Group III-nitride high-electron mobility transistors with buried p-type layers and process for making the same
An apparatus includes a substrate. The apparatus further includes a group III-nitride buffer layer on the substrate; a group III-nitride barrier layer on the group III-nitride buffer layer, the group III-nitride barrier layer including a higher bandgap than a bandgap of the group III-nitride buffer layer. The apparatus further includes a source electrically coupled to the group III-nitride barrier layer; a gate electrically coupled to the group III-nitride barrier layer; a drain electrically coupled to the group III-nitride barrier layer; and a p-region being at least one of the following: in the substrate or on the substrate below said group III-nitride barrier layer.
1. An apparatus, comprising:
a substrate;
a group III-Nitride buffer layer on the substrate;
a group III-Nitride barrier layer on the group III-Nitride buffer layer, the group III-Nitride barrier layer comprising a higher bandgap than a bandgap of the group III-Nitride buffer layer;
a source electrically coupled to the group III-Nitride barrier layer;
a gate electrically coupled to the group III-Nitride barrier layer;
a drain electrically coupled to the group III-Nitride barrier layer;
a p-region being at least one of the following: in the substrate or on the substrate below said group III-Nitride barrier layer; and
a contact pad electrically coupled to said p-region and the contact pad being implemented electrically separate from the source.
2. The apparatus of claim 1 , further comprising a connection connecting the contact pad electrically to said p-region.
3. The apparatus of claim 1 , wherein:
the contact pad is configured to receive at least one of the following: bias and signals; and
the contact pad being configured and implemented electrically separate from the source, the gate, and the drain.
4. The apparatus of claim 1 , wherein:
the p-region is on the substrate below said group III-Nitride barrier layer; and
the p-region is structured and arranged to extend a limited length parallel to said group III-Nitride barrier layer such that the p-region is located at least partially under the pate and is not located past the gate near the drain.
5. The apparatus of claim 1 , wherein the p-region is implanted.
6. The apparatus of claim 1 , wherein the p-region is in the substrate below said group III-Nitride barrier layer.
7. The apparatus of claim 1 , wherein:
the p-region is on the substrate below said group III-Nitride barrier layer; and
the p-region is structured and arranged to extend an entire length parallel to said group III-Nitride barrier layer.
8. The apparatus of claim 1 , wherein the p-region is arranged solely in the substrate below said group III-Nitride barrier layer.