IP Library Granted Patent US 10,340,276
Granted Patent B2
US 10,340,276 · App. 16/200,997 · Granted Jul 2, 2019

Method of maintaining the state of semiconductor memory having electrically floating body transistor

Inventors: Yuniarto Widjaja (Cupertino, CA); Zvi Or-Bach (San Jose, CA)
Assignee: Zeno Semiconductor, Inc.
H01L27/10802G11C7/22G11C11/39G11C11/404G11C11/4074G11C11/4094G11C11/4096G11C11/4099G11C14/0018H01L23/528H01L27/1023H01L29/0821H01L29/1004H01L29/1095H01L29/66825H01L29/66833H01L29/772H01L29/7841H01L29/7881G11C11/04G11C11/4026G11C2211/4016
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Quick Facts
Patent No.
US 10,340,276
App. No.
16/200,997
Granted
Jul 2, 2019
Kind
B2
Abstract

Methods of maintaining a state of a memory cell without interrupting access to the memory cell are provided, including applying a back bias to the cell to offset charge leakage out of a floating body of the cell, wherein a charge level of the floating body indicates a state of the memory cell; and accessing the cell.

Claims (45)

1. An integrated circuit comprising:

an array of semiconductor memory cells formed in a semiconductor substrate having at least one surface, the array comprising:

said semiconductor memory cells arranged in a matrix of rows and columns, wherein each said semiconductor memory cell includes:

a transistor comprising a source region, a floating body region, a drain region, and a gate;

a first bipolar device having a first floating base region, a first emitter, and a first collector; and

a second bipolar device having a second floating base region, a second emitter, and a second collector;

wherein said first floating base region and said second floating base region are common to said floating body region;

wherein said first collector is common to said second collector;

wherein application of back bias to said first and second collectors results in at least two stable floating base region charge levels;

wherein said transistor is usable to access said memory cell;

a first control circuit configured to apply said back bias to said first and second collectors; and

a second control circuit configured to access a selected memory cell selected from said semiconductor memory cells and perform a read or write operation on said selected memory cell.

2. The integrated circuit of claim 1 , wherein said first control circuit is configured to provide electrical signals to at least two of said memory cells to maintain states of said at least two memory cells.

3. The integrated circuit of claim 2 , wherein said electrical signals are constant voltage biases.

4. The integrated circuit of claim 2 , wherein said electrical signals are periodic pulses of voltage.

5. The integrated circuit of claim 2 , wherein said electrical signals result in at least two stable states.

6. The integrated circuit of claim 1 , wherein said integrated circuit comprises a fin structure extending from said substrate.

7. The integrated circuit of claim 1 , wherein said first control circuit comprises a voltage generator circuit.

8. The integrated circuit of claim 7 , further comprising a multiplexer electrically connected between said voltage generator circuit and said first and second collectors.

9. The integrated circuit of claim 1 , wherein said second control circuit comprises a reference generator circuit configured to sense potential of said floating body region.

10. The integrated circuit of claim 1 , wherein said second control circuit comprises a read circuit connected to one of said source or drain region.

11. The integrated circuit of claim 10 , further comprising a reference generator circuit connected to said read circuit.

12. An integrated circuit comprising:

an array of semiconductor memory cells formed in a semiconductor substrate having at least one surface, the array comprising:

said semiconductor memory cells arranged in a matrix of rows and columns, wherein each said semiconductor memory cell includes:

a transistor comprising a source region, a floating body region, a drain region, and a gate;

a first bipolar device having a first floating base region, a first emitter, and a first collector; and

a second bipolar device having a second floating base region, a second emitter, and a second collector;

wherein said first floating base region and said second floating base region are common to said floating body region;

wherein said first collector is common to said second collector;

wherein at least one of said first bipolar device or second bipolar device maintains a state of said memory cell;

wherein said state of said memory cell is maintained upon repeated read operations;

wherein said transistor is usable to access said memory cell;

a first control circuit configured to access a selected memory cell selected from said memory cells and perform a read or write operation on said selected memory cell; and

a second control circuit configured to provide electrical signals to perform a holding operation on said array, wherein said electrical signals are applied to a terminal not used for memory address selection.

13. The integrated circuit of claim 12 , wherein said electrical signals to perform a holding operation are applied to a terminal connected to said first and second collectors.

14. The integrated circuit of claim 12 , wherein said electrical signals to perform a holding operation are constant voltage biases.

15. The integrated circuit of claim 12 , wherein said electrical signals to perform a holding operation are periodic pulses of voltage.

16. The integrated circuit of claim 12 , wherein said electrical signals to perform a holding operation result in at least two stable states.

17. The integrated circuit of claim 12 , wherein said integrated circuit comprises a fin structure extending from said substrate.

18. The integrated circuit of claim 12 , wherein said first control circuit comprises a voltage generator circuit.

19. The integrated circuit of claim 18 , further comprising a multiplexer electrically connected between said voltage generator circuit and said first and second collectors.

20. The integrated circuit of claim 12 , wherein said second control circuit comprises a reference generator circuit configured to sense potential of said floating body region.

21. The integrated circuit of claim 12 , wherein said second control circuit comprises a read circuit connected to one of said source or drain region.

22. The integrated circuit of claim 21 , further comprising a reference generator circuit connected to said read circuit.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 25, 2021
From: SILICON STORAGE TECHNOLOGY, INC.
To: ZENO SEMICONDUCTOR, INC.
Reel/Frame 056681/0744 →
DECLARATION SUPPORTING CORRECTION OF ERROUNEOIUSLY FILED REEL/FRAME NO. 049657/0037 Recorded Dec 13, 2019
From: ZENO SEMICONDUCTOR, INC.
To: ZENO SEMICONDUCTOR, INC.
Reel/Frame 051287/0251 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 2, 2019
From: WIDJAJA, YUNIARTO
To: SILICON STORAGE TECHNOLOGY, INC.
Reel/Frame 049657/0037 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 4, 2019
From: WIDJAJA, YUNIARTO; OR-BACH, ZVI
To: ZENO SEMICONDUCTOR, INC.
Reel/Frame 048235/0773 →
Continuity (13)
Continuation 16017692 · Jun 25, 2018
Continuation 15701187 · Sep 11, 2017
Continuation 15485011 · Apr 11, 2017
Continuation 15347048 · Nov 9, 2016
Continuation 14956253 · Dec 1, 2015
Continuation 14688122 · Apr 16, 2015
Continuation 14448757 · Jul 31, 2014
Continuation 13941475 · Jul 13, 2013
Continuation 13478014 · May 22, 2012
Continuation 13244855 · Sep 26, 2011
Continuation 12797334 · Jun 9, 2010
Provisional Application 61309589 · Mar 2, 2010
Related Publication 20190096889A1 · Mar 28, 2019
Cited By (3)
US 12,238,916 US 12,439,611 US 12,538,469