IP Library Granted Patent US 10,921,155
Granted Patent B2
US 10,921,155 · App. 16/205,103 · Granted Feb 16, 2021

Multi cycle dual redundant angular position sensing mechanism and associated method of use for precise angular displacement measurement

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Quick Facts
Patent No.
US 10,921,155
App. No.
16/205,103
Granted
Feb 16, 2021
Kind
B2
Abstract

An apparatus can include a first planar inductive sensor including two oscillator coils and two sensing coils. The apparatus can also include a second planar inductive sensor independent of the first sensor and also including a pair of oscillator and sensing coils. The apparatus can further include a high frequency alternating current carrier generator configured to inject high frequency alternating current carrier signals into the oscillator coils. The carrier signal for the oscillator coil of the first planar inductive sensor is 180 degrees out of phase with a 2 nd oscillator coil of the same planar inductive sensor, and wound in an opposite geometric direction, and the oscillator coils of the other inductive sensor can also be wound similarly The two sensing coils of the first planar inductive sensor can be 90 degrees out of phase with each another, and the sensing coils of the other inductive sensor can also be wound similarly.

Claims (24)

1. An apparatus, comprising:

a first planar inductive sensor comprising two oscillator coils, which are 180 degrees out of phase with respect to each other, and two sensing coils;

a second planar inductive sensor independent of the first sensor comprising two oscillator coils, which are 180 degrees out of phase with respect to each other, and two sensing coils; and

a high frequency alternating current carrier generator configured to inject high frequency alternating current carrier signals into the oscillator coils,

wherein a carrier signal for the oscillator coils of the first planar inductive sensor are in phase with a carrier signal for the oscillator coils of the second planar inductive sensor,

wherein the oscillator coils of the first planar inductive sensor are wound in a same geometric direction as respective oscillator coils of the second planar inductive sensor,

wherein the two sensing coils of the first planar inductive sensor are 90 degrees out of phase with one another, and

wherein the two sensing coils of the second planar inductive sensor are 90 degrees out of phase with one another.

2. The apparatus of claim 1 , wherein each of the sensing coils completes three cycles to reach phase shift points and return to starting point.

3. The apparatus of claim 1 , wherein the two oscillator coils of the first planar inductive sensor and the two oscillator coils of the second planar inductive sensor are sourced from independent power supplies.

4. The apparatus of claim 1 , wherein the two oscillator coils of the first planar inductive sensor are 180 degrees out of phase with one another, and the respective two oscillator coils of the second planar inductive sensor are correspondingly 180 degrees out of phase with one another.

5. The apparatus of claim 1 , wherein the first planar inductive sensor is configured to be independently redundant of the second planar inductive sensor.

6. The apparatus of claim 1 , wherein the first planar inductive sensor and the second planar inductive sensor are configured such that a single sensor fault that disables one of the sensors will not affect the operation of the other sensor.

7. The apparatus of claim 1 , wherein a target is provided axially facing the printed circuit board that comprises the oscillator coils and the sensing coils, wherein the sensing coils are configured to detect the angular position of the target.

8. The apparatus of claim 7 , wherein the sensing coils are configured to detect the absolute angular position of the target.

9. The apparatus of claim 1 , wherein the oscillator coils and the sensing coils of the first planar inductive sensor and the second planar inductive sensor are provided on a multiple layer printed circuit board and occupy half of a radial area of a printed circuit board.

10. The apparatus of claim 9 , wherein the sensing coils occupy first or last two layers of the multiple layer printed circuit board.

11. The apparatus of claim 1 , wherein the oscillator coils are on two layers of a multiple layer printed circuit board, and the sensing coils are on two other layers, one respectively set over the other.

12. A method, comprising:

providing an apparatus having a first planar inductive sensor that includes two oscillator coils and two sensing coils, and also having a second planar inductive sensor independent of the first sensor and also including two oscillator coils and two sensing coils;

providing 180 degrees out of phase alternating currents as an input to each of the two oscillator coils of the first planar inductive sensor and each of the two oscillator coils of the second planar inductive sensor;

providing a target electromagnetically linked to each of the sensing coils; and

sensing an angular position of the target based on voltages induced in the sensing coils.

13. The method of claim 12 , wherein the sensed angular position is an absolute position.

Assignments (12)
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0335 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059263/0001 →
GRANT OF SECURITY INTEREST IN PATENT RIGHTS Recorded Nov 19, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 058214/0625 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 052856/0909 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 29, 2018
From: SHAGA, GANESH; NAUDURI, BALA SUNDARAM
To: MICROSEMI CORPORATION
Reel/Frame 047629/0654 →