of claim 1 , wherein:

the memory material comprises a programmable portion,

the conductive material is non-overlapping with the programmable portion of the memory material in the first direction, and

the separation material is overlapping with at least a portion the programmable portion in the first direction.

6. The apparatus of claim 1 , further comprising:

a dielectric material positioned below the memory material, the dielectric material comprising a resistive material that is positioned below and in contact with a programmable portion of the memory material.

7. The apparatus of claim 6 , wherein:

the resistive material comprises titanium, titanium nitride, tungsten, tungsten nitride, chromium, or tantalum, or any combination thereof,

the separation material comprises titanium, titanium nitride, tungsten, chromium, tantalum, or any combination thereof, and

the conductive material comprises copper, or aluminum, or any combination thereof.

8. The apparatus of claim 1 , further comprising:

a conductive plug positioned below the memory material; and

a switching device positioned below the conductive plug and coupled with a ground reference.

9. A method of forming an apparatus, comprising:

forming a memory material having a first edge and a second edge that is laterally offset form the first edge in a first direction;

forming, over the memory material, a separation material having a first edge and a second edge that is laterally offset from the first edge in the first direction; and

forming, over the separation material, a conductive material having a first edge and a second edge that is laterally offset from the first edge in the first direction, wherein the second edge of the separation material and the second edge of the memory material extend farther in the first direction than the second edge of the conductive material.

10. The method of claim 9 , further comprising:

forming a resistive material, wherein the memory material is formed over the resistive material; and

forming a dielectric material that at least partially surrounds the resistive material.

11. The method of claim 9 , wherein forming the conductive material comprises removing a portion of the conductive material that lies above a programmable portion of the memory material.

12. The method of claim 9 , further comprising:

forming a conductive path across the memory material, the separation material, and the conductive material.

13. The method of claim 10 , further comprising:

forming a conductive plug, wherein the resistive material is formed over the conductive plug; and

forming a switching device, wherein the conductive plug is formed over the switching device.

14. The method of claim 10 , wherein:

the resistive material comprises titanium, titanium nitride, tungsten, tungsten nitride, chromium, or tantalum, or any combination thereof,

the separation material comprises titanium, titanium nitride, tungsten, chromium, tantalum, or any combination thereof, and

the conductive material comprises copper, or aluminum, or any combination thereof.

15. The method of claim 9 , wherein the memory material comprises a programmable portion, and wherein the second edge of the conductive material is laterally offset from a center of the programmable portion of the memory material in a second direction by a distance that is greater than or equal to a height of the separation material, the second direction being different than the first direction.

16. The method of claim 9 , wherein the first edge of the separation material and the first edge of the conductive material are aligned, and wherein the second edge of the conductive material is laterally offset from the second edge of the separation material in a second direction that is different than the first direction.

17. The method of claim 9 , wherein the first edge of the memory material is aligned with the first edge of the conductive material and the second edge of the memory material is aligned with the second edge of the separation material.

18. The method of claim 9 , wherein:

the memory material comprises a programmable portion,

the conductive material is non-overlapping with the programmable portion of the memory material in the first direction, and

the separation material is overlapping with at least a portion the programmable portion in the first direction.