Integrated circuit including an array of logic tiles, each logic tile including a configurable switch interconnect network

1. An integrated circuit comprising:

a plurality of logic tiles, wherein each logic tile includes:

a configurable switch interconnect network, wherein the configurable switch interconnect network includes a plurality of switch matrices, wherein the plurality of switch matrices are configured into a plurality of stages including:

first and second stages of switch matrices connected in a hierarchical network, and

a third stage of switch matrices (i) connected in a mesh network and (ii) directly connected to at least one of the first and second stages of the hierarchical network of the configurable switch interconnect network of the same logic tile, wherein each switch matrix of the third stage of switch matrices includes:

a first output which is directly connected to an input of a switch matrix of the third stage of switch matrices of the configurable switch interconnect network of the same logic tile, and

a second output which is directly connected to an input of a switch matrix of the third stage of switch matrices of the configurable switch interconnect network of a first different logic tile of the plurality of logic tiles.

2. The integrated circuit of claim 1 wherein:

the plurality of logic tiles are physically organized in an array including a plurality of rows and/or a plurality of columns.

3. The integrated circuit of claim 1 wherein:

each switch matrix of the third stage of switch matrices of each logic tile is directly connected to the hierarchical network of the configurable switch interconnect network of the same logic tile via only one switch matrix of the hierarchical network thereof.

4. The integrated circuit of claim 1 wherein:

each switch matrix of the first stage of switch matrices is configured in a radix-a network, where a is a whole number which is greater than or equal to 2,

each switch matrix of the second stage of switch matrices is configured in a radix-b, where (i) b is whole number and (ii) b is not equal to a, and

the third stage of switch matrices is a highest stage of the plurality of stages of switch matrices of the configurable switch interconnect network of each logic tile.

5. The integrated circuit of claim 4 wherein:

each switch matrix of the third stage of switch matrices of the configurable switch interconnect network of each logic tile includes a third output which is directly connected to an input of a switch matrix of the third stage of switch matrices of the configurable switch interconnect network of a second different logic tile of the plurality of logic tiles.

6. The integrated circuit of claim 1 wherein:

the third stage of switch matrices is a highest stage of the plurality of stages of switch matrices of the configurable switch interconnect network of each logic tile.

7. The integrated circuit of claim 1 wherein:

the third stage of switch matrices is a highest stage of the plurality of stages of switch matrices of the configurable switch interconnect network of each logic tile of the plurality of logic tile;

the first different logic tile of the plurality of logic tiles is a first neighboring logic tile, and

each switch matrix of the third stage of switch matrices of the configurable switch interconnect network of each logic tile includes a third output which is directly connected to an input of a switch matrix of the third stage of switch matrices of the configurable switch interconnect network of a second different logic tile of the plurality of logic tiles.

8. The integrated circuit of claim 1 wherein:

each switch matrix of the third stage of switch matrices of the configurable switch interconnect network of each logic tile includes a third output which is directly connected to an input of a switch matrix of the third stage of switch matrices of the configurable switch interconnect network of a second different logic tile of the plurality of logic tiles.

9. An integrated circuit comprising:

a plurality of logic tiles, wherein each logic tile (i) is physically adjacent to at least one other logic tile of the plurality of logic tiles and (ii) includes:

a configurable switch interconnect network, wherein the configurable switch interconnect network includes a plurality of switch matrices, wherein the plurality of switch matrices are configured into a plurality of stages including:

first and second stages of switch matrices configured in a hierarchical network, and

a third stage of switch matrices is:

configured in a mesh network,

directly connected to the first or second stage of switch matrices of the hierarchical network of the configurable switch interconnect network of the same logic tile, and

directly connected to a different one of the other switch matrices of the third stage of switch matrices of the configurable switch interconnect network of the same logic tile.

10. The integrated circuit of claim 9 wherein:

each switch matrix of the first stage of switch matrices is configured in a radix-a network, where a is a whole number which is greater than or equal to 2, and

each switch matrix of the second stage of switch matrices is configured in a radix-b, where (i) b is whole number and (ii) b is not equal to a.

11. The integrated circuit of claim 9 wherein:

the third stage of switch matrices is a highest stage of the plurality of stages of switch matrices of the configurable switch interconnect network of each logic tile.

