Chemical mechanical polishing apparatus and method
The present disclosure describes an apparatus and a method to detect a polishing pad profile during a polish process and adjust the polishing process based on the detected profile. The apparatus can include a polishing pad configured to polishing a substrate, a substrate carrier configured to hold the substrate against the polishing pad, and a detection module configured to detect a profile of the polishing pad. The detection module can include a probe configured to measure a thickness of one or more areas on the polishing pad, and a beam configured to support the probe, where the probe can be further configured to move along the beam.
1. An apparatus for polishing a substrate, comprising:
a polishing pad configured to polish the substrate;
a substrate carrier configured to hold the substrate against the polishing pad;
a conditioner configured to condition the polishing pad;
a detection module configured to detect a profile of the polishing pad, wherein the detection module comprises:
a probe configured to measure a thickness of one or more areas on the polishing pad; and
a beam configured to support e probe, wherein the probe is further configured to move along the beam; and
a control device configured to:
simulate a moving trajectory of the conditioner to generate a reference profile; and
compare the profile to the reference profile of the polishing pad stored in the control device.
2. The apparatus of claim 1 , further comprising a slurry dispenser configured to dispense a CMP slurry onto a surface of the polishing pad, wherein the detection module is attached to the slurry dispenser.
3. The apparatus of claim 1 , wherein the detection module is attached to the conditioner.
4. The apparatus of claim 1 , wherein the detection module further comprises a base configured to support the beam, and wherein the base is positioned adjacent to the polishing pad.
5. The apparatus of claim 1 , wherein the beam is further configured to extend over the polishing pad, and sweep across a surface of the polishing pad.
6. The apparatus of claim 1 , wherein the detection module is further configured to detect the profile of the polishing pad during a polishing process.
7. The apparatus of claim 1 , wherein the probe comprises an optical module configured to transmit and receive one or more optical signals associated with thickness measurements of the one or more areas on the polishing pad.
8. The apparatus of claim 1 , wherein the probe comprises an acoustic module configured to transmit and receive one or more acoustic signals associated with thickness measurements of the one or more areas on the polishing pad.
9. The apparatus of claim 1 , wherein the probe comprises a contact probe configured to sense a mechanical pressure signal associated with thickness measurements of the one or more areas on the polishing pad.
10. An apparatus, comprising:
a polishing pad;
a detection module above a surface of the polishing pad and comprising a probe configured to:
extend over and sweep across the surface; and
measure a surface contour of the surface; and
a control device configured to store a predetermined reference profile of the polishing pad and compare the surface contour to the predetermined reference profile, wherein the predetermined reference profile is based on a simulation of a moving trajectory of a conditioning disk performing a conditioning process on the polishing pad.
11. The apparatus of claim 10 , wherein the probe is further configured to measure a distance between the probe and the surface.
12. The apparatus of claim 10 , wherein the probe is further configured to sense a pressure between the probe and the surface.
13. The apparatus of claim 10 , wherein the probe is further configured to:
transmit a first optical signal to the surface;
receive a second optical signal from the surface; and
generate a holography image of the surface based on the first and second optical signals.
14. The apparatus of claim 10 , further comprising a slurry dispenser configured to disperse a slurry on the surface, wherein the probe is attached to the slurry dispenser.
15. An apparatus, comprising:
a polishing pad;
a detection module above a surface of the polishing pad and comprising a probe configured to measure a surface contour of the surface;
a control device configured to:
perform a simulation of a polishing process to predict a projected wear of the polishing pad;
generate and store a reference profile of the surface of the polishing pad based on the simulation; and
compare the surface contour to the reference profile; and
a conditioner above the surface and configured to condition the surface based on a comparison between the surface contour and the reference profile.
16. The apparatus of claim 15 , wherein a pressure applied by the conditioner is adjustable based on the comparison between the surface contour and the reference profile.
17. The apparatus of claim 15 , wherein the detection module is attached to the conditioner.
18. The apparatus of claim 15 , wherein the control device is further configured to adjust a rotation speed of the polishing pad based on the comparison between the surface contour and the reference profile.
19. The apparatus of claim 15 , further comprising a substrate carrier configured to hold a substrate against the polishing pad, wherein the control device is further configured to adjust a rotation speed of the substrate carrier, a location of the substrate carrier, or a pressure applied by the substrate carrier based on the comparison between the surface contour and the reference profile.
20. The apparatus of claim 15 , further comprising a slurry dispenser configured to move above the surface and dispense a slurry onto the surface, wherein the control device is further configured to adjust a location of the slurry dispenser or a flow rate of the slurry based on the comparison between the surface contour and the reference profile.