IP Library › Granted Patent US 12,660,212
Granted Patent B2
US 12,660,212 · App. 18/462,394 · Granted Jun 16, 2026

Capacitor structure, method of forming the same, and semiconductor device including the capacitor structure

Inventors: Jungmin Park (Suwon-si, KR); Hanjin Lim (Suwon-si, KR); Hyungsuk Jung (Suwon-si, KR)
Assignee: SAMSUNG ELECTRONICS CO., LTD.
H10D1/042H10B12/0335H10B12/315H10D1/696H10D1/716
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,660,212
App. No.
18/462,394
Granted
Jun 16, 2026
Kind
B2
Abstract

A capacitor structure includes a lower electrode structure disposed on a substrate, including an oxide of a first metal having 4 valence electrons, and being doped with a second metal having 3, 5, 6, or 7 valence electrons, a dielectric pattern disposed on a sidewall of the lower electrode structure, and an upper electrode disposed on a sidewall of the dielectric pattern.

Claims (38)

1 . A capacitor structure, comprising:

a lower electrode structure disposed on a substrate, the lower electrode structure including an oxide of a first metal having 4 valence electrons and being doped with a second metal having 3, 5, 6, or 7 valence electrons;

a dielectric pattern disposed on a sidewall of the lower electrode structure; and

an upper electrode disposed on a sidewall of the dielectric pattern.

2 . The capacitor structure of claim 1 , wherein the first metal is hafnium or zirconium.

3 . The capacitor structure of claim 1 , wherein the second metal is vanadium, niobium, tantalum, chromium, molybdenum, tungsten, manganese, yttrium or lanthanum.

4 . The capacitor structure of claim 1 , wherein the lower electrode structure includes:

a second lower electrode; and

a first lower electrode disposed on a sidewall of the second lower electrode,

wherein the first lower electrode includes an oxide of the first metal and is doped with the second metal.

5 . The capacitor structure of claim 4 , wherein the first lower electrode at least partially covers a lower surface of the second lower electrode.

6 . The capacitor structure of claim 1 , wherein the dielectric pattern includes an oxide of a third metal having 4 valence electrons.

7 . The capacitor structure of claim 6 , wherein the third metal and the first metal are the same metal.

8 . The capacitor structure of claim 1 , wherein the upper electrode includes an oxide of a third metal having 4 valence electrons and is doped with a fourth metal having 3, 5, 6, or 7 valence electrons.

9 . The capacitor structure of claim 8 , wherein the upper electrode includes a material that is the same as a material of the lower electrode structure.

10 . The capacitor structure of claim 1 , further comprising a support layer disposed on the sidewall of the lower electrode structure.

11 . The capacitor structure of claim 10 , wherein the dielectric pattern contacts; the sidewall of the lower electrode structure, an upper surface of the support layer, and a lower surface of the support layer.

12 . A capacitor structure, comprising:

a lower electrode structure including:

a second lower electrode disposed on a substrate; and

a first lower electrode disposed on a sidewall of the second lower electrode, the first lower electrode including an oxynitride of a first metal having 4 valence electrons and being doped with a second metal having 3, 5, 6, or 7 valence electrons;

a dielectric pattern disposed on a sidewall of the lower electrode structure; and

an upper electrode disposed on a sidewall of the dielectric pattern.

13 . The capacitor structure of claim 12 , wherein the second lower electrode extends in a vertical direction that is substantially perpendicular to an upper surface of the substrate, and

wherein the first lower electrode is one of a plurality of first lower electrodes spaced apart from each other in the vertical direction.

14 . The capacitor structure of claim 13 , further comprising an insulation pattern disposed on a portion of the sidewall of the second electrode, between neighboring pairs of the plurality of first lower electrodes.

15 . The capacitor structure of claim 14 , further comprising a support layer disposed on a sidewall of the insulation pattern.

16 . The capacitor structure of claim 12 , wherein the insulation pattern includes an oxide of a third metal having 4 valence electrons.

17 . The capacitor structure of claim 12 , wherein the second metal is vanadium, niobium, tantalum, chromium, molybdenum, tungsten, manganese, yttrium/or lanthanum.

18 . The capacitor structure of claim 12 , wherein the dielectric pattern includes an oxide of a third metal having 4 valence electrons.

19 . The capacitor structure of claim 12 , wherein the upper electrode includes an oxide of a third metal having 4 valence electrons and is doped with a fourth metal having 3, 5, 6, or 7 valence electrons.

20 . A capacitor structure, comprising:

a lower electrode structure including:

a second lower electrode disposed on a substrate, the second lower electrode extending in a vertical direction that is substantially perpendicular to an upper surface of the substrate; and

a first lower electrode disposed on a sidewall of the second lower electrode, the first lower electrode including an oxide of a first metal having 4 valence electrons and being doped with a second metal having 3, 5, 6, or 7 valence electrons;

support layers contacting a sidewall of the lower electrode structure, the support layers being spaced apart from each other in the vertical direction;

a dielectric pattern disposed on a portion of the sidewall of the lower electrode structure, between neighboring pairs of the support layers; and

an upper electrode disposed on a sidewall of the dielectric pattern.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 6, 2023
From: PARK, JUNGMIN; LIM, HANJIN; JUNG, HYUNGSUK
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 064822/0192 →
Priority Claims (1)
KR 10-2022-0118269 · Sep 20, 2022 · national
Continuity (1)
Related Publication 20240096931A1 · Mar 21, 2024
References Cited (21)
US 8481384B2 · Chen · 2013 [cited by examiner]
US 8791004B2 · Ando et al. · 2014 [cited by applicant]
US 8969169B1 · Chen et al. · 2015 [cited by applicant]
US 10964614B2 · Lee · 2021 [cited by examiner]
US 11138499B2 · Sharma et al. · 2021 [cited by applicant]
US 11678476B2 · Cho et al. · 2023 [cited by applicant]
US 11791374B2 · Lee et al. · 2023 [cited by applicant]
US 20140183696A1 · Rui et al. · 2014 [cited by applicant]
US 20210066446A1 · Lee et al. · 2021 [cited by applicant]
US 20210183718A1 · Lee et al. · 2021 [cited by applicant]
US 20220157823A1 · Jung et al. · 2022 [cited by applicant]
CN 109935589 · 2019 [cited by applicant]
CN 112334916A · 2021 [cited by applicant]
EP 3971976A1 · 2022 [cited by applicant]
KR 10604672 · 2006 [cited by applicant]
KR 1020220014997A · 2022 [cited by applicant]
KR 1020220106336A · 2022 [cited by applicant]
TW 1769792B · 2022 [cited by applicant]
EESR issued in connection with corresponding European Patent Application No. 23193201.3 issue Apr. 29, 2024. [cited by applicant]
Office Action issued in connection with corresponding Taiwan Patent Application No. 112134150 issued on May 15, 2024. [cited by applicant]
Office Action dated May 6, 2026 issued in corresponding to Korean Patent Application No. 10-2022-0118269. [cited by applicant]