Device design for short-circuitry protection circuitry within transistors
A transistor semiconductor die includes a first current terminal, a second current terminal, and a control terminal. A semiconductor structure is between the first current terminal, the second current terminal, and the control terminal and configured such that a resistance between the first current terminal and the second current terminal is based on a control signal provided at the control terminal. Short circuit protection circuitry is coupled between the control terminal and the second current terminal. In a normal mode of operation, the short circuit protection circuitry is configured to provide a voltage drop that is greater than a voltage of the control signal. In a short circuit protection mode of operation, the short circuit protection circuitry is configured to provide a voltage drop that is less than a voltage of the control signal.
1. A transistor semiconductor die comprising:
a first current terminal and a second current terminal;
a control terminal;
a semiconductor structure comprising a drift layer, wherein the semiconductor structure is between the first current terminal, the second current terminal, and the control terminal, the semiconductor structure configured such that a resistance between the first current terminal and the second current terminal is based on a control signal provided at the control terminal; and
a short circuit protection circuitry comprising one or more diodes formed by implants that reside entirely within the drift layer, wherein the short circuit protection circuitry is coupled between the control terminal and the second current terminal such that an anode of the one or more diodes is coupled to the control terminal and the short circuit protection circuitry is configured to:
in a normal mode of operation, provide a voltage drop between the control terminal and the second current terminal that is greater than a voltage of the control signal; and
in a short circuit protection mode of operation, provide a voltage drop between the control terminal and the second current terminal that is less than a voltage of the control signal.
2. The transistor semiconductor die of claim 1 further comprising a resistive element coupled between the short circuit protection circuitry and the control terminal.
3. The transistor semiconductor die of claim 2 wherein:
the one or more diodes have a negative temperature coefficient with respect to a voltage drop across the one or more diodes; and
the resistive element has a positive temperature coefficient with respect to a resistance thereof.
4. The transistor semiconductor die of claim 1 wherein the one or more diodes have a negative temperature coefficient with respect to a voltage drop across the one or more diodes.
5. The transistor semiconductor die of claim 1 wherein the one or more diodes are coupled in series such that an anode of a first one of the one or more diodes is coupled to the control terminal and a cathode of a last one of the one or more diodes is coupled to the second current terminal.
6. The transistor semiconductor die of claim 5 wherein the one or more diodes are PN diodes.
7. The transistor semiconductor die of claim 5 wherein the one or more diodes are Schottky diodes.
8. The transistor semiconductor die of claim 1 wherein the semiconductor structure comprises silicon carbide.
9. The transistor semiconductor die of claim 8 wherein the semiconductor structure provides a metal-oxide semiconductor field-effect transistor (MOSFET) such that the first current terminal is a drain terminal and the second current terminal is a source terminal.
10. The transistor semiconductor die of claim 8 wherein the semiconductor structure provides an insulated gate bipolar transistor (IGBT) such that the first current terminal is a collector terminal and the second current terminal is an emitter terminal.
11. The transistor semiconductor die of claim 1 wherein:
the transistor semiconductor die is configured to operate in the normal mode of operation when a temperature of the semiconductor structure is below a short circuit threshold temperature; and
the transistor semiconductor die is configured to operate in the short circuit protection mode of operation when a temperature of the semiconductor structure is above the short circuit threshold temperature.
12. The transistor semiconductor die of claim 1 wherein the voltage drop between the control terminal and the second current terminal provided by the short circuit protection circuitry has a negative temperature coefficient.
13. The transistor semiconductor die of claim 1 wherein an on-state resistance of the transistor semiconductor die is less than 3.0 mΩ/cm 2 , a blocking voltage of the transistor semiconductor die is greater than 600 V, and a short circuit withstand time of the transistor semiconductor die is greater than 3 μs.
14. The transistor semiconductor die of claim 13 wherein the on-state resistance of the transistor semiconductor die is greater than 0.1 mΩ/cm 2 , the blocking voltage of the transistor semiconductor die is less than 10 kV, and a short circuit withstand time of the transistor semiconductor die is less than 10 s.
15. A transistor semiconductor die comprising:
a first current terminal and a second current terminal;
a control terminal; and
a semiconductor structure between the first current terminal, the second current terminal, and the control terminal, the semiconductor structure comprising a short circuit protection circuitry comprising a plurality of diodes formed by implants that reside entirely within a drift layer of the semiconductor structure, wherein the semiconductor structure is configured such that a resistance between the first current terminal and the second current terminal is based on a control signal provided at the control terminal, an on-state resistance of the transistor semiconductor die is less than 3.0 mΩ/cm 2 , a blocking voltage of the transistor semiconductor die is greater than 600 V, and a short circuit withstand time of the transistor semiconductor die is greater than 3 μs.
16. The transistor semiconductor die of claim 15 wherein the on-state resistance of the transistor semiconductor die is greater than 0.1 mΩ/cm 2 , the blocking voltage of the transistor semiconductor die is less than 10 kV, and the short circuit withstand time of the transistor semiconductor die is less than 10 s.
17. A transistor semiconductor die comprising:
a first current terminal and a second current terminal;
a control terminal;
a semiconductor structure between the first current terminal, the second current terminal, and the control terminal, the semiconductor structure configured such that a resistance between the first current terminal and the second current terminal is based on a control signal provided at the control terminal; and
a short circuit protection circuitry comprising a plurality of diodes formed by implants that resides entirely within a drift layer of the semiconductor structure, wherein the the plurality of diodes coupled in series between the control terminal and the second current terminal such that an anode of the plurality of diodes is coupled to the control terminal.
18. The transistor semiconductor die of claim 17 wherein the plurality of diodes are coupled in series such that an anode of a first one of the plurality of diodes is coupled to the control terminal, a cathode of a last one of the plurality of diodes is coupled to the second current terminal, and each adjacent pair of diodes in the plurality of diodes is coupled anode-to-cathode.
19. The transistor semiconductor die of claim 18 further comprising a resistive element coupled between the cathode of the last one of the plurality of diodes and the second current terminal.
20. The transistor semiconductor die of claim 19 wherein:
the plurality of diodes have a negative temperature coefficient with respect to a voltage drop across the plurality of diodes; and
the resistive element has a negative temperature coefficient with respect to a resistance thereof.
21. The transistor semiconductor die of claim 17 wherein the plurality of diodes are coupled in series such that a cathode of a first one of the plurality of diodes is coupled to the control terminal, an anode of a last one of the plurality of diodes is coupled to the second current terminal, and each adjacent pair of diodes in the plurality of diodes is coupled anode-to-cathode.
22. The transistor semiconductor die of claim 19 wherein the plurality of diodes are Zener diodes.
23. The transistor semiconductor die of claim 21 further comprising a resistive element coupled between the anode of the last one of the diodes and the second current terminal.
24. The transistor semiconductor die of claim 23 wherein:
the plurality of diodes have a negative temperature coefficient with respect to a voltage drop across the plurality of diodes; and
the resistive element has a positive temperature coefficient with respect to a resistance thereof.
25. The transistor semiconductor die of claim 17 further comprising a resistive element coupled between the short circuit protection circuitry and the control terminal.
26. The transistor semiconductor die of claim 25 wherein:
the plurality of diodes have a negative temperature coefficient with respect to a voltage drop across the plurality of diodes; and
the resistive element has a positive temperature coefficient with respect to a resistance thereof.