High density receptacle
A receptacle is depicted. The receptacle can provide two rows of terminals to increase the density of the interface. If desired, a connector positioned in the receptacle can omit the use of a housing, even if the receptacle provides a stacked connector configuration. With the use of various airflow features it is possible to cool inserted plug modules that use more than 6 watts and potentially more than 8 watts of power.
1. A connector assembly, comprising:
a cage defining a port and forming a bottom wall having a protruding tongue at a connective side of the bottom wall; and
a card slot plug forming a mating portion having a tongue slot configured to receive the protruding tongue at the connective side of the bottom wall, wherein the protruding tongue provides an interference fit with the tongue slot when the protruding tongue is inserted into the tongue slot of the mating portion.
2. The connector assembly of claim 1 , wherein the card slot plug engages a connector having a wafer set.
3. The connector assembly of claim 2 , wherein the wafer set is positioned in the cage, wherein the wafer set includes a plurality of wafers, wherein the wafer set is not being supported by a housing that extends along a substantial portion of the wafer set, wherein the wafer set has a first side, a second side, and a third side, wherein each wafer of the plurality of wafers in the wafer set has an insulative frame that supports a plurality of terminals, wherein at least one terminal from the wafer set has a folded form, wherein the folded form orients a contact end of the at least one terminal to face a top wall of the cage, and wherein at least some of the plurality of wafers in the wafer set are arranged in a wafer pattern comprising a ground wafer, a signal wafer, and another signal wafer.
4. The connector assembly of claim 3 , wherein at least one wafer among the plurality of wafers has at least one cutout in the insulative frame, the at least one cutout being adjacent to the top wall so as to provide a tortuous air path along the top wall and through the at least one cutout.
5. The connector assembly of claim 2 , wherein the wafer set provides dimensional stack up between the card slot plug and the cage.
6. The connector assembly of claim 2 , wherein insertion of a plug module into the connector assembly is based on alignment between the wafer set and the cage to reduce dimensional stack up between the card slot plug and the cage.
7. The connector assembly of claim 1 , wherein the tongue slot is a size larger than the protruding tongue to provide an infinite adjustment over a range defined by a difference in a size of the tongue slot to a size of the protruding tongue.
8. A receptacle, comprising:
a cage defining a port and forming a top wall, two side walls, a rear wall, and a bottom wall, the bottom wall having a protruding tongue at a connective side of the bottom wall;
a wafer set positioned in the cage, the wafer set including a plurality of wafers, the wafer set not being supported by a housing that extends along a substantial portion of the wafer set, the wafer set having a first side, a second side, and a third side, each wafer of the plurality of wafers in the wafer set having an insulative frame that supports a plurality of terminals, at least one terminal from the wafer set having a folded form, the folded form orienting a contact end of the at least one terminal to face the top wall, wherein at least some of the plurality of wafers in the wafer set are arranged in a wafer pattern comprising a ground wafer, a signal wafer, and another signal wafer;
a first retaining bar positioned on the first side and a second retaining bar positioned on the second side; and
a card slot plug forming a mating portion having a tongue slot configured to receive the protruding tongue at the connective side of the bottom wall, wherein the protruding tongue is inserted into the tongue slot of the mating portion.
9. The receptacle of claim 8 , wherein the card slot plug engages a connector having the wafer set.
10. The receptacle of claim 8 , wherein at least one wafer among the plurality of wafers has at least one cutout in the insulative frame, the at least one cutout being adjacent to the top wall so as to provide a tortuous air path along the top wall and through the at least one cutout.
11. The receptacle of claim 8 , wherein the wafer set provides dimensional stack up between the card slot plug and the cage.
12. The receptacle of claim 8 , wherein insertion of a plug module into the receptacle is based on alignment between the wafer set and the cage to reduce dimensional stack up between the card slot plug and the cage.
13. The receptacle of claim 9 , wherein the protruding tongue provides an interference fit with the tongue slot to join the cage and the connector.
14. The receptacle of claim 8 , wherein the tongue slot is a size larger than the protruding tongue to provide an infinite adjustment over a range defined by a difference in a size of the tongue slot to a size of the protruding tongue.