Bonding alignment marks at bonding in interface
Embodiments of bonded semiconductor structures and fabrication methods thereof are disclosed. In an example, a semiconductor device includes a first semiconductor structure, a second semiconductor structure, and a bonding interface between the first semiconductor structure and the second semiconductor structure. The first semiconductor structure includes a substrate, a first device layer disposed on the substrate, and a first bonding layer disposed above the first device layer and including a first bonding contact and a first bonding alignment mark. The second semiconductor structure includes a second device layer, and a second bonding layer disposed below the second device layer and including a second bonding contact and a second bonding alignment mark. The first bonding alignment mark is aligned with the second bonding alignment mark at the bonding interface, such that the first bonding contact is aligned with the second bonding contact at the bonding interface.
1. A semiconductor device, comprising:
a first semiconductor structure comprising a substrate, a first device layer disposed on the substrate, and a first bonding layer disposed above the first device layer and comprising a first bonding contact and a first bonding alignment mark;
a second semiconductor structure comprising a second device layer, and a second bonding layer disposed below the second device layer and comprising a second bonding contact and a second bonding alignment mark; and
a bonding interface between the first semiconductor structure and the second semiconductor structure,
wherein the first bonding alignment mark is aligned with the second bonding alignment mark at the bonding interface, such that the first bonding contact is aligned with the second bonding contact at the bonding interface;
a thickness of the first bonding alignment mark is smaller than a thickness of the first bonding contact, and the first bonding alignment mark and the first bonding contact with different thicknesses are in physical contact with a same material;
at least one of the first and second bonding alignment marks comprises a plurality of repetitive patterns, each of the repetitive patterns consisting of a metal region and a dielectric region between two adjacent metal regions; and
a size of the metal region is not greater than about 25% of a size of the respective repetitive pattern.
2. The semiconductor device of claim 1 , wherein a dimension of each of the first and second bonding alignment marks is not greater than about 15 μm.
3. The semiconductor device of claim 2 , wherein the dimension of each of the first and second bonding alignment marks is about 10 μm.
4. The semiconductor device of claim 1 , wherein a dimension of each of the repetitive patterns is not greater than about 1 μm.
5. The semiconductor device of claim 1 , wherein
the first semiconductor structure further comprises a first interconnect layer between the first device layer and the first bonding layer;
the second semiconductor structure further comprises a second interconnect layer between the second device layer and the second bonding layer; and
at least one of the first and second interconnect layers does not include a bonding alignment mark for aligning the first and second bonding contacts.
6. The semiconductor device of claim 1 , wherein the first bonding layer further comprises a first dielectric, and the second bonding layer further comprises a second dielectric in contact with the first dielectric at the bonding interface.
7. The semiconductor device of claim 1 , wherein at least one of the first and second bonding alignment marks is a lithography overlay mark.
8. The semiconductor device of claim 1 , wherein one of the first and second device layers comprises a NAND memory string, and another one of the first and second device layers comprises a peripheral device.
9. A bonded structure, comprising:
a first bonding layer comprising a first bonding contact and a first bonding alignment mark;
a second bonding layer comprising a second bonding contact and a second bonding alignment mark; and
a bonding interface between the first bonding layer and the second bonding layer,
wherein the first bonding alignment mark is aligned with the second bonding alignment mark at the bonding interface, such that the first bonding contact is aligned with the second bonding contact at the bonding interface;
a thickness of the first bonding alignment mark is smaller than a thickness of the first bonding contact, and the first bonding alignment mark and the first bonding contact with different thicknesses are in physical contact with a same material;
a dimension of each of the first bonding alignment mark and the second bonding alignment mark is not greater than about 15 μm;
at least one of the first and second bonding alignment marks comprises a plurality of repetitive patterns, each of the repetitive patterns consisting of a metal region and a dielectric region between two adjacent metal regions; and
a size of the metal region is not greater than about 25% of a size of the respective repetitive pattern.
10. The bonded structure of claim 9 , wherein the dimension of each of the first and second bonding alignment marks is about 10 μm.
11. The bonded structure of claim 9 , wherein a dimension of each of the repetitive patterns is not greater than about 1 μm.
12. The bonded structure of claim 9 , wherein the first bonding layer further comprises a first dielectric, and the second bonding layer further comprises a second dielectric in contact with the first dielectric at the bonding interface.
13. A bonded structure, comprising:
a first bonding layer comprising a first bonding contact, a first bonding alignment mark, and a first dielectric;
a second bonding layer comprising a second bonding contact, a second bonding alignment mark, and a second dielectric; and
a bonding interface between the first bonding layer and the second bonding layer,
wherein the first bonding alignment mark is aligned with the second bonding alignment mark at the bonding interface, such that the first bonding contact is aligned with the second bonding contact at the bonding interface;
a thickness of the first bonding alignment mark is smaller than a thickness of the first bonding contact;
the first bonding alignment mark and the first bonding contact with different thicknesses are completely surrounded by the first dielectric;
at least one of the first and second bonding alignment marks comprises a plurality of repetitive patterns, each of the repetitive patterns consisting of a metal region and a dielectric region between two adjacent metal regions; and
a size of the metal region is not greater than about 25% of a size of the respective repetitive pattern.
14. The bonded structure of claim 13 , wherein a dimension of each of the first bonding alignment mark and the second bonding alignment mark is not greater than about 15 μm.