High density receptacle
View Patent ↗A receptacle is depicted. The receptacle can provide two rows of terminals to increase the density of the interface. If desired, a connector positioned in the receptacle can omit the use of a housing, even if the receptacle provides a stacked connector configuration. With the use of various airflow features it is possible to cool inserted plug modules that use more than 6 watts and potentially more than 8 watts of power.
1. A receptacle, comprising:
a cage with a top wall, two side walls and a rear wall, the cage defining a port;
a wafer set positioned in the cage, the wafer set including a plurality of wafers, the wafer set not being supported by a housing that extends along a substantial portion of the wafer set, the wafer set having a first side, a second side and a third side, each of the wafers in the wafer set having an insulative frame that supports a plurality of terminals, at least one terminal from the wafer set having a folded form, the folded form orienting a contact end of the at least one terminal to face the top wall, wherein at least some of the wafers in the wafer set are arranged in a ground, signal, signal pattern;
two retaining bars, one of the retaining bars position on the first side and the other of the two retaining bars positioned on the second side.
2. The receptacle of claim 1 , further comprising a third retaining bar that is positioned on the third side.
3. The receptacle of claim 1 , wherein the first retaining bar extends from one of the side walls to the other side wall.
4. The receptacle of claim 3 , wherein the first retaining bar extends out past the wafer set.
5. The receptacle of claim 1 , further comprising a card slot member supported by the wafer set.
6. A receptacle, comprising:
a cage with a top wall, two side walls and a rear wall, the cage defining a port; and
a wafer set positioned in the cage, the wafer set including a plurality of wafers, the wafer set having a first side, a second side and a third side, each of the wafers in the wafer set having an insulative frame that supports a plurality of terminals, at least one terminal from the wafer set having a folded form, the folded form orienting a contact end of the at least one terminal to face the top wall, wherein at least some of the wafers in the wafer set are arranged in a ground, signal, signal pattern, wherein the plurality of wafers extend to the top wall.
7. The receptacle of claim 6 , wherein the plurality of wafers have cutouts in the insulative frame adjacent the top wall so as to provide a tortuous air path along the top wall and through the cutouts.
8. A connector assembly, comprising:
a cage that defines a port, the cage having a top wall, the cage configured to be mounted on a supporting surface;
a card slot member positioned in the port;
a wafer set aligned with the card slot, the wafer set including a plurality of wafers that each support at least four terminals, wherein the terminals are arranged so that two rows of contacts are provided on a first side and a second side of the card slot, at least one terminal from the wafer set having a folded form, the folded form orienting a contact end of the at least one terminal to face the top wall, wherein the card slot member is configured to be suspended from the supporting surface and is only supported by the wafer set and the cage.
9. The connector assembly of claim 8 , wherein the two rows of contacts on the first side are opposite the two rows of contacts on the second side and form a front top row of contacts, a rear top row of contacts, a front bottom row of contacts and a rear bottom row of contacts, wherein the rear top row of contacts and the rear bottom row of contacts have pad touching portions that are offset from each other.
10. The connector assembly of claim 8 , wherein the two rows of contacts on the first side are opposite the two rows of contacts on the second side and from a front top row of contacts, a rear top row of contacts, a front bottom row of contacts and a rear bottom row of contacts, wherein the terminals that form the rear top row and rear bottom row of contacts have tails that are aligned between tails of the terminals that form the front top row and front bottom row of contacts.
11. The connector assembly of claim 8 , further comprising an additional terminal from the wafer set having a folded form, the folded from orienting a contact end of the additional terminal to face the contact end of one of the at least one terminal.
12. The receptacle of claim 1 , further comprising an additional terminal from the wafer set having a folded form, the folded form orienting a contact end of the additional terminal to face the contact end of one of the at least one terminal.