Semiconductor device and method for fabricating the same
A semiconductor device includes a dielectric layer, a conductive layer formed over the dielectric layer, and a reduction sacrificial layer formed between the dielectric layer and the conductive layer, wherein the reduction sacrificial layer includes a first reduction sacrificial material having higher electronegativity than the dielectric layer, and a second reduction sacrificial material having higher electronegativity than the first reduction sacrificial material.
1. A semiconductor device comprising:
a capacitor formed over a substrate,
wherein the capacitor comprises:
a bottom electrode;
a dielectric layer formed over the bottom electrode;
a top electrode formed over the dielectric layer; and
a reduction sacrificial layer having a higher electronegativity than the dielectric layer and formed between the dielectric layer and the top electrode,
wherein the reduction sacrificial layer includes:
a first reduction sacrificial material having higher electronegativity than the dielectric layer; and
a second reduction sacrificial material having higher electronegativity than the first reduction sacrificial material,
wherein the second reduction sacrificial material has a larger vertical thickness than the first reduction sacrificial material.
2. The semiconductor device of claim 1 , wherein the reduction sacrificial layer includes a stack structure in which the first reduction sacrificial material and the second reduction sacrificial material are stacked, and the second reduction sacrificial material contacted with the top electrode or the dielectric layer.
3. The semiconductor device of claim 1 , wherein the reduction sacrificial layer includes a laminate structure in which the first reduction sacrificial material and the second reduction sacrificial material are alternately stacked, and the second reduction sacrificial material contacted with the conductive layer or the dielectric layer.
4. The semiconductor device of claim 1 , wherein the reduction sacrificial layer includes a structure in which the first reduction sacrificial material and the second reduction sacrificial material are intermixed.
5. The semiconductor device of claim 1 , wherein the dielectric layer includes a zirconium oxide-based layer or a hafnium oxide-based layer, and the first reduction sacrificial material and the second reduction sacrificial material include a material having higher electronegativity than the zirconium oxide-based layer and the hafnium oxide-based layer.
6. The semiconductor device of claim 1 , wherein each of the first reduction sacrificial material and the second reduction sacrificial material includes titanium oxide, tantalum oxide, aluminum oxide, tin oxide, niobium oxide, germanium oxide, silicon oxide, molybdenum oxide, ruthenium oxide, iridium oxide or combinations thereof, and the first reduction sacrificial material and the second reduction sacrificial material are different from each other.
7. The semiconductor device of claim 1 , wherein the first reduction sacrificial material includes titanium oxide or tantalum oxide, and the second reduction sacrificial material includes aluminum oxide, tin oxide, niobium oxide, germanium oxide, silicon oxide, molybdenum oxide, ruthenium oxide, iridium oxide or combinations thereof.
8. The semiconductor device of claim 1 , wherein each of the first reduction sacrificial material and the second reduction sacrificial material includes one suboxide of materials selected from titanium, tantalum, aluminum, tin, molybdenum, ruthenium, iridium, niobium, germanium, silicon and combinations thereof, and the first reduction sacrificial material and the second reduction sacrificial material are different from each other.
9. The semiconductor device of claim 1 , wherein the reduction sacrificial layer has a smaller thickness than the dielectric layer.
10. The semiconductor device of claim 1 , wherein the reduction sacrificial layer includes a conductive metal oxide.
11. The semiconductor device of claim 1 further comprising:
an interface control layer between the bottom electrode and the dielectric layer.
12. The semiconductor device of claim 11 , wherein the interface control layer and the reduction sacrificial layer include the same material, and include a material having higher electronegativity than the dielectric layer.
13. The semiconductor device of claim 11 , wherein the interface control layer and the reduction sacrificial layer include different materials, and include a material having higher electronegativity than the dielectric layer.
14. The semiconductor device of claim 1 , wherein the reduction sacrificial layer includes a conductive material.
15. The semiconductor device of claim 1 , wherein the dielectric layer includes ZA (ZrO 2 /Al 2 O 3 ), ZAZ (ZrO 2 /Al 2 O 3 /ZrO 2 ), HA (HfO 2 /Al 2 O 3 ), HAH (HfO 2 /Al 2 O 3 /HfO 2 ), ZAZA (ZrO 2 /Al 2 O 3 /ZrO 2 /Al 2 O 3 ), ZAZAZ (ZrO 2 /Al 2 O 3 /ZrO 2 /Al 2 O 3 /ZrO 2 ), HAHA (HfO 2 /Al 2 O 3 /HfO 2 /Al 2 O 3 ) or HAHAH (HfO 2 /Al 2 O 3 /HfO 2 /Al 2 O 3 /HfO 2 ).
16. The semiconductor device of claim 1 , wherein the top electrode includes a SiGe/TiN stack.
17. The semiconductor device of claim 1 , wherein the capacitor includes a DRAM capacitor.
18. The semiconductor device of claim 1 , wherein each of the first reduction sacrificial material and the second reduction sacrificial material have the vertical thickness of 1 nm or less, and the vertical thickness of the second reduction sacrificial material is larger than the vertical thickness of the first reduction sacrificial material.