IP Library Granted Patent US 10,716,225
Granted Patent B1
US 10,716,225 · App. 16/457,134 · Granted Jul 14, 2020

Data storage devices and connectors for same

Inventor: Kin Ming So (Hong Kong, CN)
Assignee: Western Digital Technologies, Inc.
H05K5/0026G06F13/382H05K5/0239H05K5/03G06F2213/0042
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Quick Facts
Patent No.
US 10,716,225
App. No.
16/457,134
Granted
Jul 14, 2020
Kind
B1
Abstract

A storage device includes a circuit board configured to store data and a connector mounted horizontally to the first surface of the circuit board. The connector comprises an insertion portion configured to be inserted into a port of an electronic device and a connection portion connected to the circuit board. An offset thickness between a thickness of the connection portion and a thickness of the insertion portion is at least 1 millimeter (mm). The storage device also comprises a housing enclosing the circuit board. A length of the housing does not exceed 8 mm.

Claims (47)

1. A storage device comprising:

a circuit board configured to store data, the circuit board including a first surface;

a connector mounted horizontally to the first surface of the circuit board such that an insertion axis of the connector is substantially parallel to the first surface of the circuit board, the connector comprising an insertion portion configured to be inserted along the insertion axis of the connector into a port of an electronic device and a connection portion connected to the first surface of the circuit board, wherein an offset thickness between a thickness of the connection portion and a thickness of the insertion portion is at least 1 millimeter (mm); and

a housing enclosing the circuit board and the connection portion of the connector, the insertion portion of the connector extending through an aperture in an inner side of the housing,

wherein a length of the housing, measured between the inner side of the housing and an outer side of the housing, does not exceed 8 mm, the outer side positioned opposite the inner side along the length.

2. The storage device of claim 1 , wherein:

the circuit board comprises a thickness measured between the first surface and a second surface opposite the first surface; and

the thickness of the circuit board is approximately equal to the offset thickness.

3. The storage device of claim 1 , wherein:

the connection portion of the connector comprises twenty-two pins attached to the circuit board; and

the storage device is configured to transfer data at least 10 gigabits per second (Gbps) using the twenty-two pins.

4. The storage device of claim 3 , wherein the twenty-two pins are connected to the circuit board in a first row comprising twelve pins and a second row comprising ten pins.

5. The storage device of claim 4 , wherein the first row of pins are staggered with respect to the second row of pins such that the first row of pins and second row of pins are not aligned in a direction parallel to the insertion axis.

6. The storage device of claim 1 , wherein:

the circuit board comprises a length of about 5 mm; and

the housing comprises a length of about 5.8 mm.

7. The storage device of claim 1 , wherein:

the circuit board comprises a length of about 7 mm; and

the housing comprises a length of about 7.8 mm.

8. The storage device of claim 1 , wherein a length of the insertion portion of the connector is about 7.4 mm.

9. The storage device of claim 1 , wherein the housing comprises:

a first housing component including the inner side of the housing and at least partially surrounding the circuit board, wherein the first housing component comprises a heat conductive material configured to transfer heat; and

a second housing component at least partially surrounding the first housing component, the second housing component comprising a heat insulative material configured to inhibit transfer of heat.

10. The storage device of claim 9 , wherein the inner side of the first housing component is configured to directly contact a surface of the electronic device to provide heat transfer between the inner side of the first housing and the electronic device.

11. The storage device of claim 9 , wherein the first housing component comprises:

a first bridging wall positioned above the connection portion of the connector; and

a second bridging wall positioned below the circuit board.

12. The storage device of claim 11 , wherein the second housing component includes a flange for securing the circuit board.

13. The storage device of claim 1 , wherein the connector comprises a universal serial bus (USB) type-C connector.

14. The storage device of claim 1 , wherein the circuit board comprises a system-in-package (SiP) comprising a plurality of integrated circuits.

15. A storage device comprising:

a circuit board configured to store data, the circuit board comprising a temperature sensor configured to measure a temperature of the circuit board and a data transfer rate controller configured to control data transfer rate based on the measured temperature;

a connector mounted horizontally the circuit hoard such that an insertion axis of the connector is substantially parallel the circuit board, the connector comprising an insertion portion configured to be inserted into a port of an electronic device and a connection portion connected to the circuit board; and

a housing enclosing the circuit board and the connection portion of the connector, the insertion portion of the connector extending through an aperture in an inner side of the housing,

wherein a length of the housing, measured between the inner side of the housing and an outer side of the housing, does not exceed 8 millimeters (mm).

16. The storage device of claim 15 , wherein an offset thickness between a thickness of the connection portion and a thickness of the insertion portion is at least 1 mm.

17. The storage device of claim 16 , wherein the housing comprises:

a first housing component including e inner side of the housing and at least partially surrounding the circuit board, wherein the first housing component comprises a heat conductive material configured to transfer heat; and

a second housing component at least partially surrounding the first housing component, the second housing component comprising a heat insulative material,

wherein the inner side of the first housing component is configured to directly contact a surface of the electronic device to provide heat transfer between the inner side of the first housing component and the electronic device.

18. The storage device of claim 17 , wherein the first housing component is die cast.

19. The storage device of claim 18 , wherein the connector comprises a universal serial bus (USB) type-C connector.

20. A storage device comprising:

a storing means for storing data, the storing means comprising a top surface;

a housing means for housing the storing means; and

a connector means for connecting to an electronic device to transfer data between the storing means and the electronic device, the connector means mounted horizontally to the top surface of the storing means by an attachment means, the connector means extending through an aperture of the housing means,

wherein a length of the housing means, measured between an inner surface of the housing means and an outer surface of the housing means, does not exceed 8 millimeters (mm).

Assignments (10)
PARTIAL RELEASE OF SECURITY INTERESTS Recorded Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →
SECURITY AGREEMENT Recorded Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →
PATENT COLLATERAL AGREEMENT Recorded Aug 23, 2024
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS THE AGENT
Reel/Frame 068762/0494 →
CHANGE OF NAME Recorded Jun 27, 2024
From: SANDISK TECHNOLOGIES, INC.
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 067982/0032 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 29, 2024
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 067567/0682 →
PATENT COLLATERAL AGREEMENT - DDTL LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 067045/0156 →
PATENT COLLATERAL AGREEMENT - A&R LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064715/0001 →
RELEASE OF SECURITY INTEREST AT REEL 052915 FRAME 0566 Recorded Feb 8, 2022
From: JPMORGAN CHASE BANK, N.A.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 059127/0001 →
SECURITY INTEREST Recorded Feb 6, 2020
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS AGENT
Reel/Frame 052915/0566 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 18, 2019
From: SO, KIN MING
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 050760/0377 →
Cited By (1)
US 12,399,818