Socket interconnector with compressible ball contacts for high pad count memory cards
View Patent ↗A memory card socket interconnector is disclosed including a pair of cavities configured to receive a pair of memory cards. The cavities include patterns of memory card interconnect pads. A second surface of the socket interconnector includes socket interconnect pads, distributed across the second surface of the socket interconnector, which are electrically coupled to the memory card interconnect pads. The memory card socket interconnector may further include electrically conductive balls provided between the memory card pads and the memory card interconnect pads in each cavity to enable good electrical contact between the memory card pads and the memory card interconnect pads.
1. A memory card socket interconnector configured to support one or more memory cards in a socket of a host device, the memory card socket interconnector comprising:
a set of memory card interconnect pads on a first surface of the memory card socket interconnector, the set of memory card interconnect pads configured to mate with pads on the one or more memory cards;
an electrically conductive epoxy layer adhered to discrete ones of the memory card interconnect pads, the electrically conductive epoxy layer configured to facilitate electrical contact between the set of memory card interconnect pads and the pads on the one or more memory cards;
a set of socket interconnect pads on a second surface of the memory card socket interconnector opposite the first surface, the set of socket interconnect pads configured to mate with pins within the socket of the host device; and
a redistribution layer between the first and second surfaces configured to electrically redistribute the set of memory card interconnect pads to the set of socket interconnect pads, wherein each memory card interconnect pad of a plurality of the set of memory card interconnect pads is redistributed to a larger socket interconnect pad.
2. The memory card socket interconnector of claim 1 , wherein:
the memory card socket interconnector is further configured to support a first memory card having a PCI express (PCIe) interface; and
the set of memory card interconnect pads mirrors a configuration of the pads on the first memory card.
3. The memory card socket interconnector of claim 2 , wherein:
the memory card socket interconnector is further configured to support a second memory card in addition to the first memory card; and
the second memory card has at least one of a PCIe interface, a SIM interface, an SD interface and a multimedia card interface.
4. The memory card socket interconnector of claim 3 , wherein:
the set of memory card interconnect pads mirroring a configuration of the pads on the first memory card comprises a first set of memory card interconnect pads; and
the memory card socket interconnector further comprises a second set of memory card interconnect pads mirroring a configuration of the pads on the second memory card.
5. The memory card socket interconnector of claim 1 , wherein the electrically conductive epoxy comprises electrically conductive balls in contact with and extending above surfaces of the memory card interconnect pads.
6. A memory card socket interconnector configured to support one or more memory cards in a socket of a host device, the memory card socket interconnector comprising:
a set of memory card interconnect pads on a first surface of the memory card socket interconnector, the set of memory card interconnect pads having a pattern mirroring a pattern of pads on the one or more memory cards;
electrically conductive balls formed on the set of memory card interconnect pads on the first surface of the memory card socket interconnector, the electrically conductive balls configured to facilitate electrical contact between the set of memory card interconnect pads on the first surface of the memory card socket interconnector and the pads on the one or more memory cards;
a set of socket interconnect pads on a second surface of the memory card socket interconnector opposite the first surface, the set of socket interconnect pads configured to mate with pins within the socket of the host device; and
a redistribution layer between the first and second surfaces configured to electrically redistribute the set of memory card interconnect pads to the set of socket interconnect pads.
7. The memory card socket interconnector of claim 6 , wherein:
the memory card socket interconnector is configured to support a first memory card having a PCI express (PCIe) interface; and
the set of memory card interconnect pads mirrors a configuration of the pads on the first memory card.
8. The memory card socket interconnector of claim 7 , wherein:
the memory card socket interconnector is configured to support a second memory card in addition to the first memory card; and
the second memory card has at least one of a PCIe interface, a SIM interface, an SD interface and a multimedia card interface.
9. The memory card socket interconnector of claim 6 , wherein the conductive balls are suspended in an epoxy applied to the surfaces of the memory card interconnect pads.
10. The memory card socket interconnector of claim 1 , further comprising a cavity formed in a first surface of the memory card socket interconnector, wherein the set of memory card interconnect pads are provided in the cavity.
11. The memory card socket interconnector of claim 10 , wherein:
the set of memory card interconnect pads comprise a first set of memory card interconnect pads;
the cavity comprises a first cavity; and
the memory card socket interconnector further comprises:
a second set of memory card interconnect pads; and
a second cavity formed in a first surface of the memory card socket interconnector, wherein the second set of memory card interconnect pads are provided in the second cavity.
12. The memory card socket interconnector of claim 11 , wherein the first set of memory card interconnect pads are configured for the PCI express (PCIe) interface.
13. The memory card socket interconnector of claim 11 , wherein the first second set of memory card interconnect pads are configured for one of the PCI express (PCIe) interface, a SIM interface, an SD interface and a multimedia card interface.
14. The memory card socket interconnector of claim 1 , wherein the electrically conductive epoxy comprises a plurality of electrically conductive balls.
15. The memory card socket interconnector of claim 14 , wherein the plurality of electrically conductive balls protrude from a surface of the electrically conductive epoxy.
16. The memory card socket interconnector of claim 14 , wherein the plurality of electrically conductive balls comprise an electrical conductor coated onto compressible polymer balls.
17. The memory card socket interconnector of claim 6 , wherein the plurality of electrically conductive balls are embedded in an electrically conductive epoxy layer.
18. The memory card socket interconnector of claim 17 , wherein the plurality of electrically conductive balls protrude from a surface of the electrically conductive epoxy.
19. The memory card socket interconnector of claim 17 , wherein the plurality of electrically conductive balls comprise an electrical conductor coated onto compressible polymer balls.
20. A memory card socket interconnector configured to support one or more memory cards in a socket of a host device, the memory card socket interconnector comprising:
a set of memory card interconnect pads on a first surface of the memory card socket interconnector, the set of memory card interconnect pads configured to mate with pads on the one or more memory cards;
first means, provided on surfaces of the set of memory card interconnect pads, for facilitating electrical contact between the set of memory card interconnect pads and the pads on the one or more memory cards;
a set of socket interconnect pads on a second surface of the memory card socket interconnector opposite the first surface, the set of socket interconnect pads configured to mate with pins within the socket of the host device; and
second means, between the first and second surfaces, for electrically redistributing the set of memory card interconnect pads to the set of socket interconnect pads, wherein each memory card interconnect pad of a plurality of the set of memory card interconnect pads is redistributed to a larger socket interconnect pad.