IP Library Granted Patent US 11,183,435
Granted Patent B2
US 11,183,435 · App. 16/397,870 · Granted Nov 23, 2021

Endpointing detection for chemical mechanical polishing based on spectrometry

Inventors: Dominic J. Benvegnu (La Honda, CA); Jeffrey Drue David (San Jose, CA); Boguslaw A. Swedek (Cupertino, CA)
Assignee: Applied Materials, Inc.
H01L22/26B24B37/013B24B37/205B24B49/08B24B49/12B24D7/14H01L21/30625H01L21/31053H01L21/31055H01L21/3212H01L21/67075H01L21/67092H01L21/67253
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Quick Facts
Patent No.
US 11,183,435
App. No.
16/397,870
Granted
Nov 23, 2021
Kind
B2
Abstract

A method of detecting a polishing endpoint includes storing a plurality of library spectra, measuring a sequence of spectra from the substrate in-situ during polishing, and for each measured spectrum of the sequence of spectra, finding a best matching library spectrum from the plurality of library spectra to generate a sequence of best matching library spectra. Each library spectrum has a stored associated value representing a degree of progress through a polishing process, and the stored associated value for the best matching library spectrum is determined for each best matching library spectrum to generate a sequence of values representing a progression of polishing of the substrate. The sequence of values is compared to a target value, and a polishing endpoint is triggered when the sequence of values reaches the target value.

Claims (10)

1. A computer program product, tangibly embodied in a non-transitory computer readable medium, comprising instructions for causing a computer to perform operations comprising:

storing a plurality of library spectra, each library spectrum of the plurality of library spectra having a stored associated value representing a degree of progress through a polishing process;

receiving, from an in-situ monitoring system, a sequence of spectra from a substrate during polishing;

for each measured spectrum of the sequence of spectra, finding a best matching library spectrum from the plurality of library spectra to generate a sequence of best matching library spectra;

for each best matching library spectrum from the sequence of best matching library spectra, determining the stored associated value for the best matching library spectrum to generate a sequence of values representing an amount of progression of the substrate through the polishing process;

comparing the sequence of values to a target value; and

triggering a polishing endpoint when the sequence of values reaches the target value.

2. The computer program product of claim 1 , wherein each library spectrum of the plurality of library spectra has a unique associated value.

3. The computer program product of claim 1 , wherein the operations further comprise smoothing the sequence of values to generate a smoothed sequence and comparing comprises comparing the smoothed sequence to the target value.

4. The computer program product of claim 1 , wherein the sequence of values provides a trace, and respective stored associated values of the plurality of library spectra are substantially linearly proportional to a number of values at a point in a trace at which respective library spectra occur.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 18, 2020
From: BENVEGNU, DOMINIC J.; DAVID, JEFFREY DRUE; SWEDEK, BOGUSLAW A.
To: APPLIED MATERIALS, INC.
Reel/Frame 052684/0977 →
Continuity (7)
Division 15403915 · Jan 11, 2017
Continuation 14832997 · Aug 21, 2015
Division 14010193 · Aug 26, 2013
Division 12843782 · Jul 26, 2010
Continuation 11213344 · Aug 26, 2005
Provisional Application 60710682 · Aug 22, 2005
Related Publication 20190252274A1 · Aug 15, 2019