Hot spot cooling for data storage system
A data storage system may include multiple data storage devices, such as solid-state drives, an enclosure housing the devices, and a thermal bridge positioned in a gap between and in contact with each of the enclosure and a device, where the enclosure is cooler than the device. Thus, heat is conducted away from a hot spot of the device and to the enclosure. The thermal bridge may be flexible enough to bridge different sized gaps, while stiff enough to generate contact forces applied to the enclosure and the device. For example, the thermal bridge may be constructed primarily of copper and configured to function like a compression spring.
1. A data storage system comprising:
a plurality of solid-state drives (SSDs) each comprising a drive enclosure;
a system enclosure housing the plurality of SSDs; and
a thermal bridge positioned in a gap between and in contact with each of the system enclosure and an SSD of the plurality of SSDs;
wherein:
the gap is a first gap having a first distance between the system enclosure and the SSD; and
the thermal bridge is flexible in at least one direction such that the thermal bridge is operationally and non-permanently adjustable to alternatively bridge either the first gap or a second gap having a second different distance between the system enclosure and a second SSD of the plurality of SSDs.
2. The data storage system of claim 1 , wherein the system enclosure is cooler than the SSD.
3. The data storage system of claim 1 , wherein the thermal bridge is positioned in contact with the SSD at least in part coincident with a hot spot of the drive enclosure of the SSD.
4. The data storage system of claim 1 , wherein the thermal bridge is configured with a stiffness such that the thermal bridge generates contact forces applied at the system enclosure and at the SSD.
5. The data storage system of claim 1 , wherein the thermal bridge is configured to function as a compression spring.
6. The data storage system of claim 1 , wherein the thermal bridge is constructed primarily of copper.
7. The data storage system of claim 1 , wherein the thermal bridge is constructed of a bent copper sheet having a thickness in a range of 0.1 millimeter to 1.0 millimeter.
8. The data storage system of claim 1 , wherein the thermal bridge is constructed primarily of a pyrolytic graphite sheet.
9. The data storage system of claim 1 , further comprising:
a thermal interface material (TIM) applied to at least one of the thermal bridge, the system enclosure, and the SSD at an area at which the thermal bridge is in contact with the system enclosure and/or the SSD.
10. A method of reducing a temperature of a hot spot associated with a solid-state drive (SSD) enclosure, the method comprising:
positioning a thermal bridge between and in contact with the SSD enclosure, solely at a certain location proximal to the hot spot of the SSD enclosure, and a relatively cooler structure housing the SSD enclosure.
11. The method of claim 10 , wherein positioning the thermal bridge comprises compressing the thermal bridge, thereby generating contact forces applied at the SSD enclosure and at the cooler structure.
12. The method of claim 10 , wherein the thermal bridge is constructed of a bent copper sheet having a thickness in a range of 0.1 millimeter (mm) to 1.0 millimeter (mm) and a z-shaped form.
13. The method of claim 10 , wherein the thermal bridge is constructed primarily of a pyrolytic graphite sheet.
14. The method of claim 10 , further comprising:
prior to positioning the thermal bridge, applying a thermal interface material (TIM) to at least one of the thermal bridge, the SSD enclosure, and the cooler structure at an area at which the thermal bridge is in contact with the SSD enclosure and/or the cooler structure.
15. The method of claim 10 , wherein the thermal bridge is a first thermal bridge between and in contact with a first SSD enclosure and a relatively cooler structure housing the first SSD enclosure, the method further comprising:
positioning a second thermal bridge, which is substantially identical to the first thermal bridge, between and in contact with a second SSD enclosure and a relatively cooler structure housing the second SSD;
wherein a first distance between the first SSD enclosure and a contact location of the corresponding cooler structure is different from a second distance between the second SSD enclosure and a contact location of the corresponding cooler structure.