IP Library › Granted Patent US 10,763,322
Granted Patent B2
US 10,763,322 · App. 16/509,819 · Granted Sep 1, 2020

Display device and method for manufacturing the same

Inventors: Shunpei Yamazaki (Setagaya, JP); Masakatsu Ohno (Utsunomiya, JP); Hiroki Adachi (Tochigi, JP); Satoru Idojiri (Tochigi, JP); Koichi Takeshima (Sano, JP)
Assignee: Semiconductor Energy Laboratory Co., Ltd.
H01L27/3272B23K26/04B23K26/0617B23K26/0622B23K26/0643B23K26/0648B23K26/083H01L27/1225H01L27/1266H01L27/322H01L27/3258H01L27/3262H01L29/24H01L29/66969H01L29/7869H01L29/78603H01L51/003H01L51/0024H01L51/0027H01L51/0097H01L51/5246H01L51/5253H01L51/56H01L27/3244H01L41/314H01L51/5096H01L51/5284H01L2227/323H01L2227/326H01L2251/5338H01L2251/558Y02E10/549Y02P70/521
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Quick Facts
Patent No.
US 10,763,322
App. No.
16/509,819
Granted
Sep 1, 2020
Kind
B2
Abstract

A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.

Claims (27)

1. A device for irradiating an object comprising a planar substrate, an organic resin layer over a top surface of the planar substrate, and an element layer over the organic resin layer with a linear beam, the device comprising:

a laser device configured to emit a laser light;

an optical system configured to extend the laser light;

a mirror configured to reflect the laser light; and

a lens configured to condense the laser light reflected by the mirror into the linear beam having an energy density with which the organic resin layer is weakened or adhesion between the organic resin layer and the planar substrate is reduced, wherein the linear beam is configured to enter the organic resin layer after passing through a bottom surface and the top surface of the planar substrate.

2. The device according to claim 1 , wherein the laser device is configured to emit a wavelength of 308 nm or longer.

3. The device according to claim 1 , wherein the organic resin layer comprises any one of an epoxy resin, an acrylic resin, a polyimide resin, a polyamide resin, and a polyamide-imide resin.

4. The device according to claim 1 , wherein the planar substrate is a glass substrate.

5. The device according to claim 1 , wherein the linear beam is configured to enter the organic resin layer after passing through the bottom surface and the top surface in this order.

6. A device for irradiating an object comprising a planar substrate, an organic resin layer over a top surface of the planar substrate, and an element layer over the organic resin layer with a linear beam, the device comprising:

a laser device comprising a plurality of laser oscillators;

an optical system configured to synthesize laser lights emitted from the plurality of laser oscillators and extend a synthesized laser light;

a mirror configured to reflect the synthesized laser light; and

a lens configured to condense the synthesized laser light reflected by the mirror into the linear beam having an energy density with which the organic resin layer is weakened or adhesion between the organic resin layer and the planar substrate is reduced, wherein the linear beam is configured to enter the organic resin layer after passing through a bottom surface and the top surface of the planar substrate.

7. The device according to claim 6 , wherein the laser device is configured to emit a wavelength of 308 nm or longer.

8. The device according to claim 6 , wherein the organic resin layer comprises any one of an epoxy resin, an acrylic resin, a polyimide resin, a polyamide resin, and a polyamide-imide resin.

9. The device according to claim 6 , wherein the planar substrate is a glass substrate.

10. The device according to claim 6 , wherein the linear beam is configured to enter the organic resin layer after passing through the bottom surface and the top surface in this order.

11. A device for irradiating an object comprising a planar substrate, an organic resin layer over a top surface of the planar substrate, and an element layer over the organic resin layer with a linear beam, the device comprising:

a plurality of laser devices;

an optical system configured to synthesize laser lights emitted from the plurality of laser devices and extend a synthesized laser light;

a mirror configured to reflect the synthesized laser light; and

a lens configured to condense the synthesized laser light reflected by the mirror into the linear beam having an energy density with which the organic resin layer is weakened or adhesion between the organic resin layer and the planar substrate is reduced, wherein the linear beam is configured to enter the organic resin layer after passing through a bottom surface and the top surface of the planar substrate.

12. The device according to claim 11 , wherein the laser device is configured to emit a wavelength of 308 nm or longer.

13. The device according to claim 11 , wherein the organic resin layer comprises any one of an epoxy resin, an acrylic resin, a polyimide resin, a polyamide resin, and a polyamide-imide resin.

14. The device according to claim 11 , wherein the planar substrate is a glass substrate.

15. The device according to claim 11 , wherein the linear beam is configured to enter the organic resin layer after passing through the bottom surface and the top surface in this order.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 3, 2020
From: YAMAZAKI, SHUNPEI; OHNO, MASAKATSU; ADACHI, HIROKI; IDOJIRI, SATORU; TAKESHIMA, KOICHI
To: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Reel/Frame 052823/0413 →
Priority Claims (4)
JP 2013-249631 · Dec 2, 2013 · national
JP 2013-256872 · Dec 12, 2013 · national
JP 2013-272176 · Dec 27, 2013 · national
JP 2014-047348 · Mar 11, 2014 · national
Continuity (5)
Continuation 15894117 · Feb 12, 2018
Continuation 15416166 · Jan 26, 2017
Continuation 15145246 · May 3, 2016
Continuation 14553251 · Nov 25, 2014
Related Publication 20190333976A1 · Oct 31, 2019
Cited By (1)
US 12,738,196