Dressing method, method of determining dressing conditions, program for determining dressing conditions, and polishing apparatus
A method dresses a polishing member with a diamond dresser having diamond particles arranged on a surface thereof. The method includes determining dressing conditions by performing a simulation of a distribution of a sliding distance of the diamond dresser on a surface of the polishing member, and dressing the polishing member with the diamond dresser under the determined dressing conditions. The simulation includes calculating the sliding distance corrected in accordance with a depth of the diamond particles thrusting into the polishing member.
1. A method of dressing a polishing member with a diamond dresser while moving the diamond dresser and the polishing member relative to each other, the diamond dresser having diamond particles arranged on a surface thereof, said method comprising:
calculating sliding distances of the diamond dresser at respective predefined points on a surface of the polishing member using temporary dressing conditions;
correcting the calculated sliding distances in accordance with a depth of the diamond particles thrusting into the polishing member such that differences between the calculated sliding distances are reduced;
modifying the temporary dressing conditions based on the corrected sliding distances;
searching dressing conditions for a preset distribution of the sliding distances from the modified temporary dressing conditions; and
dressing the polishing member with the diamond dresser under the dressing conditions searched,
wherein said correcting of the calculated sliding distances is performed by multiplying the calculated sliding distances by correction factors, respectively, which vary such that the differences between the calculated sliding distances are reduced.
2. The method of dressing the polishing member according to claim 1 , further comprising correcting the corrected sliding distances in accordance with tilting of the diamond dresser when the diamond dresser protrudes from the polishing member.
3. The method of dressing the polishing member according to claim 1 , wherein said calculating of the sliding distances of the diamond dresser comprises calculating the sliding distances of the diamond dresser in accordance with an acceleration of movement of the diamond dresser.
4. A method of determining dressing conditions for use in dressing a polishing member with a diamond dresser while moving the diamond dresser and the polishing member relative to each other, the diamond dresser having diamond particles arranged on a surface thereof, said method comprising:
calculating, with a controller, sliding distances of the diamond dresser at respective predefined points on a surface of the polishing member using temporary dressing conditions;
correcting the calculated sliding distances in accordance with a depth of the diamond particles thrusting into the polishing member such that differences between the calculated sliding distances are reduced;
modifying the temporary dressing conditions based on the corrected sliding distances; and searching dressing conditions for a preset distribution of the sliding distances from the modified temporary dressing conditions,
wherein said correcting of the calculated sliding distances is performed by multiplying the calculated sliding distances by correction factors, respectively, which vary such that the differences between the calculated sliding distances are reduced.
5. The method of determining the dressing conditions according to claim 4 , further comprising correcting the corrected sliding distances in accordance with tilting of the diamond dresser when the diamond dresser protrudes from the polishing member.
6. The method of determining the dressing conditions according to claim 4 , wherein said calculating of the sliding distances of the diamond dresser comprises calculating the sliding distances of the diamond dresser in accordance with an acceleration of movement of the diamond dresser.
7. A non-transitory computer-readable storage medium having stored thereon a program for determining dressing conditions for use in dressing of a polishing member with a diamond dresser while moving the diamond dresser and the polishing member relative to each other, the diamond dresser having diamond particles arranged on a surface thereof, said program causing a computer to execute a method comprising:
calculating sliding distances of the diamond dresser at respective predefined points on a surface of the polishing member using temporary dressing conditions;
correcting the calculated sliding distances in accordance with a depth of the diamond particles thrusting into the polishing member such that differences between the calculated sliding distances are reduced;
modifying the temporary dressing conditions based on the corrected sliding distances; and
searching dressing conditions for a preset distribution of the sliding distances from the modified temporary dressing conditions,
wherein said correcting of the calculated sliding distances is performed by multiplying the calculated sliding distances by correction factors, respectively, which vary such that the differences between the calculated sliding distances is reduced.
8. The non-transitory computer-readable storage medium having stored thereon said program for determining the dressing conditions according to claim 7 , said program causing the computer to execute the method further comprising correcting the corrected sliding distances in accordance with tilting of the diamond dresser when the diamond dresser protrudes from the polishing member.
9. The non-transitory computer-readable storage medium having stored thereon said program for determining the dressing conditions according to claim 7 , wherein said calculating of the sliding distances of the diamond dresser comprises calculating the sliding distances of the diamond dresser in accordance with an acceleration of movement of the diamond dresser.
10. A polishing apparatus comprising:
a first relative-movement mechanism configured to bring a workpiece to be polished and a polishing member into sliding contact with each other;
a dressing unit having a diamond dresser configured to dress the polishing member, said diamond dresser having diamond particles arranged on a surface thereof;
a second relative-movement mechanism configured to move said diamond dresser and the polishing member relative to each other; and
an arithmetic device configured to determine dressing conditions for realizing a preset distribution of an amount of the polishing member scraped off by said diamond dresser using a distribution of sliding distances of said diamond dresser,
wherein said arithmetic device is configured to calculate the sliding distances of said diamond dresser at respective predefined points on a surface of the polishing member and correct the calculated sliding distances in accordance with a depth of said diamond particles thrusting into the polishing member such that differences between the calculated sliding distances are reduced,
wherein said dressing unit is configured to dress the polishing member under the dressing conditions determined by said arithmetic device, and
wherein said arithmetic device is configured to correct the calculated sliding distances by multiplying the calculated sliding distances by correction factors, respectively, which vary such that the differences between the calculated sliding distances are reduced.
11. The polishing apparatus according to claim 10 , wherein said arithmetic device is configured to further correct the corrected sliding distances in accordance with tilting of said diamond dresser when said diamond dresser protrudes from the polishing member.
12. The polishing apparatus according to claim 10 , wherein said arithmetic device is configured to calculate the sliding distances in accordance with an acceleration of movement of said diamond dresser.