12. The integrated circuit of claim 9 wherein:

the third stage of switch matrices is a highest stage of the plurality of stages of switch matrices of the configurable switch interconnect network of each logic tile, and

each switch matrix of the third stage of switch matrices of the configurable switch interconnect network of each logic tile is directly connected to a switch matrix of the third stage of switch matrices of the configurable switch interconnect network of a first different logic tile of the plurality of logic tiles.

13. The integrated circuit of claim 12 wherein:

each switch matrix of the third stage of switch matrices of the configurable switch interconnect network of each logic tile is directly connected to a switch matrix of the third stage of switch matrices of the configurable switch interconnect network of a second different logic tile of the plurality of logic tiles.

14. The integrated circuit of claim 9 wherein:

each switch matrix of the third stage of switch matrices of each logic tile is directly connected to the of the hierarchical network of the configurable switch interconnect network of the same logic tile via only the first or second stage of switch matrices of the hierarchical network of the same logic tile.

15. An integrated circuit comprising:

a plurality of logic tiles, wherein each logic tile (i) is physically adjacent to at least one other logic tile of the plurality of logic tiles and (ii) includes:

a configurable switch interconnect network, wherein the configurable switch interconnect network includes a plurality of switch matrices, wherein the plurality of switch matrices are configured into a plurality of stages including:

first and second stages of switch matrices configured in a hierarchical network, and

a third stage of switch matrices is:

configured in a mesh network,

directly connected to the first or second stage of switch matrices of the hierarchical network of the configurable switch interconnect network of the same logic tile,

directly connected to a different one of the other switch matrices of the third stage of switch matrices of the configurable switch interconnect network of the same logic tile, and

directly connected to a switch matrix of the third stage of switch matrices of the configurable switch interconnect network of a first different logic tile of the plurality of logic tiles.

16. The integrated circuit of claim 15 wherein:

the third stage of switch matrices is a highest stage of the plurality of stages of switch matrices of the configurable switch interconnect network of each logic tile,

each switch matrix of the first stage of switch matrices is configured in a radix-a network, where a is a whole number which is greater than or equal to 2, and

each switch matrix of the second stage of switch matrices is configured in a radix-b, where (i) b is whole number and (ii) b is not equal to a.

17. The integrated circuit of claim 15 wherein:

each switch matrix of the third stage of switch matrices of each logic tile is directly connected to the hierarchical network of the configurable switch interconnect network of the same logic tile via only the first or second stage of switch matrices of the hierarchical network of the same logic tile.

18. The integrated circuit of claim 17 wherein:

the third stage of switch matrices is a highest stage of the plurality of stages of switch matrices of the configurable switch interconnect network of each logic tile.

19. An integrated circuit comprising:

a plurality of logic tiles, wherein each logic tile (i) is electrically connected to at least one other logic tile of the plurality of logic tiles and (ii) includes:

a configurable switch interconnect array, wherein the configurable switch interconnect array includes a plurality of switch matrices, wherein the plurality of switch matrices are configured into a plurality of stages including:

first and second stages of switch matrices configured in a hierarchical network, and

a third stage of switch matrices is:

configured in a mesh network,

directly connected to the first or second stage of switch matrices of the hierarchical network of the same configurable switch interconnect array,

directly connected to a different one of the other switch matrices of the third stage of switch matrices of the same configurable switch interconnect array, and

directly connected to a switch matrix of the third stage of switch matrices of a different configurable switch interconnect array.

20. The integrated circuit of claim 19 wherein the third stage of switch matrices is a highest stage of the plurality of stages of switch matrices of the configurable switch interconnect array of each logic tile.

21. The integrated circuit of claim 19 wherein:

the third stage of switch matrices is a highest stage of the plurality of stages of switch matrices of the configurable switch interconnect array of each logic tile,

each switch matrix of the first stage of switch matrices is configured in a radix-a network, where a is a whole number which is greater than or equal to 2, and

each switch matrix of the second stage of switch matrices is configured in a radix-b, where (i) b is whole number and (ii) b is not equal to a.

22. The integrated circuit of claim 19 wherein each switch matrix of the third stage of switch matrices of each logic tile is directly connected to the hierarchical network of the same configurable switch interconnect array of the logic tile via only the first or second stage of switch matrices of the hierarchical network of the same logic tile.

23. The integrated circuit of claim 19 wherein the different configurable switch interconnect array is a configurable switch interconnect array of a different logic tile.